JP2005072418A5 - - Google Patents

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Publication number
JP2005072418A5
JP2005072418A5 JP2003302416A JP2003302416A JP2005072418A5 JP 2005072418 A5 JP2005072418 A5 JP 2005072418A5 JP 2003302416 A JP2003302416 A JP 2003302416A JP 2003302416 A JP2003302416 A JP 2003302416A JP 2005072418 A5 JP2005072418 A5 JP 2005072418A5
Authority
JP
Japan
Prior art keywords
substrate
electronic component
main surface
insulating substrate
wiring conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003302416A
Other languages
English (en)
Japanese (ja)
Other versions
JP4116954B2 (ja
JP2005072418A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003302416A priority Critical patent/JP4116954B2/ja
Priority claimed from JP2003302416A external-priority patent/JP4116954B2/ja
Publication of JP2005072418A publication Critical patent/JP2005072418A/ja
Publication of JP2005072418A5 publication Critical patent/JP2005072418A5/ja
Application granted granted Critical
Publication of JP4116954B2 publication Critical patent/JP4116954B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003302416A 2003-08-27 2003-08-27 電子部品封止用基板およびそれを用いた電子装置 Expired - Fee Related JP4116954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003302416A JP4116954B2 (ja) 2003-08-27 2003-08-27 電子部品封止用基板およびそれを用いた電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003302416A JP4116954B2 (ja) 2003-08-27 2003-08-27 電子部品封止用基板およびそれを用いた電子装置

Publications (3)

Publication Number Publication Date
JP2005072418A JP2005072418A (ja) 2005-03-17
JP2005072418A5 true JP2005072418A5 (enExample) 2006-11-30
JP4116954B2 JP4116954B2 (ja) 2008-07-09

Family

ID=34406686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003302416A Expired - Fee Related JP4116954B2 (ja) 2003-08-27 2003-08-27 電子部品封止用基板およびそれを用いた電子装置

Country Status (1)

Country Link
JP (1) JP4116954B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4550653B2 (ja) * 2005-04-15 2010-09-22 富士通株式会社 マイクロ可動素子および光スイッチング装置
JP4665733B2 (ja) * 2005-11-25 2011-04-06 パナソニック電工株式会社 センサエレメント
JP5237733B2 (ja) * 2008-09-22 2013-07-17 アルプス電気株式会社 Ｍｅｍｓセンサ

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