JP2005072418A5 - - Google Patents

Claims (10)

Electrons for hermetically sealing the microelectromechanical mechanism of an electronic component having a semiconductor substrate, a microelectromechanical mechanism formed on a main surface of the semiconductor substrate, and an electrode electrically connected to the microelectromechanical mechanism A component sealing substrate,
One main surface is joined to the main surface of the semiconductor substrate, one end is led out to the one main surface of the insulating substrate, and the other end is led to the other main surface or side surface of the insulating substrate. One wiring conductor, and a second wiring conductor having one end led out to one main surface of the insulating substrate at the junction between the semiconductor substrate and the insulating substrate, and the other end led to the other main surface or side surface of the insulating substrate And
The micro mechanical mechanism is hermetically sealed by bonding the semiconductor substrate and the insulating substrate so as to surround the micro electro mechanical mechanism.
The electronic component sealing substrate, wherein the first wiring conductor has the one end led to one main surface of the insulating substrate electrically connected to the electrode.   The electronic component sealing substrate according to claim 1, wherein at least one of the first wiring conductor and the second wiring conductor includes ferrite in at least a part thereof.   3. The electronic component according to claim 1, wherein the one end of the second wiring conductor is led out corresponding to a hermetic sealing portion of the electronic component on one main surface of the insulating substrate. Substrate for sealing.   4. The electronic component sealing substrate according to claim 1, wherein the one end of the first wiring conductor is located inside a joint portion between the semiconductor substrate and the insulating substrate. 5. . A connection pad formed on the one main surface of the insulating substrate and electrically connected to the one end of the first wiring conductor;
5. The electronic component sealing substrate according to claim 1, further comprising a connection terminal formed on the connection pad and electrically connected to the electrode.   6. The electronic component sealing substrate according to claim 1, wherein the insulating substrate is formed by laminating and firing ceramic green sheets.   The electronic component sealing substrate according to claim 1, wherein the insulating substrate includes a concave portion that accommodates the micro electro mechanical mechanism.   8. The electronic component sealing container according to claim 1, wherein the insulating substrate is separately provided with a portion functioning as a side wall that hermetically seals the microelectromechanical mechanism as a frame member. 9. substrate.   An electronic component sealing substrate in a multi-cavity configuration, comprising a large number of regions constituting the electronic component sealing substrate according to claim 1.   An electronic device comprising the electronic component sealing substrate according to claim 1 and the electronic component.