JPS6416641U - - Google Patents

Info

Publication number
JPS6416641U
JPS6416641U JP1987111807U JP11180787U JPS6416641U JP S6416641 U JPS6416641 U JP S6416641U JP 1987111807 U JP1987111807 U JP 1987111807U JP 11180787 U JP11180787 U JP 11180787U JP S6416641 U JPS6416641 U JP S6416641U
Authority
JP
Japan
Prior art keywords
printed wiring
chip
wiring board
semiconductor chip
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987111807U
Other languages
English (en)
Japanese (ja)
Other versions
JPH041738Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987111807U priority Critical patent/JPH041738Y2/ja
Publication of JPS6416641U publication Critical patent/JPS6416641U/ja
Application granted granted Critical
Publication of JPH041738Y2 publication Critical patent/JPH041738Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W90/754—
JP1987111807U 1987-07-20 1987-07-20 Expired JPH041738Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987111807U JPH041738Y2 (enExample) 1987-07-20 1987-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987111807U JPH041738Y2 (enExample) 1987-07-20 1987-07-20

Publications (2)

Publication Number Publication Date
JPS6416641U true JPS6416641U (enExample) 1989-01-27
JPH041738Y2 JPH041738Y2 (enExample) 1992-01-21

Family

ID=31350183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987111807U Expired JPH041738Y2 (enExample) 1987-07-20 1987-07-20

Country Status (1)

Country Link
JP (1) JPH041738Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075801U (ja) * 1993-06-22 1995-01-27 将一 林 自動車用ホイールのセンターロツク装置
JP2008047908A (ja) * 2006-08-14 2008-02-28 Chien-Chung Chen 発光モジュールおよびその製造プロセス

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH075801U (ja) * 1993-06-22 1995-01-27 将一 林 自動車用ホイールのセンターロツク装置
JP2008047908A (ja) * 2006-08-14 2008-02-28 Chien-Chung Chen 発光モジュールおよびその製造プロセス

Also Published As

Publication number Publication date
JPH041738Y2 (enExample) 1992-01-21

Similar Documents

Publication Publication Date Title
US6411507B1 (en) Removing heat from integrated circuit devices mounted on a support structure
JPH0773117B2 (ja) 半導体パッケ−ジ
JPS6416641U (enExample)
JPH02278856A (ja) 半導体集積回路装置
JPS61199052U (enExample)
JPS61134039U (enExample)
JP2504262Y2 (ja) 半導体モジュ―ル
JPS59132641U (ja) 半導体装置用基板
JPS6263935U (enExample)
JPS5989544U (ja) 混成集積回路
JPH01246857A (ja) 半導体装置
JPS60163753U (ja) 放熱型ミニバス
JPH01146548U (enExample)
JPS61140544U (enExample)
JPH0426785B2 (enExample)
JPH02106057A (ja) 半導体装置
JPS6217140U (enExample)
JPS63167782U (enExample)
JPS6084842A (ja) 半導体集積回路パツケ−ジ
JPS5822741U (ja) 半導体パツケ−ジ
JPS6033456U (ja) 半導体装置
JPS5878656U (ja) 混成集積回路装置
JPH0436247U (enExample)
JPS5944052U (ja) 半導体装置
JPS59155746U (ja) 配線基板を有するヒ−トシンク