JP2007124500A5 - - Google Patents
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- Publication number
- JP2007124500A5 JP2007124500A5 JP2005316594A JP2005316594A JP2007124500A5 JP 2007124500 A5 JP2007124500 A5 JP 2007124500A5 JP 2005316594 A JP2005316594 A JP 2005316594A JP 2005316594 A JP2005316594 A JP 2005316594A JP 2007124500 A5 JP2007124500 A5 JP 2007124500A5
- Authority
- JP
- Japan
- Prior art keywords
- acoustic sensor
- circuit board
- manufacturing
- electroacoustic transducer
- sensor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005316594A JP4642634B2 (ja) | 2005-10-31 | 2005-10-31 | 音響センサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005316594A JP4642634B2 (ja) | 2005-10-31 | 2005-10-31 | 音響センサの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007124500A JP2007124500A (ja) | 2007-05-17 |
| JP2007124500A5 true JP2007124500A5 (enExample) | 2010-01-14 |
| JP4642634B2 JP4642634B2 (ja) | 2011-03-02 |
Family
ID=38147807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005316594A Expired - Fee Related JP4642634B2 (ja) | 2005-10-31 | 2005-10-31 | 音響センサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4642634B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101008399B1 (ko) * | 2007-09-03 | 2011-01-14 | 주식회사 비에스이 | 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰 |
| CN101237719B (zh) * | 2007-12-28 | 2012-05-23 | 深圳市豪恩电声科技有限公司 | 一种硅电容式麦克风及其制作方法 |
| WO2017170457A1 (ja) * | 2016-03-28 | 2017-10-05 | 国立大学法人東北大学 | 圧力センサ |
| CN111422825B (zh) * | 2020-06-11 | 2020-09-22 | 潍坊歌尔微电子有限公司 | 传感器的制造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4129042A (en) * | 1977-11-18 | 1978-12-12 | Signetics Corporation | Semiconductor transducer packaged assembly |
| JPH05259478A (ja) * | 1992-03-12 | 1993-10-08 | Fuji Electric Co Ltd | 半導体圧力センサの製造方法 |
| JP3374620B2 (ja) * | 1995-10-25 | 2003-02-10 | 松下電工株式会社 | 半導体圧力センサ |
| JPH11287723A (ja) * | 1998-04-01 | 1999-10-19 | Yazaki Corp | 半導体圧力センサ |
| JP2001054196A (ja) * | 1999-08-11 | 2001-02-23 | Kyocera Corp | エレクトレットコンデンサマイクロホン |
| US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
| JP2002359445A (ja) * | 2001-03-22 | 2002-12-13 | Matsushita Electric Ind Co Ltd | レーザー加工用の誘電体基板およびその加工方法ならび半導体パッケージおよびその製作方法 |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| DE10303263B4 (de) * | 2003-01-28 | 2012-01-05 | Infineon Technologies Ag | Mikrophonanordnung |
| JP2004254138A (ja) * | 2003-02-20 | 2004-09-09 | Sanyo Electric Co Ltd | コンデンサマイクロホン |
| JP2005150652A (ja) * | 2003-11-20 | 2005-06-09 | Aoi Electronics Co Ltd | 回路基板 |
| JP4419563B2 (ja) * | 2003-12-25 | 2010-02-24 | パナソニック株式会社 | エレクトレットコンデンサー |
| JP2005262353A (ja) * | 2004-03-17 | 2005-09-29 | Sony Corp | 電子部品および電子部品の製造方法 |
| SG131039A1 (en) * | 2005-09-14 | 2007-04-26 | Bse Co Ltd | Condenser microphone and packaging method for the same |
-
2005
- 2005-10-31 JP JP2005316594A patent/JP4642634B2/ja not_active Expired - Fee Related
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