TWI456812B - 電子零件、電子機器及電子零件之製造方法 - Google Patents

電子零件、電子機器及電子零件之製造方法 Download PDF

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Publication number
TWI456812B
TWI456812B TW100134856A TW100134856A TWI456812B TW I456812 B TWI456812 B TW I456812B TW 100134856 A TW100134856 A TW 100134856A TW 100134856 A TW100134856 A TW 100134856A TW I456812 B TWI456812 B TW I456812B
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TW
Taiwan
Prior art keywords
wiring
electrode
electronic component
semiconductor element
disposed
Prior art date
Application number
TW100134856A
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English (en)
Other versions
TW201220565A (en
Inventor
Terunao Hanaoka
Akinori Shindo
Yasuo Yamasaki
Seiichi Chiba
Toshiyuki Enta
Shuji Kojima
Original Assignee
Seiko Epson Corp
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201220565A publication Critical patent/TW201220565A/zh
Application granted granted Critical
Publication of TWI456812B publication Critical patent/TWI456812B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5769—Manufacturing; Mounting; Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Gyroscopes (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)

Claims (7)

  1. 一種電子零件，其包含：半導體元件，其包含電路；振動元件；第1電極，其配置於上述半導體元件之第1面，且與上述電路及配置於上述第1面側之上述振動元件連接；第2電極，其配置於上述第1面，且於朝向上述第1面俯視時與上述振動元件之輪廓線之內側區域之至少一部分重疊而配置；第1配線基板，其包含第1配線；及第2配線基板，其包含第2配線；且上述第1配線包含：與上述第2電極連接之第1連接部、及與上述第2配線連接之第2連接部；上述第2配線基板之形成有上述第2配線之配線面與上述半導體元件之上述第1面交叉而配置。
  2. 如請求項1之電子零件，其中上述第1配線基板於上述第1連接部與第2連接部之間包含彎曲部。
  3. 如請求項1或2之電子零件，其更包含覆蓋上述半導體元件與上述振動元件且與上述第2配線基板連接之金屬構件；上述半導體元件之上述第1面係具有第1邊及與上述第1邊對向之第2邊之矩形；上述第2邊與上述金屬構件之距離短於上述第1邊與上 述金屬構件之距離；上述第1電極包含檢測上述振動元件之振動之信號用第3電極，且配置成較上述第1邊更接近上述第2邊；上述第2電極位於較上述第2邊更接近上述第1邊之位置。
  4. 如請求項1或2之電子零件，其中上述第1配線基板具有可撓性。
  5. 一種電子機器，其搭載有如請求項1至4中任一項之電子零件。
  6. 一種電子零件之製造方法，其特徵在於包含：第1基板連接步驟，將包含電路、第1電極及第2電極之半導體元件的上述第2電極與包含第1配線之第1配線基板之上述第1配線的第1連接部電性連接，上述第1電極與上述第2電極設置於第1面且與上述電路電性連接；振動元件搭載步驟，於上述半導體元件之上述第1面側，將振動元件與上述第1電極電性連接並進行搭載；及第2基板連接步驟，將上述第1配線基板之第2連接部與包含第2配線之第2配線基板的上述第2配線連接，上述第2配線基板之形成有上述第2配線之配線面與上述半導體元件之上述第1面交叉而配置；且上述振動元件搭載步驟中，於朝向上述第1面俯視時，使上述振動元件之輪廓線之內側區域之至少一部分與上述第2電極重疊而配置。
  7. 如請求項6之電子零件之製造方法，其中 於上述第1基板連接步驟之後進行上述振動元件搭載步驟。
TW100134856A 2010-09-30 2011-09-27 電子零件、電子機器及電子零件之製造方法 TWI456812B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010220809A JP5531887B2 (ja) 2010-09-30 2010-09-30 電子部品、電子機器、および電子部品の製造方法

Publications (2)

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TW201220565A TW201220565A (en) 2012-05-16
TWI456812B true TWI456812B (zh) 2014-10-11

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US (1) US8749001B2 (zh)
JP (1) JP5531887B2 (zh)
CN (1) CN102571023B (zh)
TW (1) TWI456812B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013156127A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 振動片、振動デバイス、物理量検出装置、および電子機器
JP7024349B2 (ja) * 2017-11-24 2022-02-24 セイコーエプソン株式会社 センサーユニット、センサーユニットの製造方法、慣性計測装置、電子機器、および移動体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090146227A1 (en) * 2007-12-06 2009-06-11 Oki Semiconductor Co., Ltd. Capacitive sensor and manufacturing method therefor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07208998A (ja) * 1994-01-21 1995-08-11 Murata Mfg Co Ltd 振動ジャイロ
DE10134620A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung
JP2005292079A (ja) 2004-04-05 2005-10-20 Seiko Epson Corp 圧電デバイス、及び圧電発振器
JP2006229121A (ja) 2005-02-21 2006-08-31 Seiko Epson Corp 圧電デバイス及び圧電装置並びに電子機器
US7553164B2 (en) * 2005-05-30 2009-06-30 Sanyo Electric Co., Ltd. Circuit device and method of manufacturing the same
JP4305678B2 (ja) 2007-05-11 2009-07-29 セイコーエプソン株式会社 半導体装置
JP4361102B2 (ja) * 2007-09-12 2009-11-11 富士フイルム株式会社 圧電素子の製造方法
JP2009117559A (ja) * 2007-11-05 2009-05-28 Olympus Corp 積層圧電素子及び超音波モータ
JP5013131B2 (ja) 2009-02-13 2012-08-29 セイコーエプソン株式会社 半導体装置の製造方法
JP2010252303A (ja) * 2009-03-25 2010-11-04 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090146227A1 (en) * 2007-12-06 2009-06-11 Oki Semiconductor Co., Ltd. Capacitive sensor and manufacturing method therefor

Also Published As

Publication number Publication date
CN102571023B (zh) 2015-04-15
US20120080763A1 (en) 2012-04-05
JP2012078104A (ja) 2012-04-19
JP5531887B2 (ja) 2014-06-25
US8749001B2 (en) 2014-06-10
TW201220565A (en) 2012-05-16
CN102571023A (zh) 2012-07-11

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