JP2003171624A - 支持テープ - Google Patents

支持テープ

Info

Publication number
JP2003171624A
JP2003171624A JP2001370760A JP2001370760A JP2003171624A JP 2003171624 A JP2003171624 A JP 2003171624A JP 2001370760 A JP2001370760 A JP 2001370760A JP 2001370760 A JP2001370760 A JP 2001370760A JP 2003171624 A JP2003171624 A JP 2003171624A
Authority
JP
Japan
Prior art keywords
adhesive
pressure
wafer
sensitive adhesive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001370760A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003171624A5 (cg-RX-API-DMAC7.html
Inventor
Munehiro Hatakei
宗宏 畠井
Masateru Fukuoka
正輝 福岡
Satoshi Hayashi
聡史 林
Shigeru Danjo
滋 檀上
Yasuhiko Oyama
康彦 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2001370760A priority Critical patent/JP2003171624A/ja
Publication of JP2003171624A publication Critical patent/JP2003171624A/ja
Publication of JP2003171624A5 publication Critical patent/JP2003171624A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
JP2001370760A 2001-12-04 2001-12-04 支持テープ Withdrawn JP2003171624A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001370760A JP2003171624A (ja) 2001-12-04 2001-12-04 支持テープ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001370760A JP2003171624A (ja) 2001-12-04 2001-12-04 支持テープ

Publications (2)

Publication Number Publication Date
JP2003171624A true JP2003171624A (ja) 2003-06-20
JP2003171624A5 JP2003171624A5 (cg-RX-API-DMAC7.html) 2004-12-24

Family

ID=19179931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001370760A Withdrawn JP2003171624A (ja) 2001-12-04 2001-12-04 支持テープ

Country Status (1)

Country Link
JP (1) JP2003171624A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7691672B2 (en) 2006-05-25 2010-04-06 Sony Corporation Substrate treating method and method of manufacturing semiconductor apparatus
US10965054B2 (en) 2016-07-20 2021-03-30 Hirose Electric Co., Ltd. Cable connector having cable holders

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7691672B2 (en) 2006-05-25 2010-04-06 Sony Corporation Substrate treating method and method of manufacturing semiconductor apparatus
US10965054B2 (en) 2016-07-20 2021-03-30 Hirose Electric Co., Ltd. Cable connector having cable holders

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