JP2003115707A5 - - Google Patents
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- Publication number
- JP2003115707A5 JP2003115707A5 JP2001309691A JP2001309691A JP2003115707A5 JP 2003115707 A5 JP2003115707 A5 JP 2003115707A5 JP 2001309691 A JP2001309691 A JP 2001309691A JP 2001309691 A JP2001309691 A JP 2001309691A JP 2003115707 A5 JP2003115707 A5 JP 2003115707A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- liquid crystal
- crystal polymer
- thermoplastic liquid
- polymer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- 229920000106 Liquid crystal polymer Polymers 0.000 description 12
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 11
- 229920001169 thermoplastic Polymers 0.000 description 11
- 239000004416 thermosoftening plastic Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001309691A JP2003115707A (ja) | 2001-10-05 | 2001-10-05 | 表面波伝送線路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001309691A JP2003115707A (ja) | 2001-10-05 | 2001-10-05 | 表面波伝送線路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003115707A JP2003115707A (ja) | 2003-04-18 |
| JP2003115707A5 true JP2003115707A5 (enExample) | 2004-12-09 |
Family
ID=19128794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001309691A Pending JP2003115707A (ja) | 2001-10-05 | 2001-10-05 | 表面波伝送線路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003115707A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4893483B2 (ja) | 2006-09-11 | 2012-03-07 | ソニー株式会社 | 通信システム |
| JP4345850B2 (ja) | 2006-09-11 | 2009-10-14 | ソニー株式会社 | 通信システム及び通信装置 |
| JP4788562B2 (ja) | 2006-10-19 | 2011-10-05 | ソニー株式会社 | 通信システム |
| JP4923975B2 (ja) | 2006-11-21 | 2012-04-25 | ソニー株式会社 | 通信システム並びに通信装置 |
| JP5674405B2 (ja) * | 2010-09-30 | 2015-02-25 | 株式会社クラレ | 熱可塑性液晶ポリマーフィルムおよびそれを用いた伝送線路 |
| GB201401014D0 (en) * | 2014-01-21 | 2014-03-05 | Welding Inst | System and method for transmitting data or power across a structural component |
| JP2018086067A (ja) * | 2016-11-28 | 2018-06-07 | オリンパス株式会社 | 撮像装置 |
-
2001
- 2001-10-05 JP JP2001309691A patent/JP2003115707A/ja active Pending
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