JP2003071585A5 - - Google Patents

Download PDF

Info

Publication number
JP2003071585A5
JP2003071585A5 JP2002169125A JP2002169125A JP2003071585A5 JP 2003071585 A5 JP2003071585 A5 JP 2003071585A5 JP 2002169125 A JP2002169125 A JP 2002169125A JP 2002169125 A JP2002169125 A JP 2002169125A JP 2003071585 A5 JP2003071585 A5 JP 2003071585A5
Authority
JP
Japan
Prior art keywords
plate
processing apparatus
suction
suction plate
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002169125A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003071585A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002169125A priority Critical patent/JP2003071585A/ja
Priority claimed from JP2002169125A external-priority patent/JP2003071585A/ja
Publication of JP2003071585A publication Critical patent/JP2003071585A/ja
Publication of JP2003071585A5 publication Critical patent/JP2003071585A5/ja
Withdrawn legal-status Critical Current

Links

JP2002169125A 2001-06-18 2002-06-10 レーザ加工装置 Withdrawn JP2003071585A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002169125A JP2003071585A (ja) 2001-06-18 2002-06-10 レーザ加工装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-183565 2001-06-18
JP2001183565 2001-06-18
JP2002169125A JP2003071585A (ja) 2001-06-18 2002-06-10 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2003071585A JP2003071585A (ja) 2003-03-11
JP2003071585A5 true JP2003071585A5 (https=) 2005-08-11

Family

ID=26617108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002169125A Withdrawn JP2003071585A (ja) 2001-06-18 2002-06-10 レーザ加工装置

Country Status (1)

Country Link
JP (1) JP2003071585A (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006263747A (ja) * 2005-03-22 2006-10-05 Toppan Forms Co Ltd レーザ加工装置
JP4808460B2 (ja) * 2005-09-30 2011-11-02 芝浦メカトロニクス株式会社 レーザ加工装置
JP5311176B2 (ja) * 2007-09-10 2013-10-09 Ｕｈｔ株式会社 レーザ加工装置
JP5110592B2 (ja) * 2007-09-28 2012-12-26 日立ビアメカニクス株式会社 レーザ加工機
JP4795377B2 (ja) * 2008-03-27 2011-10-19 日立ビアメカニクス株式会社 レーザ加工装置
JP5142784B2 (ja) * 2008-03-27 2013-02-13 京セラ株式会社 レーザ加工装置
JP6322066B2 (ja) * 2014-06-26 2018-05-09 日本特殊陶業株式会社 配線基板の製造方法
CN106181053B (zh) * 2015-04-29 2019-03-12 宁波舜宇光电信息有限公司 防止裁切污染的裁切定位治具及其排尘结构和方法
CN106132077A (zh) * 2016-08-23 2016-11-16 竞陆电子(昆山)有限公司 Pcb电路板上散热过孔的重工装置
KR20180047145A (ko) * 2016-10-31 2018-05-10 삼성전기주식회사 기판 가공용 지그, 기판 관통홀 가공 설비 및 기판 관통홀 가공 시스템
JP7616792B2 (ja) * 2021-05-27 2025-01-17 ビアメカニクス株式会社 レーザ加工装置

Similar Documents

Publication Publication Date Title
JP2003071585A5 (https=)
JP2017521259A5 (https=)
WO2010035786A1 (ja) 吸着用シート
TW200715447A (en) Electrostatic chuck and electrode sheet for electrostatic chuck
JP5831987B2 (ja) ワーク吸着装置
TWI546152B (zh) 加工台用治具、加工台用治具之製造方法及雷射加工方法
JP5666947B2 (ja) ワーク吸引治具及びワーク把持方法
JP2009202329A (ja) 打ち抜き装置
TW200506984A (en) Method for manufacturing multi-layered ceramic electronic component
BR0003464A (pt) Folha de multicamadas laminável à quente
JP2007110023A5 (https=)
TW200606968A (en) Method for manufacturing multilayer electronic component
CN116476255A (zh) 一种光孔治具及适配光孔治具的底座和光孔加工辅助组件
JP2011249629A5 (https=)
CN205767937U (zh) 半自动胶合装置
JP2019102774A5 (https=)
JP2010094681A (ja) レーザ光を用いたフィルム基材の加工方法
JP2009021382A5 (https=)
CN202963851U (zh) 一种提高激光钻孔表面平整度的治具
CN206807848U (zh) 一种用于电路板基板的铝基板材定位装置
TWM590838U (zh) 薄板翻面裝置（一）
CN214235798U (zh) 一种基板加工用的冲压模具结构
JPS6050910A (ja) 積層コンデンサの製造方法
CN214082883U (zh) 一种软材料错位贴合装置
CN209497692U (zh) 一种pcb板治具装置