JP2011249629A5 - - Google Patents

Download PDF

Info

Publication number
JP2011249629A5
JP2011249629A5 JP2010122307A JP2010122307A JP2011249629A5 JP 2011249629 A5 JP2011249629 A5 JP 2011249629A5 JP 2010122307 A JP2010122307 A JP 2010122307A JP 2010122307 A JP2010122307 A JP 2010122307A JP 2011249629 A5 JP2011249629 A5 JP 2011249629A5
Authority
JP
Japan
Prior art keywords
metal foil
shape guide
outer shape
temporary substrate
moving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010122307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011249629A (ja
JP5395745B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010122307A priority Critical patent/JP5395745B2/ja
Priority claimed from JP2010122307A external-priority patent/JP5395745B2/ja
Priority to US13/115,287 priority patent/US8539668B2/en
Publication of JP2011249629A publication Critical patent/JP2011249629A/ja
Publication of JP2011249629A5 publication Critical patent/JP2011249629A5/ja
Application granted granted Critical
Publication of JP5395745B2 publication Critical patent/JP5395745B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010122307A 2010-05-28 2010-05-28 仮基板の製造装置及び製造方法 Active JP5395745B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010122307A JP5395745B2 (ja) 2010-05-28 2010-05-28 仮基板の製造装置及び製造方法
US13/115,287 US8539668B2 (en) 2010-05-28 2011-05-25 Apparatus for manufacturing temporary substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010122307A JP5395745B2 (ja) 2010-05-28 2010-05-28 仮基板の製造装置及び製造方法

Publications (3)

Publication Number Publication Date
JP2011249629A JP2011249629A (ja) 2011-12-08
JP2011249629A5 true JP2011249629A5 (https=) 2013-02-07
JP5395745B2 JP5395745B2 (ja) 2014-01-22

Family

ID=45020889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010122307A Active JP5395745B2 (ja) 2010-05-28 2010-05-28 仮基板の製造装置及び製造方法

Country Status (2)

Country Link
US (1) US8539668B2 (https=)
JP (1) JP5395745B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8850695B1 (en) * 2010-01-05 2014-10-07 The Boeing Company Printed circuit board assembly tooling
JP5395745B2 (ja) * 2010-05-28 2014-01-22 新光電気工業株式会社 仮基板の製造装置及び製造方法
TWI411073B (zh) * 2010-08-13 2013-10-01 欣興電子股份有限公司 嵌埋被動元件之封裝基板及其製法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4541763B2 (ja) * 2004-01-19 2010-09-08 新光電気工業株式会社 回路基板の製造方法
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP5057339B2 (ja) * 2008-07-31 2012-10-24 京セラＳｌｃテクノロジー株式会社 配線基板の製造方法
JP5395745B2 (ja) * 2010-05-28 2014-01-22 新光電気工業株式会社 仮基板の製造装置及び製造方法

Similar Documents

Publication Publication Date Title
CN108891097B (zh) 一种蜂窝夹芯板成型方法
CN104244594B (zh) 一种规则排版的矩形内缩补强片制作方法
JP2018026427A5 (https=)
KR101281600B1 (ko) 인쇄회로기판의 테이프 부착장치
CA2682600A1 (en) Non-planar circuit board and a method for fabricating the same
CN201989387U (zh) 一种视觉精密贴合设备
JP2011249629A5 (https=)
JP2010283098A (ja) 板状部材の支持部材
CN101460012B (zh) 立体电路板的形成装置及形成方法
CN105246272A (zh) 一种外层刚性板厚度大于0.4mm内层印字符的刚挠结合板制作方法
CN204431215U (zh) 一种oca全贴合产品定位装置
CN105228370A (zh) 一种两面刚性板面积不样大的刚挠结合板制作工艺
CN206084853U (zh) 一种生产治具
CN203872437U (zh) 线路板补强片贴附用治具
CN103660522B (zh) 薄膜粘贴装置及利用此的薄膜粘贴方法
CN203523160U (zh) 组合式柔性印刷电路板贴合辅材治具
JP6219951B2 (ja) 部品組付装置における基板に部品を組み付ける方法及び部品組付装置
CN205910353U (zh) 一种快速检孔治具
JP2011249629A (ja) 仮基板の製造装置及び製造方法
CN204217223U (zh) 复合型电路板补强板贴合工装
CN202663661U (zh) 一种印刷电路板制作线路过程中的曝光对位结构
CN205648227U (zh) 一种改善层偏的工具
CN107509304A (zh) 一种挠性电路板补强钢片的方法
KR20150054557A (ko) 적층 유리 박판 자동 면취 가공장치 및 그 가공방법
CN205510582U (zh) 高效层叠型电路板生产结构