JP2003071585A5 - - Google Patents

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Publication number
JP2003071585A5
JP2003071585A5 JP2002169125A JP2002169125A JP2003071585A5 JP 2003071585 A5 JP2003071585 A5 JP 2003071585A5 JP 2002169125 A JP2002169125 A JP 2002169125A JP 2002169125 A JP2002169125 A JP 2002169125A JP 2003071585 A5 JP2003071585 A5 JP 2003071585A5
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JP
Japan
Prior art keywords
plate
processing apparatus
suction
suction plate
diameter
Prior art date
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Withdrawn
Application number
JP2002169125A
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Japanese (ja)
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JP2003071585A (en
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Publication date
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Priority to JP2002169125A priority Critical patent/JP2003071585A/en
Priority claimed from JP2002169125A external-priority patent/JP2003071585A/en
Publication of JP2003071585A publication Critical patent/JP2003071585A/en
Publication of JP2003071585A5 publication Critical patent/JP2003071585A5/ja
Withdrawn legal-status Critical Current

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Claims (8)

被加工物を載置する吸着プレートと、前記吸着プレートを保持する保持台とを備え、前記被加工物にレーザ光を照射して加工を行なうレーザ加工装置であって、前記レーザ光が照射される被加工物の直下に相当する前記吸着プレートの複数の部分に貫通孔を設けると共に、前記レーザ光が照射されない前記吸着プレートの複数の部分に貫通孔を設けたことを特徴とするレーザ加工装置。  A laser processing apparatus comprising: a suction plate for placing a workpiece; and a holding table for holding the suction plate, wherein the workpiece is irradiated with laser light to perform processing, wherein the laser light is irradiated. A laser processing apparatus, wherein through holes are provided in a plurality of portions of the suction plate corresponding to immediately below the workpiece to be processed, and through holes are provided in a plurality of portions of the suction plate that are not irradiated with the laser light. . 前記レーザ光が照射される被加工物の直下に相当する前記吸着プレートに設けられた複数個の貫通孔に対する吸引部と、前記レーザ光が照射されない前記吸着プレートの部分に設けられた複数個の貫通孔に対する吸引部とが、それぞれ独立している請求項１に記載のレーザ加工装置。  A plurality of through holes provided in the suction plate corresponding to the workpiece directly irradiated with the laser light, and a plurality of suction portions provided in a portion of the suction plate not irradiated with the laser light. The laser processing apparatus according to claim 1, wherein suction parts for the through holes are independent of each other. 前記吸着プレートの上面と、前記保持台の吸引穴の上面との距離が５ｍｍ以上である請求項１に記載のレーザ加工装置。  The laser processing apparatus according to claim 1, wherein a distance between an upper surface of the suction plate and an upper surface of the suction hole of the holding table is 5 mm or more. 前記レーザ光が照射される被加工物の直下に相当する前記吸着プレートに設けられた複数個の貫通孔の直径が、レーザ加工を行なう被加工物の加工部の直径よりも１０〜１００μｍ大きい請求項１に記載のレーザ加工装置。  A diameter of a plurality of through holes provided in the suction plate corresponding to a position directly below the workpiece irradiated with the laser light is larger by 10 to 100 μm than a diameter of a processed portion of the workpiece to be laser processed. Item 2. The laser processing apparatus according to Item 1. 前記吸着プレートが、複数枚のプレートの積層体からなる請求項１に記載のレーザ加工装置。  The laser processing apparatus according to claim 1, wherein the suction plate includes a stacked body of a plurality of plates. 前記吸着プレートが複数枚のプレートの積層体からなり、最上部のプレートに設けられた貫通孔の直径より、他の下部のプレートに設けられた貫通孔の直径が大きい請求項１に記載のレーザ加工装置。  2. The laser according to claim 1, wherein the suction plate includes a laminate of a plurality of plates, and a diameter of a through hole provided in another lower plate is larger than a diameter of a through hole provided in the uppermost plate. Processing equipment. 前記吸着プレートが複数枚のプレートの積層体からなり、最上部のプレートの厚みが他の下部のプレートの厚みより薄く、且つ最上部のプレートに設けられた貫通孔の直径より、他の下部のプレートに設けられた貫通孔の直径が大きい請求項１に記載のレーザ加工装置。  The suction plate is composed of a laminate of a plurality of plates, the thickness of the uppermost plate is thinner than the thickness of the other lower plate, and the diameter of the other lower plate is smaller than the diameter of the through hole provided in the uppermost plate. The laser processing apparatus according to claim 1, wherein a diameter of the through hole provided in the plate is large. 請求項１〜７のいずれかに記載のレーザ加工装置を用いて貫通孔を形成したことを特徴とするセラミックグリーンシート。A ceramic green sheet in which a through hole is formed using the laser processing apparatus according to claim 1.
JP2002169125A 2001-06-18 2002-06-10 Laser beam machining device Withdrawn JP2003071585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002169125A JP2003071585A (en) 2001-06-18 2002-06-10 Laser beam machining device

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-183565 2001-06-18
JP2001183565 2001-06-18
JP2002169125A JP2003071585A (en) 2001-06-18 2002-06-10 Laser beam machining device

Publications (2)

Publication Number Publication Date
JP2003071585A JP2003071585A (en) 2003-03-11
JP2003071585A5 true JP2003071585A5 (en) 2005-08-11

Family

ID=26617108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002169125A Withdrawn JP2003071585A (en) 2001-06-18 2002-06-10 Laser beam machining device

Country Status (1)

Country Link
JP (1) JP2003071585A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006263747A (en) * 2005-03-22 2006-10-05 Toppan Forms Co Ltd Laser beam machining device
JP4808460B2 (en) * 2005-09-30 2011-11-02 芝浦メカトロニクス株式会社 Laser processing equipment
JP5311176B2 (en) * 2007-09-10 2013-10-09 Ｕｈｔ株式会社 Laser processing equipment
JP5110592B2 (en) * 2007-09-28 2012-12-26 日立ビアメカニクス株式会社 Laser processing machine
JP5142784B2 (en) * 2008-03-27 2013-02-13 京セラ株式会社 Laser processing equipment
JP4795377B2 (en) * 2008-03-27 2011-10-19 日立ビアメカニクス株式会社 Laser processing equipment
JP6322066B2 (en) * 2014-06-26 2018-05-09 日本特殊陶業株式会社 Wiring board manufacturing method
CN106181053B (en) * 2015-04-29 2019-03-12 宁波舜宇光电信息有限公司 Prevent from cutting pollution cuts localization tool and its dust outlet geometry and method
CN106132077A (en) * 2016-08-23 2016-11-16 竞陆电子(昆山)有限公司 The reworking apparatus of dissipating vias in PCB
KR20180047145A (en) * 2016-10-31 2018-05-10 삼성전기주식회사 Jig for board fabrication, apparutus for forming through hole of board and system for forming through hole

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