JP4795377B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that processes a workpiece by adsorbing and placing the workpiece on a processing table and relatively moving a laser irradiation head and a processing table in the front-rear and left-right directions.

  Conventionally, a printed circuit board processing apparatus for processing a printed circuit board performs cutting using a router bit. However, with the conventional printed circuit board processing apparatus, the physical rigidity of the printed circuit board is lowered due to the thinning or miniaturization of the printed circuit board, and it is difficult to perform processing with excellent external accuracy. Therefore, a laser processing apparatus that processes the outer shape of the printed board with a laser is regarded as important. After laser processing the external shape of the printed circuit board, the laser processing device sucks and collects chips with a vacuum cleaner, or pre-fixes the workpiece to the lower plate with adhesive tape, and discards the entire lower plate. (Patent Document 1).

JP-A-2005-342749

  However, since the conventional laser processing apparatus sucks and collects chips every time the operation is completed, it takes time to collect the chips. Moreover, the conventional laser processing apparatus which fixes a workpiece | work to a lower board with an adhesive tape has a short chip collection | recovery operation time at the time of completion | finish of work, However, it took time for the setup operation | work which sticks an adhesive tape.

  The present invention is capable of cutting a thin and low-rigidity workpiece with high precision, and does not require a chip recovery operation or a setup operation for chip recovery. An object of the present invention is to provide a laser processing apparatus that can be efficiently recovered.

In order to solve the above problems, a laser processing apparatus (100) of the present invention has a hollow portion (11a) that communicates with a negative pressure source (16) and has a negative pressure therein, and the hollow portion ( The workpiece (W) is attracted to the workpiece placement surface (61c) of the processing table (15) having communication holes (61a, 64a, 11b) that communicate with the workpiece placement surface (61c) and communicate with the workpiece placement surface (11a). The workpiece (W) is mounted and processed by relative movement between the processing table (15) and the laser irradiation head (13). The hollow portion is formed on the processing table (15). A space (60a) communicating (11b) with (11a), a workpiece placement surface (61c) formed on the processing table (15 ) and the space (60a), and a workpiece chip (70). Falls into the space (60a) And allowing chips falling hole (61b), to open and close the dust collecting means (17) for recovering chips dropped in the space, the cuttings fall hole (61b) and the communication hole and (61a) opening and closing Means (40), and the dust collecting means (17) is formed by the opening / closing means (40) and the chip dropping hole (61b) after the work is processed and removed from the work placing surface. In a state where the communication hole (61a) is closed, air in the space (60a) is flowed to collect the chips (70) falling in the space (60a).

  In addition, the code | symbol in a parenthesis is given in order to make contrast with drawing easy for convenience, Comprising: The structure of this invention is not limited at all.

In the laser processing apparatus of the present invention, the dust collecting means flows into the space by flowing air in the space where the chip dropping hole and the communication hole are blocked by the opening / closing means after the workpiece is processed and removed. since so as to collect the swarf are, the setup operation for the recovery of chips by the operator, chip recovery operation and is unnecessary, thereby improving the working efficiency.

  Further, in the laser processing apparatus of the present invention, when the chip dropping hole is formed to be 0.1 mm to 0.5 mm larger than the outer shape of the chip, the work is less likely to be deformed by being sucked into the chip dropping hole. The workpiece can be processed with high accuracy.

  FIG. 1 is a schematic front view of a laser processing apparatus according to an embodiment of the present invention. The arrow X direction is the left-right direction in FIG. The arrow Y direction is the depth (front-rear) direction of the laser processing apparatus of FIG. The arrow X direction and the arrow Y direction are orthogonal to each other.

  The laser processing apparatus 100 includes a laser processing machine 1, a substrate transport device 2 as a mounting means for mounting a work on the processing table 15, and a substrate recovery as a removing means for removing the processed workpiece from the processing table 15. It consists of machine 3 etc.

  The substrate transporter 2 includes a rail 21, a slider 23 that can be reciprocated in the direction of the arrow X by the driving device 22, a lifter 24 provided on the slider 23, and a plurality of vacuum suctions provided on the lifter 24. It is composed of a pad (hereinafter simply referred to as “suction pad”) 25 and the like. The substrate transfer machine 2 supplies an unprocessed printed circuit board (hereinafter referred to as “work”) W placed on the work supply table 30 onto the work holder 60 on the processing table 15 of the laser processing machine 1. It has become.

  A support seat 26 is provided below the rail 21 of the substrate transporter 2. A shielding plate 40 is placed on the support seat 26. The shielding plate 40 is formed to have almost the same size as the processing table 15 of the laser processing machine 1. On the lower surface of the shielding plate 40, a protrusion 40a having an outer shape smaller than a chip 70 described later is provided.

  The processing table 15 of the laser processing machine 1 can be moved on the bed 12 in the direction of arrow XY. The processing table 15 will be described later. The workpiece holder 60 is fixed to the base 11. A processing head 13 as a laser irradiation head is disposed above the processing table 15. The processing head 13 is fixed on a column 14 fixed on the bed 12.

  The substrate collecting machine 3 includes a rail 31, a slider 33 that can be reciprocated on the rail 31 in the direction of arrow X in FIG. 1 by a driving device 32, a lifter 34 provided on the slider 33, and a plurality of lifters 34. Vacuum suction pad (hereinafter simply referred to as “suction pad”) 35 and the like. The substrate collection machine 3 collects the workpiece W that has been processed from the workpiece holder 60 and places it on the workpiece collection table 36.

  The control device 51 controls the substrate transfer machine 2, the control device 52 controls the operations of the processing table 15 and the processing head 13, and the control device 53 controls the substrate recovery machine 3. The control device 50 as a control means controls the control device 51, the control device 52, and the control device 53.

  Next, the machining table 15 including the base 11 and the work holding machine 60 will be described.

  FIG. 2 is a plan view of the processing table. FIG. 3 is a sectional view of the processing table. 3A is a cross-sectional view taken along the line AA in FIG. 3B is a cross-sectional view taken along the line BB in FIG.

  A hollow portion 11 a is formed inside the base 11 of the processing table 15. The hollow portion 11a is connected to a negative pressure source 16 as a decompressor, and the internal pressure is adjusted by the negative pressure source 16 between a negative pressure state and an atmospheric pressure state. A through hole 11 b is formed in the upper portion of the base 11. The work holding machine 60 fixed to the upper part of the base 11 includes an upper plate 61, a left duct 62, a right duct 63, a plurality of partitions 64, and the like, and is formed in a box shape. The partition 64 is formed with a plurality of through holes 64a for suction. The pitch of the through holes 64a in the arrow X direction is set to be the same as the pitch of the through holes 11b in the arrow X direction.

  As shown in FIG. 3B, a suction through-hole 61a and a chip collection through-hole 61b are formed in the upper plate 61 sandwiched between adjacent partitions 64 (FIG. 2). Has been. The left duct 62 has a square pipe cross section and has a space 62a inside. A hole 62b formed in the side surface of the left duct 62 connects the space 62a and the space 60a. A space 60 a serving as a negative pressure chamber is an area surrounded by the upper plate 61, the left duct 62, the right duct 63, and the base 11. The right duct 63 has a square pipe cross section and has a space 63a inside. A hole 63b provided on the side surface of the right duct 63 connects the space 63a and the space 60a.

  The through hole 61b as the chip dropping hole communicates the work placement surface 61c of the processing table 15 and the space 60a as the negative pressure chamber so as to allow the work chip 70 to fall into the space 60a. The outer shape of the chip 70 cut off from the workpiece W is similar to the outer shape of the chip 70 and is larger than the chip 70 by about 0.1 mm to 0.5 mm (one size larger).

  The space 60a communicates with the hollow portion 11a through the through hole 11b. A negative pressure source 16 (FIG. 2) is connected to the hollow portion 11a. Therefore, when the negative pressure source 16 is operated under the control of the control device 52, the hollow portion 11a is decompressed and the space 60a is decompressed.

  The through hole 61a as the communication hole communicates the workpiece placement surface 61c and the space 60a, has the same diameter as the through hole 64a, and a smaller cross-sectional area than the through hole 61b. The through hole 61a is formed concentrically with the corresponding through hole 11b.

  As shown in FIG. 2, one of the left ducts 62 in the axial direction is connected to the dust collector 17 via a shutter 65 and a hose 66, and the other is closed. One of the right ducts 63 in the axial direction is connected to the compressor 18 as a compressed air source via a shutter 67 and a hose 68, and the other is closed.

  Next, the operation of the laser processing apparatus will be described based on the operation explanatory diagram of FIG. 4 and the flowchart of FIG. The operation procedure shown in the flowchart of FIG. 5 is stored in the control device 50 in advance.

  The control device 50 controls the substrate transfer machine 2 by the control device 51, and converts the unprocessed workpiece (printed circuit board) W placed on the workpiece supply table 30 to the workpiece placement surface of the workpiece holder 60 on the machining table 15. It is placed on 61c (FIG. 4A, FIG. 5 (S101)).

  The control device 50 closes the shutter 65 (FIG. 2) by the control device 52 to block the space 62a of the left duct 62 from the dust collecting device 17, and closes the shutter 67 to remove the space 63a of the right duct 63 from the compressor 18. After shutting off (S103), the negative pressure source 16 is turned on. Then, the hollow portion 11a and the space 60a become negative pressure through the through hole 11b (S105), and the workpiece W is attracted to the workpiece placement surface 61c of the upper plate 61 (FIGS. 4A and S107). . The space 60a at this time becomes negative pressure. This negative pressure is such a negative pressure that the workpiece W is sucked into the through hole 61b and is not deformed, and the suction is such that the workpiece W is not displaced on the workpiece mounting surface 61c when the workpiece W is laser processed by the processing head 13. Negative pressure.

  The control device 50 controls the laser processing machine 1 with the control device 52 to process the workpiece (S109). The chips 70 cut off from the workpiece W pass through the through hole 61b and fall into the space 60a. At this time, since the space 60a has a negative pressure, the chips 70 are unlikely to fall into the space 60a and scatter around the processing table 15. Further, when a hole is formed in the work, the through holes 61b are sequentially opened, and the work W may be hardly attracted to the work placement surface 61c. However, the work is hardly attracted to the work placement surface 61c by the through-hole 61a and is hardly displaced during laser processing.

  When the laser processing by the laser processing machine 1 is completed, the control device 50 turns off the negative pressure source 16 by the control device 52, and returns the space 60a to atmospheric pressure (FIG. 4C, S111). And the control apparatus 50 controls the board | substrate collection | recovery machine 3 by the control apparatus 53, collect | recovers the workpiece | work W from the workpiece holding machine 60, and mounts it on the workpiece | work collection | recovery stand 36 of the board | substrate collection | recovery machine 3 (S113).

  Next, the control device 50 controls the substrate transporter 2 by the control device 51 to place the shielding plate 40 placed on the support seat 26 on the work placement surface 61 c of the work holder 60. Then, the lifter 24 presses the shielding plate 40 as the opening / closing means against the workpiece placement surface 61c (FIG. 4D, S115). Then, the projection 40a of the shielding plate 40 enters the through hole 61b and closes the through hole 61b, and the shielding plate 40 covers the through hole 61a and closes the through hole 61a. Further, the shielding plate 40 is not positioned with respect to the workpiece placement surface 61c by the protrusion 40a entering the through hole 61b, and does not fail to block the through holes 61a and 61b.

  Then, the shutter 65 is opened, the space 62a is connected to the dust collector 17, the shutter 67 is also opened, and the space 63a is connected to the compressor 18 (S117). Then, the flow of air from the space 63a to the space 62a through the hole 63b, the space 60a, and the hole 62b by the compressed air sent from the space 63a to the space 60a and the suction air sucked from the space 60a to the space 62a. Will occur. As a result, the chips 70 falling in the space 60a are collected by the air flow and collected by the dust collector 17 (FIG. 4 (E), S119).

  After that, the control device 50 closes the shutters 65 and 67 by the control unit 52 and controls the substrate transport machine 2 by the control device 51, so that the shielding plate 40 placed on the workpiece placement surface 61 c is attached to the support seat 26. Return (S121). The control device 50 controls the laser processing device 100 and repeats the above operation until the workpiece W is exhausted (S123).

  The chips 70 may be collected every time one workpiece is processed, or may be collected collectively when several workpieces are processed.

  Since the laser processing apparatus 100 of this embodiment supplies compressed air to the space 63a with the compressor 18, most of the chips 70 can be collected in the dust collector 17. In addition, although the compressor 18 is not necessarily required in order to collect | recover the chips 70, the direction which was equipped is easy to collect the chips 70.

  Further, since the outer shape of the through hole 61b is similar to the outer shape of the chip 70 (that is, the outer shape of the hole to be processed) and is about 0.5 mm larger than the chip, the workpiece W is sucked into the through hole 61b and deformed. This is rarely done, and the processing accuracy can be improved. Further, the chips can easily fall into the space 60a from the through hole 61b.

  Furthermore, since the shielding plate 40 is moved by the substrate transfer machine 2, it is not necessary to provide a device for moving the shielding plate 40, the structure of the laser processing apparatus 100 is simplified, and the laser processing apparatus is reduced in size. Can be.

  In order for the negative pressure source 16 to make the space 60a have a negative pressure, the air suction force is set to be weaker than the air suction force for the dust collector 17 to suck the chips 70, so that the thin and low-rigidity The work is prevented from being deformed by being sucked into the through hole 61b by the suction force.

  Further, the negative pressure source 16 and the dust collector 17 constitute suction means. However, without using the negative pressure source 16, the dust collector 17 also serves as a negative pressure source, and the space 60a is negatively pressured. It may be.

  Furthermore, although the protrusion 40a is provided on the lower surface of the shielding plate 40, the protrusion 40a is not necessarily provided.

It is a front schematic diagram of the laser processing apparatus in the embodiment of the present invention. It is a top view of a process table. FIG. 3 is a sectional view of the processing table. 3A is a cross-sectional view taken along the line AA in FIG. 3B is a cross-sectional view taken along the line BB in FIG. It is a figure for operation | movement description of the laser processing apparatus in embodiment of this invention. (A) is the figure which mounted the workpiece | work on the workpiece | work mounting surface. (B) is the figure which the chip generated when making a hole in a work fell into space. (C) is the figure which removed the workpiece | work which finished the process. (D) is the figure which mounted the shielding board on the workpiece | work mounting surface. (E) is a figure of the state which has collect | recovered chips. It is a flowchart for operation | movement description of the laser processing apparatus in embodiment of this invention.

Explanation of symbols

W Printed circuit board (work)
1 Laser processing machine 2 Substrate transfer machine (mounting means)
3 Substrate recovery machine (removal means)
11 base 11a hollow part 11b through hole (communication hole )
13 Processing head (laser irradiation head)
15 Processing table 16 Negative pressure source 17 Dust collector ( dust collection means)
18 Compressor 26 Supporting seat 40 Shield plate (opening / closing means)
50 Control device (control means)
51 Control Device 52 Control Device 53 Control Device 60 Work Holding Machine 60a Space 61 Upper Plate 61a Through Hole (Communication Hole)
61b Through hole (chip dropping hole)
61c Workpiece mounting surface 62 Left duct 62a Space 62b Hole 63 Right duct 63a Space 63b Hole 64 Partition 64a Through hole (communication hole )
65 Shutter 67 Shutter 70 Chip 100 Laser processing device

Claims (5)

A workpiece is placed on the workpiece mounting surface of the processing table having a hollow portion that communicates with the negative pressure source and has a negative pressure inside, and a communication hole that communicates with the hollow portion and opens at the workpiece mounting surface. In a laser processing apparatus for processing the workpiece by relative movement between the processing table and the laser irradiation head,
A space formed in the processing table and communicating with the hollow portion;
A chip dropping hole that is formed in the processing table and allows the workpiece chip to fall into the space by communicating the workpiece placement surface and the space ;
Dust collecting means for collecting chips falling in the space;
Opening and closing means for opening and closing the chip dropping hole and the communication hole,
After the workpiece is processed and removed from the workpiece mounting surface, the dust collecting means flows air in the space in a state where the chip dropping hole and the communication hole are blocked by the opening / closing means. To collect chips falling in the space,
The laser processing apparatus characterized by the above-mentioned. The processing table is composed of a base having the hollow portion, and a work holding machine integrally attached to the base and having the space and the work placement surface,
The communication hole opens to the work placement surface directly from the hollow portion or through the space,
The opening / closing means closes the chip dropping hole and the communication hole by being placed on the work placement surface, and opens the chip dropping hole and the communication hole by being removed from the work placement surface. Become
The laser processing apparatus according to claim 1. Placing means for placing a workpiece on the processing table;
Removing means for removing the workpiece that has been machined from the machining table;
Control means for controlling the opening / closing means to move so as to close the chip dropping hole and the communication hole by the placing means after removing the workpiece from the processing table by the removing means;
The laser processing apparatus according to claim 1. The chip dropping hole is formed to be 0.1 mm to 0.5 mm larger than the outer shape of the chip,
The laser processing apparatus of any one of Claims 1 thru | or 3 . Equipped with a compressor for sending compressed air into the space ,
The laser processing apparatus of any one of Claims 1 thru | or 4.

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