JP2006263747A - Laser beam machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reliably suck a material to be machined to a supporting plate in forming passing through holes to the material to be machined by irradiating the material to be machined with a laser beam while the supporting plate is sucked to the material to be machined. <P>SOLUTION: Suction holes 21 are formed in regions of the supporting plate 20 loaded wit the material to be machined where the plate is irradiated with the laser beam in the state that the material to be machined is loaded on the supporting plate 20 and adjacently to the suction holes 21, suction auxiliary holes 22 are formed in the regions where the plate is not irradiated with the laser beam in the state that the material to be machined is loaded on the supporting plate 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus that forms a through hole in a workpiece by laser light.

  2. Description of the Related Art Conventionally, a method of irradiating a workpiece with laser light has been used to form fine through holes in a workpiece such as paper or film. In such processing using laser light, finer control is possible compared to the case where a through hole is mechanically formed in a workpiece, which is suitable for forming a fine through hole.

  However, when the through hole is formed by irradiating the workpiece with the laser beam in this way, the surface of the portion facing the through hole of the support plate on which the workpiece is placed is sublimated by the laser beam. A part of the sublimated material adheres to the work piece, and the work piece is contaminated to deteriorate the quality.

  Here, a through-hole is formed in a portion of the support plate on which the workpiece is placed, which is irradiated with the laser beam, so that the support plate is sublimated when the workpiece is processed with the laser beam. Has been considered (see, for example, Patent Document 1). Further, in Patent Document 1, a workpiece is sucked from a lower portion of the support plate through a through hole formed in the support plate, whereby the workpiece is lifted from the support plate and a desired workpiece is applied to the workpiece. A technique for avoiding that a through hole cannot be formed is described.

  However, in the laser processing apparatus described in Patent Document 1, a through hole is formed in a portion of the support plate on which the workpiece is placed, which is irradiated with the laser beam. Although it is possible to avoid sublimation of the support plate when processed by machining, processing waste generated by processing the work piece accumulates in the through holes formed in the support plate, and the through holes are blocked during mass production processing. There is a risk of it.

  Therefore, in addition to the above-described configuration, a laser processing apparatus is conceivable in which a through hole is formed in a region of the support plate that is not irradiated with laser light, and the workpiece is sucked through the through hole (for example, , See Patent Document 2). In this laser processing apparatus, a portion of the support plate on which the workpiece is placed is irradiated with laser light, that is, a portion facing the through hole of the workpiece, and a portion of the support plate not irradiated with laser light; Even if the through hole formed in the portion of the support plate irradiated with the laser beam is blocked by the processing waste of the workpiece, It can be adsorbed on a support plate. Here, in the laser processing apparatus described in Patent Document 2, the through holes formed in the portions of the support plate that are irradiated with the laser light and the through holes formed in the portions of the support plate that are not irradiated with the laser light. In the hole, the workpiece is sucked by different suction means. Therefore, the through hole formed in the portion of the support plate not irradiated with the laser light is formed so as to surround the plurality of through holes formed in the portion of the support plate irradiated with the laser light. Further, through holes are formed in the support plate at positions corresponding to a plurality of types of processing patterns for the work piece, so that through the through holes that are not actually irradiated with laser light for each processing pattern. The workpiece is sucked.

Further, the support plate as described above is formed of a porous member that allows air to pass through in the thickness direction, thereby avoiding the occurrence of irregularities between the suction region and the non-suction region of the workpiece on the support plate. A laser processing apparatus capable of performing the above has been considered (for example, see Patent Document 3).
JP 11-58061 A JP 2003-71585 A JP 2000-202675 A

  However, in the laser processing apparatus described in Patent Document 2 described above, a plurality of through holes formed in a portion of the support plate that is not irradiated with laser light are formed in a portion of the support plate that is irradiated with laser light. Since it is formed so as to surround the through hole, it is formed in the portion of the support plate that is not irradiated with the laser light depending on the number or interval of the plurality of through holes formed in the portion of the support plate that is irradiated with the laser light. In this case, even if the through-hole formed in the portion of the support plate irradiated with the laser beam is blocked and the suction force of the work piece is reduced, it will be It is hard to say that it can generate a sufficient suction force. In addition, since the through holes are formed at positions corresponding to a plurality of types of machining patterns for the workpiece, the workpiece is sucked through the through holes that are not actually irradiated with laser light for each machining pattern. However, since the interval between these through holes is not set to compensate for the decrease in the suction force of the workpiece, the through holes that are not irradiated with laser light are actually irradiated with laser light. Therefore, even if the through-hole formed in the portion of the support plate irradiated with the laser beam is blocked and the suction force of the workpiece is reduced, It is hard to say that it can generate a sufficient suction force. Further, since the through hole is also irradiated with laser light depending on the processing pattern, there is a possibility that the through hole may be blocked by processing waste of the workpiece.

  Further, in the laser processing apparatus described in Patent Document 3 described above, the support plate is formed of a porous member. However, since the porous member is formed in a mesh shape, the thickness direction, that is, the workpiece is processed. There is a problem that the processing waste of the workpiece is easily clogged in the suction direction of the workpiece.

  The present invention has been made in view of the problems of the conventional techniques as described above, and forms a through hole by irradiating a workpiece with laser light while adsorbing the workpiece on a support plate. It is an object of the present invention to provide a laser processing apparatus capable of reliably adsorbing a workpiece on a support plate.

In order to achieve the above object, the present invention provides:
A support plate on which the workpiece is placed; laser irradiation means for irradiating the workpiece placed on the support plate with a laser beam; and the workpiece placed on the support plate. A suction means for sucking through a through-hole portion formed in the plate, and processing the workpiece by irradiating the workpiece placed on the support plate with laser light from the laser irradiation means. In a laser processing apparatus that performs
The through hole is
A suction hole formed in a region irradiated with laser light by the laser irradiation means in a state where the workpiece is placed on the support plate;
A suction auxiliary hole formed in a region adjacent to the suction hole and not irradiated with laser light by the laser irradiation means in a state where the workpiece is placed on the support plate. To do.

  In the present invention configured as described above, the workpiece is processed by being irradiated with laser light from the laser irradiation means in a state where the workpiece is placed on the support plate. At that time, the workpiece is sucked by the suction means through the through-hole portion formed of the suction hole and the suction auxiliary hole formed in the support plate, and is thereby sucked by the support plate and has a desired through-hole. Will be formed. Among the through holes, the suction holes are formed in a region where the laser beam is irradiated by the laser irradiation unit in a state where the workpiece is placed on the support plate. For this reason, when the workpiece is processed by the laser beam, the opposing portions of the support plate are prevented from being sublimated. In addition, although the workpiece is sucked by the suction means through the suction hole, the processing hole generated by the processing of the workpiece may be accumulated and blocked. As a result, the workpiece floats off the support plate and a desired through hole cannot be formed in the workpiece. Therefore, in the present invention, a suction auxiliary hole is formed in a region adjacent to the suction hole. The suction auxiliary hole is formed in a region where the laser beam is not irradiated by the laser irradiation means in a state where the workpiece is placed on the support plate, so that machining waste generated by the machining of the workpiece is accumulated. Since the suction hole is formed adjacent to the suction hole, even if the processing hole generated by processing the work piece is accumulated and blocked, the work piece The processed portion by the laser beam is adsorbed to the support plate, and a desired through hole can be formed in the workpiece.

  Further, it is conceivable that the through-hole portion is formed by irradiating the laser beam from the laser irradiation unit using the irradiation position data of the laser beam by the laser irradiation unit on the workpiece. In this case, the suction hole in the through-hole portion is formed in a region where the laser beam is irradiated by the laser irradiation unit in a state where the workpiece is placed on the support plate. Since the laser beam irradiation position data is used as it is, and the suction auxiliary hole in the through hole is formed in a region adjacent to the suction hole, the laser beam irradiation position on the workpiece is irradiated with the laser beam irradiation position. Thus, the laser beam is irradiated from the laser irradiation means at a position offset by a predetermined amount.

  Moreover, when the detection means which detects the obstruction | occlusion state of a through-hole part is provided, that will be detected when a through-hole part is obstruct | occluded with the processing waste of a to-be-processed object.

  As described above, in the present invention, the laser beam is emitted by the laser irradiation means in a state where the through hole formed in the support plate on which the workpiece is placed is placed on the support plate. A suction hole formed in the irradiated area, and a suction auxiliary hole formed in an area adjacent to the suction hole and not irradiated with laser light by the laser irradiation means in a state where the workpiece is placed on the support plate Since the workpiece is sucked through the through-hole portion and sucked to the support plate, the suction hole is blocked by the processing waste generated by processing the workpiece. Even in such a case, the workpiece can be reliably adsorbed to the support plate.

  Further, in the case where the through hole portion is formed by irradiating the laser beam from the laser irradiation means using the laser beam irradiation position data by the laser irradiation means on the workpiece, the through hole portion is supported by the support plate. It is not necessary to input or create new data to form the data.

  Moreover, in what has a detection means which detects the obstruction | occlusion state of a through-hole part, when a through-hole part is obstruct | occluded with the processing waste of a workpiece, it can detect that.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram showing a first embodiment of a laser processing apparatus of the present invention, (a) is a diagram showing the configuration of the entire apparatus, and (b) is a structure of a support plate 20 shown in (a). It is a top view for demonstrating.

  In this embodiment, as shown in FIG. 1, a support plate 20 on which a workpiece such as paper or film is placed is mounted on a table 30 configured to be movable in the XY directions. A laser irradiation means 10 including a laser oscillator 11 for irradiating a workpiece placed on the plate 20 with laser light, a mirror 12 and a condenser lens 13, and a space 31 formed in the table 30 communicate with each other. A suction part 40 that communicates via the part 32 and sucks the support plate 20 mounted on the table 30 is provided. The space 31 provided in the table 30 is provided with a pressure sensor 50 serving as detection means for measuring the pressure in the space 31.

  In addition, suction holes 21 penetrating the front and back of the support plate 20 are formed in the support plate 20 in a plurality of regions irradiated with the laser light by the laser irradiation means 10 with the workpiece placed thereon. In addition, four suction auxiliary holes 22 penetrating the front and back of the support plate 20 are formed in regions adjacent to the plurality of suction holes 21. That is, the suction auxiliary hole 22 is formed in a region where the laser beam is not irradiated by the laser irradiation means 10 in a state where the workpiece is placed. As described above, the support plate 20 is formed with the through hole portion including the suction hole 21 and the suction auxiliary hole 22, so that the support plate 20 is mounted on the table 30 and further covered on the support plate 20. When the workpiece is placed, the workpiece placed on the support plate 20 is sucked by the suction portion 40 through the through hole portion including the suction hole 21 and the suction auxiliary hole 22, thereby It will be adsorbed to the support plate 20. The number of suction auxiliary holes 22 for one suction hole 21 is not limited to four and may be one or more.

  Here, in the support plate 20, the suction hole 21 and the suction auxiliary hole 22 are formed according to the processing position by laser irradiation of the placed film 60, but the suction hole 21 and the suction auxiliary hole will be described below. A method of forming 22 will be described.

  First, in a state where the workpiece is not placed on the support plate 20, the suction hole 21 is formed based on the processing data of the workpiece, that is, the irradiation position data of the laser beam by the laser irradiation means 10. Specifically, in a state where the workpiece is not placed, the table 30 is moved in the XY direction based on the machining data of the workpiece, and the workpiece is placed on the support plate 20. In this case, the laser beam is irradiated from the laser irradiation means 10 to the region where the workpiece is irradiated with the laser beam, thereby forming the suction hole 21 in the region facing the processing position of the workpiece.

  Next, a predetermined offset amount is given to the position where the suction hole 21 is formed, that is, the position where the support plate 20 is irradiated with the laser beam to form the suction hole 21, and the support plate is based on the offset amount. 20 is moved in the X and Y directions and irradiated with laser light, and four suction auxiliary holes 22 are formed in regions adjacent to the respective suction holes 21. At this time, the diameter of the suction auxiliary hole 22 is preferably equal to or smaller than the diameter of the suction hole 21. Therefore, by changing the output and focal length using the laser irradiation means 10 in which the suction hole 21 is formed, the diameters of the suction auxiliary hole 22 and the suction hole 21 are made different, or the laser irradiation in which the suction hole 21 is formed. It is conceivable to form the suction auxiliary hole 22 using a laser irradiation means different from the means 10. The diameters of the suction hole 21 and the suction auxiliary hole 22 are preferably about 0.01 mm to 1 mm, and the shape is not limited to a circle but may be an ellipse or a polygon. Further, the offset amount is preferably about 0.1 mm to 50 mm, and more preferably 0.5 mm to 5 mm. Moreover, as the support plate 20, what consists of an acrylic etc. about 5 mm thick can be considered, for example.

  Thus, by forming the suction hole 21 and the suction auxiliary hole 22 formed in the support plate 20 using the laser beam, the fine suction hole 21 and the suction auxiliary hole 22 are linearly formed on the support plate 20. Can be formed.

  In this way, the suction hole 21 and the suction auxiliary hole 22 are formed in the support plate 20. As described above, the suction hole 21 and the suction auxiliary hole 22 are formed using the processing data of the workpiece. Thus, it is not necessary to input or create new data for forming the suction hole 21 and the suction auxiliary hole 22 in the support plate 20, and when the workpiece is subsequently placed on the support plate 20. It is not necessary to align the suction hole 21 with the processing position of the workpiece. As described above, a method of inputting or creating new data for forming the suction hole 21 and the suction auxiliary hole 22 in the support plate 20 without using the processing data of the workpiece may be applied. .

  Below, the effect | action at the time of the process operation | work of the workpiece in the laser processing apparatus comprised as mentioned above is demonstrated.

  FIG. 2 is a view for explaining the action during the processing operation of the workpiece in the laser processing apparatus shown in FIG. 1. FIG. 2A shows the suction hole 21 of the support plate 20 closed by processing waste. FIG. 7B is a diagram illustrating a state in which the suction hole 21 of the support plate 20 is blocked by processing waste.

  When processing a workpiece using the laser processing apparatus shown in FIG. 1, a film 60 to be processed is placed on the support plate 20 as shown in FIG. 40 is driven. Then, the suction action by the suction part 40 acts on the suction hole 21 and the suction auxiliary hole 22 formed in the support plate 20, whereby the film 60 placed on the support plate 20 is attracted to the support plate 20. At this time, if the diameter of the suction hole 21 is large, a portion of the film 60 that faces the suction hole 21 is sucked into the suction hole 21 and the portion is depressed. The distance between the condenser lens 13 of the laser irradiation means 10 and the surface of the film 60 is such that the laser light 14 emitted from the laser irradiation means 10 is condensed on the surface of the film 60 according to the processed shape of the film 60. If the film 60 is depressed and the distance between the condensing lens 13 of the laser irradiating means 10 and the surface of the film 60 changes, the film 60 is depressed. 60, it becomes impossible to perform desired processing. Therefore, it is preferable that the diameter of the suction hole 21 is slightly larger than the diameter of the through hole formed in the film 60 by laser light. Also, in the suction auxiliary hole 22, if the diameter is large as in the case of the suction hole 21, a portion of the film 60 facing the suction auxiliary hole 22 is sucked into the suction auxiliary hole 22, and the portion is recessed, and the film 60. Since the region facing the suction hole 21 is also affected, the diameter is preferably equal to or smaller than the diameter of the suction hole 21. The workpiece is not limited to the film 60, and any material that can be laser-processed, such as paper, resin, cloth, leather, wood, rubber, or metal, can be used.

In this state, for example, CO ₂ laser light 14 is output from the laser oscillator 11, the laser light 14 is reflected by the mirror 12, further condensed by the condenser lens 13, and irradiated onto the film 60. A region irradiated with 60 laser beams 14, that is, a region facing the suction hole 21 is sublimated to form a through hole.

  At this time, processing waste is generated when the film 60 is sublimated, but most of the processing waste is sucked as smoke (fumes) by a dust collector (not shown) separately provided on the upper portion of the film 60, When the film 60 penetrates, the processing waste 61 is generated also in the lower portion of the film 60, and the processing waste 61 is sucked from the suction hole 21 by the suction action by the suction portion 40. Then, the processing waste 61 sucked from the suction hole 21 is gradually accumulated inside the suction hole 21, and if the processing on the film 60 is continued as it is, the suction hole 21 is processed as shown in FIG. It will be blocked by waste 61.

  Here, in this embodiment, the suction auxiliary hole 22 is formed in a region adjacent to the suction hole 21. Since the suction auxiliary hole 22 is formed in a region where the laser beam 14 is not irradiated in a state where the film 60 is placed on the support plate 20, processing waste 61 generated by processing the film 60 is accumulated. Thus, the film 60 continues to be sucked by the suction portion 40 through the suction auxiliary hole 22. Further, since the suction auxiliary hole 22 is formed in an area adjacent to the suction portion 40, even if the suction hole 21 is blocked by the processing waste 61, the film 60 is processed. Since the vicinity is adsorbed by the support sheet 20, the region does not float from the support plate 20, and the film 60 can be processed as desired.

  In the space 31 formed in the table 30, the internal pressure changes depending on whether the suction hole 21 is blocked by the processing waste 61 or not. Therefore, the pressure inside the space 31 is measured by the pressure sensor 50 provided in the space 31, and the closed state of the suction hole 21 is detected. If the pressure value measured by the pressure sensor 50 is equal to or greater than a predetermined value, it is determined that the suction hole 21 is blocked and an alarm or the like is output. It is informed that the blockage has occurred, and it is recognized that an operation such as removing the processing waste 61 is necessary. In addition, although the suction auxiliary hole 22 is less likely to be blocked by the processing waste 61, it may be blocked for some reason. Therefore, when both the suction hole 21 and the suction auxiliary hole 22 are blocked The pressure at the pressure sensor 50 is also set, and when the pressure measured by the pressure sensor 50 exceeds the pressure, the suction hole 21 and the suction auxiliary hole 22 may be informed that both are closed. Conceivable.

(Second Embodiment)
FIG. 3 is a diagram showing a second embodiment of the laser processing apparatus of the present invention.

  In this embodiment, as shown in FIG. 3, the pressure sensor 50 for measuring the internal pressure is not provided in the space 31 of the table 30 on which the support plate 20 is mounted, as compared with that shown in FIG. As a means, a light emitting unit 51 and a light receiving sensor 52 for receiving light emitted from the light emitting unit 51 are provided in the space 31 of the table 30 so as to be close to the support plate 20, respectively. The only difference is that the closed state of the suction hole 21 is detected.

  FIG. 4 is a diagram for explaining the action during the processing operation of the workpiece in the laser processing apparatus shown in FIG. 3. FIG. 4A is a view in which the suction hole 21 of the support plate 20 is blocked by processing waste. FIG. 7B is a diagram illustrating a state in which the suction hole 21 of the support plate 20 is blocked by processing waste.

  In the laser processing apparatus shown in FIG. 3, when the suction hole 21 of the support plate 20 is not blocked by processing waste, as shown in FIG. 4A, the surface on which the film 60 of the support plate 20 is placed. Since there is no protrusion on the opposite surface, the light emitted from the light emitting unit 51 provided in the space 31 of the table 30 is received by the light receiving sensor 52 as it is.

  On the other hand, in the laser processing apparatus shown in FIG. 3, when the suction hole 21 of the support plate 20 is blocked by processing waste, the film 60 of the support plate 20 is placed as shown in FIG. The processing waste 61 accumulated in the suction hole 21 protrudes on the surface opposite to the opposite surface, so that the light emitted from the light emitting portion 51 provided in the space 31 of the table 30 is caused by the protruding processing waste 61. The light receiving sensor 52 does not receive the light.

  Therefore, if the light emitted from the light emitting unit 51 is not received by the light receiving sensor 52, it is determined that the suction hole 21 is blocked and an alarm or the like is output. It is notified that the blockage has occurred, and it is recognized that an operation such as removing the processing waste 61 is necessary.

(Third embodiment)
FIG. 5 is a diagram showing a third embodiment of the laser processing apparatus of the present invention.

  In this embodiment, as shown in FIG. 5, the pressure sensor 50 for measuring the internal pressure is not provided in the space 31 of the table 30 on which the support plate 20 is mounted, as compared with that shown in FIG. As a means, on the surface on which the support plate 20 of the table 30 is mounted, the light emitting part 53 and the light receiving sensor 54 for receiving the light emitted from the light emitting part 53 are adjacent to the support plate 20 respectively. The light emitting portion and the light receiving portion are provided so as to be slightly exposed from the surface of the film 60 placed on the support plate 20, respectively, and the closed state of the suction hole 21 is detected according to the light receiving state in the light receiving sensor 54. Only the point is different.

  FIG. 6 is a diagram for explaining the action during the processing operation of the workpiece in the laser processing apparatus shown in FIG. 5. FIG. 6A shows the suction hole 21 of the support plate 20 closed by processing waste. FIG. 7B is a diagram illustrating a state in which the suction hole 21 of the support plate 20 is blocked by processing waste.

  In the laser processing apparatus shown in FIG. 5, when the suction hole 21 of the support plate 20 is not blocked by processing waste, the surface on which the film 60 of the support plate 20 is placed as shown in FIG. Since there is no protrusion, the light emitted from the light emitting portion 53 provided on the surface of the table 30 on which the support plate 20 is mounted is received by the light receiving sensor 54 as it is.

  On the other hand, in the laser processing apparatus shown in FIG. 5, when the suction hole 21 of the support plate 20 is blocked by processing waste, the film 60 of the support plate 20 is placed as shown in FIG. On the other surface, the processing waste 61 accumulated in the suction hole 21 protrudes and the film 60 rises, so that the light emitted from the light emitting portion 53 provided on the surface on which the support plate 20 of the table 30 is mounted is this. It is blocked by the raised portion of the film 60 and is not received by the light receiving sensor 54.

  Therefore, if the light emitted from the light emitting unit 53 is not received by the light receiving sensor 54, it is determined that the suction hole 21 is blocked and an alarm or the like is output. It is notified that the blockage has occurred, and it is recognized that an operation such as removing the processing waste 61 is necessary.

  In this embodiment, when the light emitted from the light emitting unit 53 is not received by the light receiving sensor 54, it is determined that the suction hole 21 is blocked. Accordingly, it may be considered to determine whether or not the suction hole 21 is closed. In this case, it is conceivable to use, for example, a Keyence transmission type digital laser sensor LX2 (an area of φ1 mm can be identified by 8 μm) as the light receiving sensor 54.

It is a figure which shows 1st Embodiment of the laser processing apparatus of this invention, (a) is a figure which shows the structure of the whole apparatus, (b) is for demonstrating the structure of the support plate shown to (a). It is a top view. It is a figure for demonstrating the effect | action at the time of the process operation of the workpiece in the laser processing apparatus shown in FIG. 1, (a) is a figure which shows the state in which the suction hole of a support plate is not obstruct | occluded with the processing waste, (B) is a figure which shows the state by which the suction hole of the support plate is block | closed with the processing waste. It is a figure which shows 2nd Embodiment of the laser processing apparatus of this invention. It is a figure for demonstrating the effect | action at the time of the process operation | work of the workpiece in the laser processing apparatus shown in FIG. 3, (a) is a figure which shows the state in which the suction hole of a support plate is not obstruct | occluded with the processing waste, (B) is a figure which shows the state by which the suction hole of the support plate is block | closed with the processing waste. It is a figure which shows 3rd Embodiment of the laser processing apparatus of this invention. It is a figure for demonstrating the effect | action at the time of the process operation | work of the workpiece in the laser processing apparatus shown in FIG. 5, (a) is a figure which shows the state in which the suction hole of a support plate is not obstruct | occluded with the processing waste, (B) is a figure which shows the state by which the suction hole of the support plate is block | closed with the processing waste.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Laser irradiation means 11 Laser oscillator 12 Mirror 13 Condensing lens 14 Laser light 20 Support plate 21 Suction hole 22 Suction auxiliary hole 30 Table 31 Space 32 Communication part 40 Suction part 50 Pressure sensor 51, 53 Light emission part 52,54 Light receiving sensor 60 Film 61 processing waste

Claims (3)

A support plate on which the workpiece is placed; laser irradiation means for irradiating the workpiece placed on the support plate with a laser beam; and the workpiece placed on the support plate. A suction means for sucking through a through-hole portion formed in the plate, and processing the workpiece by irradiating the workpiece placed on the support plate with laser light from the laser irradiation means. In a laser processing apparatus that performs
The through hole is
A suction hole formed in a region irradiated with laser light by the laser irradiation means in a state where the workpiece is placed on the support plate;
A suction auxiliary hole formed in a region adjacent to the suction hole and not irradiated with laser light by the laser irradiation means in a state where the workpiece is placed on the support plate. Laser processing equipment. In the laser processing apparatus of Claim 1,
The through hole is formed by irradiating a laser beam from the laser irradiation unit using the irradiation position data of the laser beam from the laser irradiation unit on the workpiece. . In the laser processing apparatus of Claim 1 or Claim 2,
A laser processing apparatus comprising a detecting means for detecting a closed state of the through hole.

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