JP2003071332A5 - - Google Patents

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Publication number
JP2003071332A5
JP2003071332A5 JP2001264627A JP2001264627A JP2003071332A5 JP 2003071332 A5 JP2003071332 A5 JP 2003071332A5 JP 2001264627 A JP2001264627 A JP 2001264627A JP 2001264627 A JP2001264627 A JP 2001264627A JP 2003071332 A5 JP2003071332 A5 JP 2003071332A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001264627A
Other versions
JP4942263B2 (ja
JP2003071332A (ja
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Publication date
Application filed filed Critical
Priority to JP2001264627A priority Critical patent/JP4942263B2/ja
Priority claimed from JP2001264627A external-priority patent/JP4942263B2/ja
Priority to US10/229,931 priority patent/US7004181B2/en
Publication of JP2003071332A publication Critical patent/JP2003071332A/ja
Priority to US11/330,004 priority patent/US7288156B2/en
Publication of JP2003071332A5 publication Critical patent/JP2003071332A5/ja
Application granted granted Critical
Publication of JP4942263B2 publication Critical patent/JP4942263B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001264627A 2001-08-31 2001-08-31 洗浄装置 Expired - Lifetime JP4942263B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001264627A JP4942263B2 (ja) 2001-08-31 2001-08-31 洗浄装置
US10/229,931 US7004181B2 (en) 2001-08-31 2002-08-27 Apparatus for cleaning a substrate
US11/330,004 US7288156B2 (en) 2001-08-31 2006-01-10 Methods for cleaning a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001264627A JP4942263B2 (ja) 2001-08-31 2001-08-31 洗浄装置

Publications (3)

Publication Number Publication Date
JP2003071332A JP2003071332A (ja) 2003-03-11
JP2003071332A5 true JP2003071332A5 (ja) 2008-10-09
JP4942263B2 JP4942263B2 (ja) 2012-05-30

Family

ID=19091202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001264627A Expired - Lifetime JP4942263B2 (ja) 2001-08-31 2001-08-31 洗浄装置

Country Status (2)

Country Link
US (2) US7004181B2 (ja)
JP (1) JP4942263B2 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
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MXPA05007154A (es) * 2002-12-30 2005-09-21 Nektar Therapeutics Atomizador prepeliculizacion.
TW200608453A (en) * 2004-08-20 2006-03-01 Aqua Science Corp Object treating device and method
JP2006114738A (ja) * 2004-10-15 2006-04-27 Realize Advanced Technology Ltd レジスト剥離方法およびレジスト剥離装置
KR100617980B1 (ko) * 2005-01-21 2006-08-31 한국수자원공사 동심원상 이중관구조로 된 콘형 노즐을 구비한 이젝터
WO2007063576A1 (ja) * 2005-11-29 2007-06-07 Realize Advanced Technology Limited レジスト剥離方法およびレジスト剥離装置
JP4829686B2 (ja) * 2006-06-07 2011-12-07 大阪瓦斯株式会社 サウナ装置
US20080181832A1 (en) * 2007-01-30 2008-07-31 Lih-Ren Shiue Pocket-size ozone generator
JP2008244318A (ja) * 2007-03-28 2008-10-09 Tokyo Electron Ltd 基板搬送部材の洗浄方法、基板搬送装置及び基板処理システム
JP5199339B2 (ja) * 2007-05-18 2013-05-15 ティーイーエル エフエスアイ,インコーポレイティド 水蒸気または蒸気を用いた基板の処理方法
US8404626B2 (en) 2007-12-21 2013-03-26 Lam Research Corporation Post-deposition cleaning methods and formulations for substrates with cap layers
US8567420B2 (en) * 2008-03-31 2013-10-29 Kabushiki Kaisha Toshiba Cleaning apparatus for semiconductor wafer
JP2010103366A (ja) * 2008-10-24 2010-05-06 Tokyo Electron Ltd 基板洗浄装置
US8056832B2 (en) 2008-10-30 2011-11-15 Taiwan Semiconductor Manufacturing Co., Ltd. Jetspray nozzle and method for cleaning photo masks and semiconductor wafers
KR20130101193A (ko) * 2012-03-05 2013-09-13 삼성디스플레이 주식회사 패널의 세정장치 및 세정방법
JP5889691B2 (ja) 2012-03-28 2016-03-22 株式会社Screenホールディングス 基板処理装置および基板処理方法
JP5926086B2 (ja) * 2012-03-28 2016-05-25 株式会社Screenホールディングス 基板処理装置および基板処理方法
US8871108B2 (en) 2013-01-22 2014-10-28 Tel Fsi, Inc. Process for removing carbon material from substrates
US9870933B2 (en) * 2013-02-08 2018-01-16 Lam Research Ag Process and apparatus for treating surfaces of wafer-shaped articles
KR20160003636A (ko) * 2013-05-08 2016-01-11 티이엘 에프에스아이, 인코포레이티드 헤이즈 소멸 및 잔류물 제거를 위한 수증기를 포함하는 프로세스
JP6296899B2 (ja) 2014-05-26 2018-03-20 三菱電機株式会社 レジスト除去装置及びレジスト除去方法
KR101457574B1 (ko) * 2014-06-13 2014-11-04 강귀동 이중 튜브 구조의 다용도 스프레이 장치
CN105990122B (zh) * 2015-02-15 2020-03-27 盛美半导体设备(上海)股份有限公司 一种减小晶圆表面粗糙度的方法
JP2017123402A (ja) * 2016-01-07 2017-07-13 株式会社荏原製作所 洗浄装置
KR20180085088A (ko) * 2017-01-16 2018-07-26 삼성디스플레이 주식회사 포토레지스트 박리 장치 및 이를 이용한 포토레지스트 박리 방법 및 박막 패턴 형성 방법
GB201815163D0 (en) * 2018-09-18 2018-10-31 Lam Res Ag Wafer washing method and apparatus
CN109224892A (zh) * 2018-09-26 2019-01-18 中国航空工业集团公司西安飞机设计研究所 一种液态物质汽化及其与空气混合的预混装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
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US1504851A (en) * 1923-05-24 1924-08-12 John J Wren Device for washing vehicles
US4255121A (en) * 1978-08-14 1981-03-10 Eces Co. Ltd. Gaseous fuel containing water, apparatus therefor
DE69233539T2 (de) * 1991-09-13 2006-05-24 Kabushiki Kaisha Toshiba, Kawasaki Dampfinjektor
JP3415670B2 (ja) * 1994-03-03 2003-06-09 三菱電機株式会社 ウエハ洗浄装置
US5520331A (en) * 1994-09-19 1996-05-28 The United States Of America As Represented By The Secretary Of The Navy Liquid atomizing nozzle
JP3200528B2 (ja) * 1995-01-19 2001-08-20 三菱電機株式会社 ドライエッチングの後処理方法
JP3504023B2 (ja) * 1995-05-26 2004-03-08 株式会社ルネサステクノロジ 洗浄装置および洗浄方法
DE19523499C2 (de) * 1995-06-28 2002-01-24 Gce Rhoena Autogengeraete Gmbh Gasmischende Brennschneiddüse
KR100187445B1 (ko) * 1996-06-05 1999-04-15 김광호 웨이퍼 세정 방법 및 장치
US6610168B1 (en) * 1999-08-12 2003-08-26 Sipec Corporation Resist film removal apparatus and resist film removal method
JP2001176833A (ja) * 1999-12-14 2001-06-29 Tokyo Electron Ltd 基板処理装置
TW503458B (en) * 2000-07-11 2002-09-21 Tokyo Electron Ltd Cleaning method and cleaning apparatus for substrate
US6598805B2 (en) * 2001-05-30 2003-07-29 Dainippon Screen Mfg. Co., Ltd Substrate cleaning apparatus

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