JP2002118790A5 - - Google Patents

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Publication number
JP2002118790A5
JP2002118790A5 JP2001234328A JP2001234328A JP2002118790A5 JP 2002118790 A5 JP2002118790 A5 JP 2002118790A5 JP 2001234328 A JP2001234328 A JP 2001234328A JP 2001234328 A JP2001234328 A JP 2001234328A JP 2002118790 A5 JP2002118790 A5 JP 2002118790A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2001234328A
Other versions
JP2002118790A (ja
JP4600964B2 (ja
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Publication date
Priority claimed from US09/632,106 external-priority patent/US6724010B1/en
Application filed filed Critical
Publication of JP2002118790A publication Critical patent/JP2002118790A/ja
Publication of JP2002118790A5 publication Critical patent/JP2002118790A5/ja
Application granted granted Critical
Publication of JP4600964B2 publication Critical patent/JP4600964B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001234328A 2000-08-03 2001-08-02 ゲーテッドフォトダイオードを有する固体イメージャ及びその製造方法 Expired - Fee Related JP4600964B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/632,106 US6724010B1 (en) 2000-08-03 2000-08-03 Solid state imager having gated photodiodes and method for making same
US09/632106 2000-08-03

Publications (3)

Publication Number Publication Date
JP2002118790A JP2002118790A (ja) 2002-04-19
JP2002118790A5 true JP2002118790A5 (ja) 2008-09-18
JP4600964B2 JP4600964B2 (ja) 2010-12-22

Family

ID=24534101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001234328A Expired - Fee Related JP4600964B2 (ja) 2000-08-03 2001-08-02 ゲーテッドフォトダイオードを有する固体イメージャ及びその製造方法

Country Status (6)

Country Link
US (1) US6724010B1 (ja)
EP (1) EP1179852B1 (ja)
JP (1) JP4600964B2 (ja)
BR (1) BRPI0103203B1 (ja)
DE (1) DE60127047T2 (ja)
SG (1) SG90258A1 (ja)

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US20070053493A1 (en) * 2003-05-09 2007-03-08 Koninklijke Philips Electronics N.V. Flat panel x-ray detector
US7030032B2 (en) * 2003-05-13 2006-04-18 Raytheon Company Photodiode passivation technique
KR100556349B1 (ko) * 2003-10-28 2006-03-03 엘지.필립스 엘시디 주식회사 액정표시소자용 어레이 기판의 제조방법
US6982176B2 (en) 2003-10-30 2006-01-03 General Electric Company Method for monitoring production of pixel detectors and detectors produced thereby
US7259377B2 (en) * 2005-12-15 2007-08-21 General Electric Company Diode design to reduce the effects of radiation damage
US7208742B1 (en) * 2005-12-15 2007-04-24 General Electric Company X-ray detector with radiation hard photodiode design
JP2008244251A (ja) * 2007-03-28 2008-10-09 Toshiba Corp アモルファスシリコンフォトダイオード及びその製造方法ならびにx線撮像装置
TWI355106B (en) * 2007-05-07 2011-12-21 Chunghwa Picture Tubes Ltd Organic photodetector and fabricating method of or
US20090108385A1 (en) * 2007-10-29 2009-04-30 Micron Technology, Inc. Method and apparatus for improving crosstalk and sensitivity in an imager
US7897929B2 (en) * 2007-12-06 2011-03-01 General Electric Company Reduced cost pixel design for flat panel x-ray imager
JP5185013B2 (ja) 2008-01-29 2013-04-17 富士フイルム株式会社 電磁波検出素子
JP5461719B2 (ja) * 2008-01-29 2014-04-02 富士フイルム株式会社 電磁波検出素子
US7902512B1 (en) * 2009-12-04 2011-03-08 Carestream Health, Inc. Coplanar high fill factor pixel architecture
US10396229B2 (en) * 2011-05-09 2019-08-27 International Business Machines Corporation Solar cell with interdigitated back contacts formed from high and low work-function-tuned silicides of the same metal
KR20150034947A (ko) * 2013-09-27 2015-04-06 삼성디스플레이 주식회사 표시 장치의 금속 배선, 박막 트랜지스터 기판 및 박막 트랜지스터 기판의 제조 방법
US9461072B2 (en) * 2013-12-25 2016-10-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display array substrates and a method for manufacturing the same
CN106935601B (zh) * 2017-03-13 2019-08-23 京东方科技集团股份有限公司 半导体器件、阵列基板和半导体器件的制造方法
CN109166943B (zh) * 2018-09-19 2021-01-26 京东方科技集团股份有限公司 探测基板及其制造方法、探测器

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US4327291A (en) * 1980-06-16 1982-04-27 Texas Instruments Incorporated Infrared charge injection device imaging system
US4729005A (en) 1985-04-29 1988-03-01 General Electric Company Method and apparatus for improved metal-insulator-semiconductor device operation
US4751560A (en) * 1986-02-24 1988-06-14 Santa Barbara Research Center Infrared photodiode array
US4857979A (en) * 1988-06-20 1989-08-15 Ford Aerospace & Communications Corporation Platinum silicide imager
JP2830177B2 (ja) * 1989-10-04 1998-12-02 富士ゼロックス株式会社 画像読取装置
JPH03212975A (ja) * 1990-01-17 1991-09-18 Fuji Xerox Co Ltd イメージセンサ
JPH04154167A (ja) * 1990-10-18 1992-05-27 Fuji Xerox Co Ltd 半導体装置
JPH06314813A (ja) * 1993-03-04 1994-11-08 Sumitomo Electric Ind Ltd pin型受光素子、その製造方法及び光電子集積回路
US5399884A (en) 1993-11-10 1995-03-21 General Electric Company Radiation imager with single passivation dielectric for transistor and diode
US5435608A (en) 1994-06-17 1995-07-25 General Electric Company Radiation imager with common passivation dielectric for gate electrode and photosensor
US5663577A (en) 1996-03-01 1997-09-02 General Electric Company Solid state imager array with address line spacer structure
US5777355A (en) * 1996-12-23 1998-07-07 General Electric Company Radiation imager with discontinuous dielectric
JP4478215B2 (ja) * 1997-01-17 2010-06-09 ゼネラル・エレクトリック・カンパニイ 耐腐食性イメージング装置
JP4011734B2 (ja) * 1998-06-02 2007-11-21 キヤノン株式会社 2次元光センサ、それを用いた放射線検出装置及び放射線診断システム
US6326649B1 (en) * 1999-01-13 2001-12-04 Agere Systems, Inc. Pin photodiode having a wide bandwidth
US6384461B1 (en) * 1999-10-15 2002-05-07 Xerox Corporation Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays
US6300648B1 (en) * 1999-12-28 2001-10-09 Xerox Corporation Continuous amorphous silicon layer sensors using sealed metal back contact

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