JP2003049280A5 - - Google Patents
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- Publication number
- JP2003049280A5 JP2003049280A5 JP2001179341A JP2001179341A JP2003049280A5 JP 2003049280 A5 JP2003049280 A5 JP 2003049280A5 JP 2001179341 A JP2001179341 A JP 2001179341A JP 2001179341 A JP2001179341 A JP 2001179341A JP 2003049280 A5 JP2003049280 A5 JP 2003049280A5
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- semiconductor device
- plating solution
- cobalt
- alkali metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007772 electroless plating Methods 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 15
- 229910052783 alkali metal Inorganic materials 0.000 claims description 8
- 150000001340 alkali metals Chemical class 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- 229910000521 B alloy Inorganic materials 0.000 claims description 6
- HZEIHKAVLOJHDG-UHFFFAOYSA-N boranylidynecobalt Chemical compound [Co]#B HZEIHKAVLOJHDG-UHFFFAOYSA-N 0.000 claims description 6
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 6
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000003870 refractory metal Substances 0.000 claims description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims 3
- 229910000085 borane Inorganic materials 0.000 claims 2
- 229910001385 heavy metal Inorganic materials 0.000 claims 2
- 150000002736 metal compounds Chemical class 0.000 claims 2
- 239000003002 pH adjusting agent Substances 0.000 claims 2
- 239000003381 stabilizer Substances 0.000 claims 2
- 150000003464 sulfur compounds Chemical class 0.000 claims 2
- 239000004094 surface-active agent Substances 0.000 claims 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- 125000003282 alkyl amino group Chemical group 0.000 claims 1
- -1 alkyl borane Chemical compound 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 2
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001179341A JP2003049280A (ja) | 2001-06-01 | 2001-06-13 | 無電解めっき液及び半導体装置 |
| PCT/JP2002/005250 WO2002099164A2 (en) | 2001-06-01 | 2002-05-30 | Electroless-plating solution and semiconductor device |
| CNB028111192A CN1285764C (zh) | 2001-06-01 | 2002-05-30 | 无电电镀溶液 |
| KR1020037015760A KR100891344B1 (ko) | 2001-06-01 | 2002-05-30 | 무전해 도금액 및 반도체 디바이스 |
| TW091111514A TW543091B (en) | 2001-06-01 | 2002-05-30 | Electroless-plating solution and semiconductor device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-167355 | 2001-06-01 | ||
| JP2001167355 | 2001-06-01 | ||
| JP2001179341A JP2003049280A (ja) | 2001-06-01 | 2001-06-13 | 無電解めっき液及び半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003049280A JP2003049280A (ja) | 2003-02-21 |
| JP2003049280A5 true JP2003049280A5 (enrdf_load_stackoverflow) | 2005-02-17 |
Family
ID=26616238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001179341A Pending JP2003049280A (ja) | 2001-06-01 | 2001-06-13 | 無電解めっき液及び半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2003049280A (enrdf_load_stackoverflow) |
| KR (1) | KR100891344B1 (enrdf_load_stackoverflow) |
| CN (1) | CN1285764C (enrdf_load_stackoverflow) |
| TW (1) | TW543091B (enrdf_load_stackoverflow) |
| WO (1) | WO2002099164A2 (enrdf_load_stackoverflow) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4663965B2 (ja) * | 2003-02-27 | 2011-04-06 | 株式会社荏原製作所 | 基板処理方法及び基板処理装置 |
| JP2004304021A (ja) * | 2003-03-31 | 2004-10-28 | Ebara Corp | 半導体装置の製造方法及び製造装置 |
| JP2005015885A (ja) * | 2003-06-27 | 2005-01-20 | Ebara Corp | 基板処理方法及び装置 |
| KR100859259B1 (ko) | 2005-12-29 | 2008-09-18 | 주식회사 엘지화학 | 캡층 형성을 위한 코발트 계열 합금 무전해 도금 용액 및이를 이용하는 무전해 도금 방법 |
| JP2007246978A (ja) * | 2006-03-15 | 2007-09-27 | Jsr Corp | 無電解めっき液 |
| JP2007246979A (ja) * | 2006-03-15 | 2007-09-27 | Jsr Corp | 無電解めっき液 |
| JP2007246980A (ja) * | 2006-03-15 | 2007-09-27 | Jsr Corp | 無電解めっき液 |
| JP2007246981A (ja) * | 2006-03-15 | 2007-09-27 | Jsr Corp | 無電解めっき液 |
| KR100774651B1 (ko) | 2006-07-21 | 2007-11-08 | 동부일렉트로닉스 주식회사 | 반도체 소자의 구리배선 형성방법 및 구조 |
| TW200825207A (en) * | 2006-09-29 | 2008-06-16 | Wako Pure Chem Ind Ltd | Composition for nonelectrolytic plating and method of forming metallic protection film using the same |
| US7794530B2 (en) * | 2006-12-22 | 2010-09-14 | Lam Research Corporation | Electroless deposition of cobalt alloys |
| US9496145B2 (en) | 2014-03-19 | 2016-11-15 | Applied Materials, Inc. | Electrochemical plating methods |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3917464A (en) * | 1973-07-20 | 1975-11-04 | Us Army | Electroless deposition of cobalt boron |
| US4232060A (en) * | 1979-01-22 | 1980-11-04 | Richardson Chemical Company | Method of preparing substrate surface for electroless plating and products produced thereby |
| EP0458827A1 (en) * | 1989-02-17 | 1991-12-04 | Polymetals Technology Limited | Plating composition and process |
| JPH051384A (ja) * | 1991-06-21 | 1993-01-08 | Nec Corp | 無電解めつき浴 |
| US5203911A (en) * | 1991-06-24 | 1993-04-20 | Shipley Company Inc. | Controlled electroless plating |
| US5240497A (en) * | 1991-10-08 | 1993-08-31 | Cornell Research Foundation, Inc. | Alkaline free electroless deposition |
| JP3514800B2 (ja) * | 1994-01-27 | 2004-03-31 | 哲彌 逢坂 | 軟磁性薄膜およびその製造方法 |
| US5695810A (en) * | 1996-11-20 | 1997-12-09 | Cornell Research Foundation, Inc. | Use of cobalt tungsten phosphide as a barrier material for copper metallization |
| KR19990015599A (ko) * | 1997-08-07 | 1999-03-05 | 윤종용 | 무전해 도금을 이용한 반도체장치의 듀얼 다마슨금속 배선층 형성방법 |
| US6342733B1 (en) * | 1999-07-27 | 2002-01-29 | International Business Machines Corporation | Reduced electromigration and stressed induced migration of Cu wires by surface coating |
-
2001
- 2001-06-13 JP JP2001179341A patent/JP2003049280A/ja active Pending
-
2002
- 2002-05-30 WO PCT/JP2002/005250 patent/WO2002099164A2/en active Application Filing
- 2002-05-30 TW TW091111514A patent/TW543091B/zh not_active IP Right Cessation
- 2002-05-30 KR KR1020037015760A patent/KR100891344B1/ko not_active Expired - Fee Related
- 2002-05-30 CN CNB028111192A patent/CN1285764C/zh not_active Expired - Fee Related
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