|
US6232789B1
(en)
|
1997-05-28 |
2001-05-15 |
Cascade Microtech, Inc. |
Probe holder for low current measurements
|
|
US5729150A
(en)
*
|
1995-12-01 |
1998-03-17 |
Cascade Microtech, Inc. |
Low-current probe card with reduced triboelectric current generating cables
|
|
US5914613A
(en)
|
1996-08-08 |
1999-06-22 |
Cascade Microtech, Inc. |
Membrane probing system with local contact scrub
|
|
US7106570B2
(en)
|
1997-04-08 |
2006-09-12 |
Xzy Altenuators, Llc |
Pathway arrangement
|
|
US6603646B2
(en)
|
1997-04-08 |
2003-08-05 |
X2Y Attenuators, Llc |
Multi-functional energy conditioner
|
|
US7336468B2
(en)
|
1997-04-08 |
2008-02-26 |
X2Y Attenuators, Llc |
Arrangement for energy conditioning
|
|
US6894884B2
(en)
|
1997-04-08 |
2005-05-17 |
Xzy Attenuators, Llc |
Offset pathway arrangements for energy conditioning
|
|
US7301748B2
(en)
|
1997-04-08 |
2007-11-27 |
Anthony Anthony A |
Universal energy conditioning interposer with circuit architecture
|
|
US20030161086A1
(en)
|
2000-07-18 |
2003-08-28 |
X2Y Attenuators, Llc |
Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
|
|
US7336467B2
(en)
|
2000-10-17 |
2008-02-26 |
X2Y Attenuators, Llc |
Energy pathway arrangement
|
|
US9054094B2
(en)
|
1997-04-08 |
2015-06-09 |
X2Y Attenuators, Llc |
Energy conditioning circuit arrangement for integrated circuit
|
|
US7042703B2
(en)
|
2000-03-22 |
2006-05-09 |
X2Y Attenuators, Llc |
Energy conditioning structure
|
|
US7110227B2
(en)
|
1997-04-08 |
2006-09-19 |
X2Y Attenuators, Llc |
Universial energy conditioning interposer with circuit architecture
|
|
US7321485B2
(en)
|
1997-04-08 |
2008-01-22 |
X2Y Attenuators, Llc |
Arrangement for energy conditioning
|
|
US6018448A
(en)
*
|
1997-04-08 |
2000-01-25 |
X2Y Attenuators, L.L.C. |
Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
|
|
US6650525B2
(en)
|
1997-04-08 |
2003-11-18 |
X2Y Attenuators, Llc |
Component carrier
|
|
US7110235B2
(en)
|
1997-04-08 |
2006-09-19 |
Xzy Altenuators, Llc |
Arrangement for energy conditioning
|
|
US7274549B2
(en)
|
2000-12-15 |
2007-09-25 |
X2Y Attenuators, Llc |
Energy pathway arrangements for energy conditioning
|
|
US6606011B2
(en)
|
1998-04-07 |
2003-08-12 |
X2Y Attenuators, Llc |
Energy conditioning circuit assembly
|
|
US6034533A
(en)
*
|
1997-06-10 |
2000-03-07 |
Tervo; Paul A. |
Low-current pogo probe card
|
|
US7427816B2
(en)
|
1998-04-07 |
2008-09-23 |
X2Y Attenuators, Llc |
Component carrier
|
|
EP1070389B1
(en)
|
1998-04-07 |
2007-12-05 |
X2Y Attenuators, L.L.C. |
Component carrier
|
|
US6256882B1
(en)
|
1998-07-14 |
2001-07-10 |
Cascade Microtech, Inc. |
Membrane probing system
|
|
US6538538B2
(en)
*
|
1999-02-25 |
2003-03-25 |
Formfactor, Inc. |
High frequency printed circuit board via
|
|
US6218910B1
(en)
*
|
1999-02-25 |
2001-04-17 |
Formfactor, Inc. |
High bandwidth passive integrated circuit tester probe card assembly
|
|
US6578264B1
(en)
*
|
1999-06-04 |
2003-06-17 |
Cascade Microtech, Inc. |
Method for constructing a membrane probe using a depression
|
|
JP2001202400A
(ja)
*
|
2000-01-21 |
2001-07-27 |
Nec Corp |
電源デカップリング回路生成システム及び電源デカップリング回路生成方法
|
|
US6838890B2
(en)
*
|
2000-02-25 |
2005-01-04 |
Cascade Microtech, Inc. |
Membrane probing system
|
|
US7113383B2
(en)
|
2000-04-28 |
2006-09-26 |
X2Y Attenuators, Llc |
Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
|
|
US6549389B2
(en)
|
2000-08-15 |
2003-04-15 |
X2Y Attenuators, Llc |
Electrode arrangement for circuit energy conditioning
|
|
US6646521B1
(en)
*
|
2000-09-15 |
2003-11-11 |
Hei, Inc. |
Connection for conducting high frequency signal between a circuit and a discrete electric component
|
|
US7193831B2
(en)
|
2000-10-17 |
2007-03-20 |
X2Y Attenuators, Llc |
Energy pathway arrangement
|
|
AU2002213356B2
(en)
|
2000-10-17 |
2005-03-10 |
X2Y Attenuators, Llc |
Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
|
|
DE20114544U1
(de)
|
2000-12-04 |
2002-02-21 |
Cascade Microtech, Inc., Beaverton, Oreg. |
Wafersonde
|
|
US6617943B1
(en)
|
2001-07-27 |
2003-09-09 |
Applied Micro Circuits Corporation |
Package substrate interconnect layout for providing bandpass/lowpass filtering
|
|
AU2002327490A1
(en)
|
2001-08-21 |
2003-06-30 |
Cascade Microtech, Inc. |
Membrane probing system
|
|
US6816031B1
(en)
|
2001-12-04 |
2004-11-09 |
Formfactor, Inc. |
Adjustable delay transmission line
|
|
US7640651B2
(en)
*
|
2003-12-31 |
2010-01-05 |
Microfabrica Inc. |
Fabrication process for co-fabricating multilayer probe array and a space transformer
|
|
US20060006888A1
(en)
*
|
2003-02-04 |
2006-01-12 |
Microfabrica Inc. |
Electrochemically fabricated microprobes
|
|
US7273812B2
(en)
*
|
2002-05-07 |
2007-09-25 |
Microfabrica Inc. |
Microprobe tips and methods for making
|
|
US7265565B2
(en)
|
2003-02-04 |
2007-09-04 |
Microfabrica Inc. |
Cantilever microprobes for contacting electronic components and methods for making such probes
|
|
US7363705B2
(en)
*
|
2003-02-04 |
2008-04-29 |
Microfabrica, Inc. |
Method of making a contact
|
|
US20060053625A1
(en)
*
|
2002-05-07 |
2006-03-16 |
Microfabrica Inc. |
Microprobe tips and methods for making
|
|
US7412767B2
(en)
*
|
2003-02-04 |
2008-08-19 |
Microfabrica, Inc. |
Microprobe tips and methods for making
|
|
US20060051948A1
(en)
*
|
2003-02-04 |
2006-03-09 |
Microfabrica Inc. |
Microprobe tips and methods for making
|
|
US7531077B2
(en)
|
2003-02-04 |
2009-05-12 |
Microfabrica Inc. |
Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
|
|
US20050104609A1
(en)
*
|
2003-02-04 |
2005-05-19 |
Microfabrica Inc. |
Microprobe tips and methods for making
|
|
US20060238209A1
(en)
*
|
2002-05-07 |
2006-10-26 |
Microfabrica Inc. |
Vertical microprobes for contacting electronic components and method for making such probes
|
|
US20050184748A1
(en)
*
|
2003-02-04 |
2005-08-25 |
Microfabrica Inc. |
Pin-type probes for contacting electronic circuits and methods for making such probes
|
|
EP1509776A4
(en)
|
2002-05-23 |
2010-08-18 |
Cascade Microtech Inc |
PROBE TO TEST ANY TESTING EQUIPMENT
|
|
US6724205B1
(en)
|
2002-11-13 |
2004-04-20 |
Cascade Microtech, Inc. |
Probe for combined signals
|
|
US6911739B1
(en)
|
2003-01-29 |
2005-06-28 |
Marvell International Ltd. |
Methods and apparatus for improving high frequency input/output performance
|
|
US7002220B1
(en)
|
2003-01-29 |
2006-02-21 |
Marvell International Ltd. |
ESD protection circuit
|
|
US7180718B2
(en)
*
|
2003-01-31 |
2007-02-20 |
X2Y Attenuators, Llc |
Shielded energy conditioner
|
|
US7567089B2
(en)
*
|
2003-02-04 |
2009-07-28 |
Microfabrica Inc. |
Two-part microprobes for contacting electronic components and methods for making such probes
|
|
US8613846B2
(en)
*
|
2003-02-04 |
2013-12-24 |
Microfabrica Inc. |
Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
US20080157793A1
(en)
*
|
2003-02-04 |
2008-07-03 |
Microfabrica Inc. |
Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
|
|
US10416192B2
(en)
|
2003-02-04 |
2019-09-17 |
Microfabrica Inc. |
Cantilever microprobes for contacting electronic components
|
|
US20080211524A1
(en)
*
|
2003-02-04 |
2008-09-04 |
Microfabrica Inc. |
Electrochemically Fabricated Microprobes
|
|
US9244101B2
(en)
*
|
2003-02-04 |
2016-01-26 |
University Of Southern California |
Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
|
|
EP1471575A1
(en)
*
|
2003-04-24 |
2004-10-27 |
Samsung Electronics Co., Ltd. |
Rf chip carrier having inductors provided therein and method of manufacturing the same
|
|
US9671429B2
(en)
|
2003-05-07 |
2017-06-06 |
University Of Southern California |
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
US7414505B2
(en)
|
2003-05-13 |
2008-08-19 |
Samsung Electronics Co., Ltd. |
High frequency inductor having low inductance and low inductance variation and method of manufacturing the same
|
|
US7057404B2
(en)
|
2003-05-23 |
2006-06-06 |
Sharp Laboratories Of America, Inc. |
Shielded probe for testing a device under test
|
|
US7440252B2
(en)
|
2003-05-29 |
2008-10-21 |
X2Y Attenuators, Llc |
Connector related structures including an energy conditioner
|
|
WO2006017078A2
(en)
*
|
2004-07-07 |
2006-02-16 |
Cascade Microtech, Inc. |
Probe head having a membrane suspended probe
|
|
WO2005015719A2
(en)
|
2003-07-21 |
2005-02-17 |
X2Y Attenuators, Llc |
Filter assembly
|
|
FR2860316B1
(fr)
*
|
2003-09-26 |
2006-05-19 |
Cit Alcatel |
Systeme de connexion de type bus, notamment pour fond de panier
|
|
WO2005065097A2
(en)
|
2003-12-22 |
2005-07-21 |
X2Y Attenuators, Llc |
Internally shielded energy conditioner
|
|
DE112004002554T5
(de)
|
2003-12-24 |
2006-11-23 |
Cascade Microtech, Inc., Beaverton |
Active wafer probe
|
|
US10641792B2
(en)
|
2003-12-31 |
2020-05-05 |
University Of Southern California |
Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
|
|
US20080108221A1
(en)
*
|
2003-12-31 |
2008-05-08 |
Microfabrica Inc. |
Microprobe Tips and Methods for Making
|
|
US7388424B2
(en)
|
2004-04-07 |
2008-06-17 |
Formfactor, Inc. |
Apparatus for providing a high frequency loop back with a DC path for a parametric test
|
|
US20060030179A1
(en)
*
|
2004-08-05 |
2006-02-09 |
Palo Alto Research Center, Incorporated |
Transmission-line spring structure
|
|
DE202005021435U1
(de)
|
2004-09-13 |
2008-02-28 |
Cascade Microtech, Inc., Beaverton |
Doppelseitige Prüfaufbauten
|
|
US7656172B2
(en)
|
2005-01-31 |
2010-02-02 |
Cascade Microtech, Inc. |
System for testing semiconductors
|
|
US7535247B2
(en)
|
2005-01-31 |
2009-05-19 |
Cascade Microtech, Inc. |
Interface for testing semiconductors
|
|
JP2008535207A
(ja)
|
2005-03-01 |
2008-08-28 |
エックストゥーワイ アテニュエイターズ,エルエルシー |
共平面導体を有する調整器
|
|
WO2006093831A2
(en)
|
2005-03-01 |
2006-09-08 |
X2Y Attenuators, Llc |
Energy conditioner with tied through electrodes
|
|
US7586728B2
(en)
|
2005-03-14 |
2009-09-08 |
X2Y Attenuators, Llc |
Conditioner with coplanar conductors
|
|
US20060256489A1
(en)
*
|
2005-05-10 |
2006-11-16 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
ESD protection circuits with impedance matching for radio-frequency applications
|
|
US7456655B1
(en)
|
2005-05-16 |
2008-11-25 |
Marvell Israel (Misl) Ltd. |
System and process for overcoming wire-bond originated cross-talk
|
|
US7449899B2
(en)
|
2005-06-08 |
2008-11-11 |
Cascade Microtech, Inc. |
Probe for high frequency signals
|
|
WO2006137979A2
(en)
|
2005-06-13 |
2006-12-28 |
Cascade Microtech, Inc. |
Wideband active-passive differential signal probe
|
|
WO2007058910A2
(en)
*
|
2005-11-10 |
2007-05-24 |
Kathleen Lowe Melde |
Apparatus and method of selecting components for a reconfigurable impedance match circuit
|
|
CN101395683A
(zh)
|
2006-03-07 |
2009-03-25 |
X2Y衰减器有限公司 |
能量调节装置结构
|
|
DE112007001399T5
(de)
|
2006-06-09 |
2009-05-07 |
Cascade Microtech, Inc., Beaverton |
Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
|
|
US7764072B2
(en)
|
2006-06-12 |
2010-07-27 |
Cascade Microtech, Inc. |
Differential signal probing system
|
|
US7403028B2
(en)
|
2006-06-12 |
2008-07-22 |
Cascade Microtech, Inc. |
Test structure and probe for differential signals
|
|
US7723999B2
(en)
|
2006-06-12 |
2010-05-25 |
Cascade Microtech, Inc. |
Calibration structures for differential signal probing
|
|
US7443186B2
(en)
|
2006-06-12 |
2008-10-28 |
Cascade Microtech, Inc. |
On-wafer test structures for differential signals
|
|
KR100816758B1
(ko)
|
2006-11-07 |
2008-03-25 |
삼성전자주식회사 |
반사파억제를 통한 신호특성이 향상된 멀티 칩 패키지 모듈을 테스트하는 테스트 장치
|
|
US7876114B2
(en)
|
2007-08-08 |
2011-01-25 |
Cascade Microtech, Inc. |
Differential waveguide probe
|
|
CN101897095A
(zh)
*
|
2007-12-11 |
2010-11-24 |
加利福尼亚微型装置公司 |
用于保护高速接口的阻抗补偿esd电路及使用其的方法
|
|
US7888957B2
(en)
|
2008-10-06 |
2011-02-15 |
Cascade Microtech, Inc. |
Probing apparatus with impedance optimized interface
|
|
US8410806B2
(en)
|
2008-11-21 |
2013-04-02 |
Cascade Microtech, Inc. |
Replaceable coupon for a probing apparatus
|
|
US8242384B2
(en)
|
2009-09-30 |
2012-08-14 |
International Business Machines Corporation |
Through hole-vias in multi-layer printed circuit boards
|
|
US8432027B2
(en)
*
|
2009-11-11 |
2013-04-30 |
International Business Machines Corporation |
Integrated circuit die stacks with rotationally symmetric vias
|
|
US8258619B2
(en)
|
2009-11-12 |
2012-09-04 |
International Business Machines Corporation |
Integrated circuit die stacks with translationally compatible vias
|
|
US8310841B2
(en)
|
2009-11-12 |
2012-11-13 |
International Business Machines Corporation |
Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same
|
|
US8315068B2
(en)
|
2009-11-12 |
2012-11-20 |
International Business Machines Corporation |
Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
|
|
US9646947B2
(en)
*
|
2009-12-22 |
2017-05-09 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
Integrated circuit with inductive bond wires
|
|
JP6128756B2
(ja)
*
|
2012-05-30 |
2017-05-17 |
キヤノン株式会社 |
半導体パッケージ、積層型半導体パッケージ及びプリント回路板
|
|
US10154581B2
(en)
|
2017-02-09 |
2018-12-11 |
Cray Inc. |
Method for impedance compensation in printed circuit boards
|
|
US10116473B1
(en)
*
|
2017-04-27 |
2018-10-30 |
Cirrus Logic, Inc. |
Controlling noise transfer function of signal path to reduce charge pump noise
|
|
US11831290B2
(en)
|
2017-07-25 |
2023-11-28 |
Wjlp Company Inc. |
Inductive-capacitive filters and associated systems and methods
|
|
JP7231629B2
(ja)
*
|
2017-07-25 |
2023-03-01 |
ダブリュジェイエルピー カンパニー インコーポレイティド |
誘導性-容量性フィルタおよび関連するシステムおよび方法
|
|
EP3788644A4
(en)
|
2018-05-03 |
2023-03-01 |
L. Pierre De Rochemont |
HIGH-FAST/LOW-PERFORMANCE SERVER SYSTEMS AND SERVER NETWORKS
|
|
CA3102806A1
(en)
|
2018-06-05 |
2019-12-12 |
L. Pierre De Rochemont |
Module with high peak bandwidth i/o channels
|
|
KR102678311B1
(ko)
*
|
2018-08-30 |
2024-06-25 |
삼성전자주식회사 |
패키지 볼을 갖는 반도체 패키지를 포함하는 전자 소자
|
|
US11262383B1
(en)
|
2018-09-26 |
2022-03-01 |
Microfabrica Inc. |
Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
|
|
US12078657B2
(en)
|
2019-12-31 |
2024-09-03 |
Microfabrica Inc. |
Compliant pin probes with extension springs, methods for making, and methods for using
|
|
JP7214039B2
(ja)
|
2020-03-26 |
2023-01-27 |
三菱電機株式会社 |
高周波フィルタ
|
|
CN112290170B
(zh)
*
|
2020-09-30 |
2021-12-28 |
中国航空工业集团公司雷华电子技术研究所 |
一种具有可调谐电路的射频垂直过渡结构
|
|
US12355127B2
(en)
|
2022-12-01 |
2025-07-08 |
International Business Machines Corporation |
Field-adjustable flex circuit transmission line filters
|