JP2002538464A5 - - Google Patents

Download PDF

Info

Publication number
JP2002538464A5
JP2002538464A5 JP2000602648A JP2000602648A JP2002538464A5 JP 2002538464 A5 JP2002538464 A5 JP 2002538464A5 JP 2000602648 A JP2000602648 A JP 2000602648A JP 2000602648 A JP2000602648 A JP 2000602648A JP 2002538464 A5 JP2002538464 A5 JP 2002538464A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000602648A
Other versions
JP2002538464A (ja
JP4571749B2 (ja
Filing date
Publication date
Priority claimed from US09/260,460 external-priority patent/US6452411B1/en
Application filed filed Critical
Publication of JP2002538464A publication Critical patent/JP2002538464A/ja
Publication of JP2002538464A5 publication Critical patent/JP2002538464A5/ja
Application granted granted Critical
Publication of JP4571749B2 publication Critical patent/JP4571749B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000602648A 1999-03-01 2000-02-24 既知の良品デバイスを使用して期待する応答を生成するための集積回路デバイスの効率的な同時テスト Expired - Fee Related JP4571749B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/260,460 1999-03-01
US09/260,460 US6452411B1 (en) 1999-03-01 1999-03-01 Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses
PCT/US2000/004864 WO2000052487A1 (en) 1999-03-01 2000-02-24 Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses

Publications (3)

Publication Number Publication Date
JP2002538464A JP2002538464A (ja) 2002-11-12
JP2002538464A5 true JP2002538464A5 (ja) 2007-04-12
JP4571749B2 JP4571749B2 (ja) 2010-10-27

Family

ID=22989261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000602648A Expired - Fee Related JP4571749B2 (ja) 1999-03-01 2000-02-24 既知の良品デバイスを使用して期待する応答を生成するための集積回路デバイスの効率的な同時テスト

Country Status (8)

Country Link
US (2) US6452411B1 (ja)
EP (1) EP1159629B1 (ja)
JP (1) JP4571749B2 (ja)
KR (1) KR100681363B1 (ja)
AU (1) AU3245800A (ja)
DE (1) DE60040212D1 (ja)
TW (1) TW451379B (ja)
WO (1) WO2000052487A1 (ja)

Families Citing this family (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) * 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5729150A (en) * 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US7350108B1 (en) * 1999-09-10 2008-03-25 International Business Machines Corporation Test system for integrated circuits
JP4444419B2 (ja) * 1999-11-10 2010-03-31 東京エレクトロン株式会社 データ通信方法及びデータ通信システム
US6615379B1 (en) * 1999-12-08 2003-09-02 Intel Corporation Method and apparatus for testing a logic device
US6801869B2 (en) * 2000-02-22 2004-10-05 Mccord Don Method and system for wafer and device-level testing of an integrated circuit
US6603323B1 (en) 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
WO2002025296A2 (en) * 2000-09-22 2002-03-28 Don Mccord Method and system for wafer and device-level testing of an integrated circuit
KR100358919B1 (ko) * 2000-11-18 2002-10-31 주식회사 메모리앤테스팅 마스터-슬레이브방식을 이용한 반도체칩 검사장치
US6629048B1 (en) * 2000-11-20 2003-09-30 Tektronix, Inc. Measurement test instrument and associated voltage management system for accessory device
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
TW494516B (en) * 2001-03-14 2002-07-11 Winbond Electronics Corp Semiconductor multi-die testing system with automatic identification functions
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US20030070126A1 (en) * 2001-09-14 2003-04-10 Werner Carl W. Built-in self-testing of multilevel signal interfaces
US7162672B2 (en) 2001-09-14 2007-01-09 Rambus Inc Multilevel signal interface testing with binary test apparatus by emulation of multilevel signals
DE60216484T2 (de) * 2001-09-14 2007-08-23 Rambus Inc., Los Altos Mehrpegelsignalschnittstellenprüfung mit binärer prüfvorrichtung durch emulation von mehrpegelsignalen
US6880118B2 (en) * 2001-10-25 2005-04-12 Sun Microsystems, Inc. System and method for testing operational transmissions of an integrated circuit
US6848063B2 (en) * 2001-11-20 2005-01-25 Hewlett-Packard Development Company, L.P. System and method for scrubbing errors in very large memories
US6961885B2 (en) * 2001-11-26 2005-11-01 Ati Technologies, Inc. System and method for testing video devices using a test fixture
US6880116B2 (en) * 2001-11-27 2005-04-12 Ati Technologies, Inc. System for testing multiple devices on a single system and method thereof
US7085980B2 (en) * 2002-05-02 2006-08-01 International Business Machines Corporation Method and apparatus for determining the failing operation of a device-under-test
US6847218B1 (en) 2002-05-13 2005-01-25 Cypress Semiconductor Corporation Probe card with an adapter layer for testing integrated circuits
US6759865B1 (en) * 2002-07-30 2004-07-06 Cypress Semiconductor Corporation Array of dice for testing integrated circuits
KR100487946B1 (ko) * 2002-08-29 2005-05-06 삼성전자주식회사 반도체 테스트 시스템 및 이 시스템의 테스트 방법
US7119567B2 (en) * 2002-09-12 2006-10-10 Infineon Technologies North America Corp. System and method for testing one or more dies on a semiconductor wafer
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7131046B2 (en) * 2002-12-03 2006-10-31 Verigy Ipco System and method for testing circuitry using an externally generated signature
JP2004249817A (ja) * 2003-02-19 2004-09-09 Denso Corp 電子制御装置及び複数の電子制御装置からなる制御システム
US7112975B1 (en) * 2003-03-26 2006-09-26 Cypress Semiconductor Corporation Advanced probe card and method of fabricating same
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE10338079B4 (de) * 2003-08-19 2007-05-16 Infineon Technologies Ag Testanordnung zum Testen von Halbleiterschaltungschips
US7089439B1 (en) * 2003-09-03 2006-08-08 T-Ram, Inc. Architecture and method for output clock generation on a high speed memory device
JP4332392B2 (ja) * 2003-09-12 2009-09-16 株式会社アドバンテスト 試験装置
DE10345977B4 (de) * 2003-10-02 2013-07-11 Qimonda Ag Verfahren zum Testen von zu testenden Schaltungseinheiten mittels Mehrheitsentscheidungen und Testvorrichtung zur Durchführung des Verfahrens
US7171586B1 (en) * 2003-12-17 2007-01-30 Sun Microsystems, Inc. Method and apparatus for identifying mechanisms responsible for “no-trouble-found” (NTF) events in computer systems
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US7332921B2 (en) * 2004-03-26 2008-02-19 Cypress Semiconductor Corporation Probe card and method for constructing same
DE102004021267B4 (de) * 2004-04-30 2008-04-17 Infineon Technologies Ag Verfahren zum Testen eines Speicherbausteins und Prüfanordnung
US7348887B1 (en) 2004-06-15 2008-03-25 Eigent Technologies, Llc RFIDs embedded into semiconductors
US7913002B2 (en) * 2004-08-20 2011-03-22 Advantest Corporation Test apparatus, configuration method, and device interface
KR20070058522A (ko) 2004-09-13 2007-06-08 캐스케이드 마이크로테크 인코포레이티드 양측 프루빙 구조
US7627798B2 (en) * 2004-10-08 2009-12-01 Kabushiki Kaisha Toshiba Systems and methods for circuit testing using LBIST
US7330038B2 (en) * 2004-12-14 2008-02-12 Silicon Light Machines Corporation Interleaved MEMS-based probes for testing integrated circuits
KR100688517B1 (ko) * 2005-01-11 2007-03-02 삼성전자주식회사 전압공급유닛 분할을 통한 반도체 소자의 병렬검사 방법
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7712674B1 (en) 2005-02-22 2010-05-11 Eigent Technologies Llc RFID devices for verification of correctness, reliability, functionality and security
DE102005037236A1 (de) * 2005-08-08 2007-02-15 Robert Bosch Gmbh Vorrichtung und Verfahren zur Konfiguration einer Halbleiterschaltung
US7539912B2 (en) 2005-12-15 2009-05-26 King Tiger Technology, Inc. Method and apparatus for testing a fully buffered memory module
US7532492B2 (en) * 2005-12-20 2009-05-12 Tektronix, Inc. Host controlled voltage input system for an accessory device
JP4571076B2 (ja) * 2006-01-23 2010-10-27 富士通セミコンダクター株式会社 半導体装置の検査装置
US7906982B1 (en) 2006-02-28 2011-03-15 Cypress Semiconductor Corporation Interface apparatus and methods of testing integrated circuits using the same
CN101030160B (zh) * 2006-03-02 2013-03-20 鸿富锦精密工业（深圳）有限公司 统一串行接口测试命令的测试装置及其测试方法
US7669090B2 (en) * 2006-05-18 2010-02-23 Kabushiki Kaisha Toshiba Apparatus and method for verifying custom IC
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
KR20090036144A (ko) * 2006-08-14 2009-04-13 가부시키가이샤 어드밴티스트 시험 장치 및 시험 방법
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7890822B2 (en) * 2006-09-29 2011-02-15 Teradyne, Inc. Tester input/output sharing
WO2008056666A1 (fr) * 2006-11-10 2008-05-15 Nec Corporation Circuit d'essai, méthode et dispositif semi-conducteur
JP5446268B2 (ja) * 2006-11-10 2014-03-19 日本電気株式会社 並列テスト回路と方法並びに半導体装置
US20080133165A1 (en) * 2006-12-04 2008-06-05 Advantest Corporation Test apparatus and device interface
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7669100B2 (en) * 2007-03-08 2010-02-23 Freescale Semiconductor, Inc. System and method for testing and providing an integrated circuit having multiple modules or submodules
US7610538B2 (en) * 2007-04-13 2009-10-27 Advantest Corporation Test apparatus and performance board for diagnosis
US7620861B2 (en) * 2007-05-31 2009-11-17 Kingtiger Technology (Canada) Inc. Method and apparatus for testing integrated circuits by employing test vector patterns that satisfy passband requirements imposed by communication channels
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7757144B2 (en) * 2007-11-01 2010-07-13 Kingtiger Technology (Canada) Inc. System and method for testing integrated circuit modules comprising a plurality of integrated circuit devices
US20090119542A1 (en) * 2007-11-05 2009-05-07 Advantest Corporation System, method, and program product for simulating test equipment
US8022718B2 (en) * 2008-02-29 2011-09-20 Lam Research Corporation Method for inspecting electrostatic chucks with Kelvin probe analysis
KR101138199B1 (ko) * 2008-06-02 2012-05-10 가부시키가이샤 어드밴티스트 시험용 웨이퍼 유닛 및 시험 시스템
US7848899B2 (en) * 2008-06-09 2010-12-07 Kingtiger Technology (Canada) Inc. Systems and methods for testing integrated circuit devices
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US7948254B2 (en) 2008-11-20 2011-05-24 Litepoint Corporation Digital communications test system for multiple input, multiple output (MIMO) systems
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP5414292B2 (ja) * 2009-01-29 2014-02-12 ルネサスエレクトロニクス株式会社 不良解析装置と方法及びプログラム
US8356215B2 (en) * 2010-01-19 2013-01-15 Kingtiger Technology (Canada) Inc. Testing apparatus and method for analyzing a memory module operating within an application system
CN103003708B (zh) * 2010-04-14 2015-01-07 爱德万测试(新加坡)私人有限公司 用于测试多个被测器件的装置和方法
US8918686B2 (en) 2010-08-18 2014-12-23 Kingtiger Technology (Canada) Inc. Determining data valid windows in a system and method for testing an integrated circuit device
US8560903B2 (en) 2010-08-31 2013-10-15 Cisco Technology, Inc. System and method for executing functional scanning in an integrated circuit environment
CN102466775B (zh) * 2010-11-17 2014-11-05 益明精密科技有限公司 多功能可变换模块测试装置
US8560474B2 (en) 2011-03-07 2013-10-15 Cisco Technology, Inc. System and method for providing adaptive manufacturing diagnoses in a circuit board environment
US9003256B2 (en) 2011-09-06 2015-04-07 Kingtiger Technology (Canada) Inc. System and method for testing integrated circuits by determining the solid timing window
US10776233B2 (en) 2011-10-28 2020-09-15 Teradyne, Inc. Programmable test instrument
US9759772B2 (en) 2011-10-28 2017-09-12 Teradyne, Inc. Programmable test instrument
US8724408B2 (en) 2011-11-29 2014-05-13 Kingtiger Technology (Canada) Inc. Systems and methods for testing and assembling memory modules
US9117552B2 (en) 2012-08-28 2015-08-25 Kingtiger Technology(Canada), Inc. Systems and methods for testing memory
US9470753B2 (en) 2012-11-07 2016-10-18 Cascade Microtech, Inc. Systems and methods for testing electronic devices that include low power output drivers
US9678148B2 (en) * 2014-06-06 2017-06-13 Advantest Corporation Customizable tester having testing modules for automated testing of devices
US9618574B2 (en) 2014-06-06 2017-04-11 Advantest Corporation Controlling automated testing of devices
US9618570B2 (en) * 2014-06-06 2017-04-11 Advantest Corporation Multi-configurable testing module for automated testing of a device
US9933454B2 (en) 2014-06-06 2018-04-03 Advantest Corporation Universal test floor system
US9638749B2 (en) 2014-06-06 2017-05-02 Advantest Corporation Supporting automated testing of devices in a test floor system
WO2016173619A1 (en) 2015-04-27 2016-11-03 Advantest Corporation Switch circuit, method for operating a switch circuit and an automated test equipment
KR20160138766A (ko) * 2015-05-26 2016-12-06 에스케이하이닉스 주식회사 반도체 장치
WO2016188572A1 (en) 2015-05-27 2016-12-01 Advantest Corporation Automated test equipment for combined signals
US9858177B2 (en) 2015-10-30 2018-01-02 International Business Machines Corporation Automated test generation for multi-interface enterprise virtualization management environment
US10572373B2 (en) 2017-04-20 2020-02-25 International Business Machines Corporation Automated test generation for multi-interface and multi-platform enterprise virtualization management environment
KR102471500B1 (ko) * 2018-03-12 2022-11-28 에스케이하이닉스 주식회사 반도체 장치 및 이를 포함하는 테스트 시스템
US10794955B2 (en) * 2018-10-16 2020-10-06 Optimal Plus Ltd Methods and systems for testing a tester
WO2020152231A1 (en) * 2019-01-22 2020-07-30 Advantest Corporation Automated test equipment for testing one or more devices under test, method for automated testing of one or more devices under test, and computer program using a buffer memory
CN116948923B (zh) * 2023-09-21 2023-12-08 内蒙古农业大学 一种可实现生物结皮-植物立体防护模式的生物引发剂

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1003048B (it) * 1972-03-17 1976-06-10 Honeywell Inf Systems Dispositivo per verificare il cor retto comportamento di unita circui tali integrate sequenziali
US4370746A (en) 1980-12-24 1983-01-25 International Business Machines Corporation Memory address selector
US4455654B1 (en) 1981-06-05 1991-04-30 Test apparatus for electronic assemblies employing a microprocessor
US4773028A (en) * 1984-10-01 1988-09-20 Tektronix, Inc. Method and apparatus for improved monitoring and detection of improper device operation
JPS6199876A (ja) 1984-10-22 1986-05-17 Nec Corp Ｉｃテスタ−
US4942576A (en) 1988-10-24 1990-07-17 Micron Technology, Inc. Badbit counter for memory testing
US5070297A (en) 1990-06-04 1991-12-03 Texas Instruments Incorporated Full wafer integrated circuit testing device
FI91356C (fi) 1990-07-11 1994-06-27 Instrumentarium Oy Verenpainemittauksessa käytettävän mansetin paineen rajoittaminen
JP2773483B2 (ja) * 1991-09-24 1998-07-09 三菱電機株式会社 半導体試験装置
US5357523A (en) 1991-12-18 1994-10-18 International Business Machines Corporation Memory testing system with algorithmic test data generation
US5442282A (en) 1992-07-02 1995-08-15 Lsi Logic Corporation Testing and exercising individual, unsingulated dies on a wafer
US5648661A (en) 1992-07-02 1997-07-15 Lsi Logic Corporation Integrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the dies
JPH0627195A (ja) 1992-07-08 1994-02-04 Mitsubishi Electric Corp Ｌｓｉ試験装置
US5243274A (en) 1992-08-07 1993-09-07 Westinghouse Electric Corp. Asic tester
US5363038A (en) 1992-08-12 1994-11-08 Fujitsu Limited Method and apparatus for testing an unpopulated chip carrier using a module test card
US5477160A (en) 1992-08-12 1995-12-19 Fujitsu Limited Module test card
KR970010656B1 (ko) 1992-09-01 1997-06-30 마쯔시다 덴기 산교 가부시끼가이샤 반도체 테스트 장치, 반도체 테스트 회로칩 및 프로브 카드
US6064213A (en) 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6577148B1 (en) 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5682472A (en) 1995-03-17 1997-10-28 Aehr Test Systems Method and system for testing memory programming devices
US5506499A (en) 1995-06-05 1996-04-09 Neomagic Corp. Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad
JP2737774B2 (ja) * 1996-03-15 1998-04-08 日本電気株式会社 ウェハテスタ
US5839100A (en) 1996-04-22 1998-11-17 Wegener; Albert William Lossless and loss-limited compression of sampled data signals
US5689515A (en) 1996-04-26 1997-11-18 Teradyne, Inc. High speed serial data pin for automatic test equipment
US5995915A (en) 1997-01-29 1999-11-30 Advanced Micro Devices, Inc. Method and apparatus for the functional verification of digital electronic systems
US5923178A (en) 1997-04-17 1999-07-13 Cerprobe Corporation Probe assembly and method for switchable multi-DUT testing of integrated circuit wafers
US5910895A (en) 1997-06-13 1999-06-08 Teradyne, Inc. Low cost, easy to use automatic test system software
US5995424A (en) 1997-07-16 1999-11-30 Tanisys Technology, Inc. Synchronous memory test system
US5794175A (en) 1997-09-09 1998-08-11 Teradyne, Inc. Low cost, highly parallel memory tester
US6064948A (en) 1998-03-02 2000-05-16 Tanisys Technology, Inc. Tester systems
US6246250B1 (en) 1998-05-11 2001-06-12 Micron Technology, Inc. Probe card having on-board multiplex circuitry for expanding tester resources
US6275962B1 (en) 1998-10-23 2001-08-14 Teradyne, Inc. Remote test module for automatic test equipment
US6324665B1 (en) * 1998-11-03 2001-11-27 Agilent Technologies, Inc. Event based fault diagnosis
US6256760B1 (en) 1998-11-13 2001-07-03 Nortel Networks Limited Automatic test equipment scan test enhancement

Similar Documents

Publication Publication Date Title
BE2016C059I2 (ja)
BE2014C019I2 (ja)
BE2013C048I2 (ja)
BE2009C057I2 (ja)
BRPI0110940B8 (ja)
AR028236A3 (ja)
BE2010C040I2 (ja)
JP2003513728A5 (ja)
BRPI0113372A8 (ja)
JP2002165466A5 (ja)
CH694022C1 (ja)
BY5768C1 (ja)
BRPI0000763B8 (ja)
CN3134731S (ja)
CN3139852S (ja)
AU2000278679A8 (ja)
AU2000278560A8 (ja)
AU2000276986A8 (ja)
AU2000271150A8 (ja)
BY7030C1 (ja)
AU2000270908A8 (ja)
CN3133951S (ja)
CN3134543S (ja)
AU2000266391A8 (ja)
CN3134893S (ja)