JP2002523909A5 - - Google Patents

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Publication number
JP2002523909A5
JP2002523909A5 JP2000567891A JP2000567891A JP2002523909A5 JP 2002523909 A5 JP2002523909 A5 JP 2002523909A5 JP 2000567891 A JP2000567891 A JP 2000567891A JP 2000567891 A JP2000567891 A JP 2000567891A JP 2002523909 A5 JP2002523909 A5 JP 2002523909A5
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JP
Japan
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JP2000567891A
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JP2002523909A (ja
JP4971541B2 (ja
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Priority claimed from US09/140,614 external-priority patent/US6133550A/en
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Publication of JP2002523909A publication Critical patent/JP2002523909A/ja
Publication of JP2002523909A5 publication Critical patent/JP2002523909A5/ja
Application granted granted Critical
Publication of JP4971541B2 publication Critical patent/JP4971541B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000567891A 1998-08-26 1999-08-20 半導体基板の熱処理のための方法及び装置 Expired - Fee Related JP4971541B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/140,614 1998-08-26
US09/140,614 US6133550A (en) 1996-03-22 1998-08-26 Method and apparatus for thermal processing of semiconductor substrates
PCT/US1999/019019 WO2000012945A1 (en) 1998-08-26 1999-08-20 Method and apparatus for thermal processing of semiconductor substrates

Publications (3)

Publication Number Publication Date
JP2002523909A JP2002523909A (ja) 2002-07-30
JP2002523909A5 true JP2002523909A5 (ja) 2011-02-03
JP4971541B2 JP4971541B2 (ja) 2012-07-11

Family

ID=22492034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000567891A Expired - Fee Related JP4971541B2 (ja) 1998-08-26 1999-08-20 半導体基板の熱処理のための方法及び装置

Country Status (6)

Country Link
US (2) US6133550A (ja)
EP (1) EP1117968A4 (ja)
JP (1) JP4971541B2 (ja)
KR (1) KR100692496B1 (ja)
TW (1) TW428250B (ja)
WO (1) WO2000012945A1 (ja)

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