JP2002353619A5 - - Google Patents
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- Publication number
- JP2002353619A5 JP2002353619A5 JP2002076226A JP2002076226A JP2002353619A5 JP 2002353619 A5 JP2002353619 A5 JP 2002353619A5 JP 2002076226 A JP2002076226 A JP 2002076226A JP 2002076226 A JP2002076226 A JP 2002076226A JP 2002353619 A5 JP2002353619 A5 JP 2002353619A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- copper foil
- adhesive layer
- multilayer wiring
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 28
- 229920005989 resin Polymers 0.000 claims 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 25
- 239000011889 copper foil Substances 0.000 claims 24
- 239000012790 adhesive layer Substances 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 11
- 239000000463 material Substances 0.000 claims 10
- 239000010410 layer Substances 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 3
- 238000007650 screen-printing Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002076226A JP2002353619A (ja) | 2001-03-23 | 2002-03-19 | 多層配線板、多層配線用基材及びその製造方法 |
| TW91105644A TW536926B (en) | 2001-03-23 | 2002-03-22 | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| US10/102,628 US6831236B2 (en) | 2001-03-23 | 2002-03-22 | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| KR1020020015757A KR100573999B1 (ko) | 2001-03-23 | 2002-03-22 | 다층 배선판, 다층 배선판용 기재 및 그 제조 방법 |
| CNB021078718A CN100471357C (zh) | 2001-03-23 | 2002-03-25 | 多层线路板组件,多层线路板组件单元及其制造方法 |
| US10/920,185 US6914199B2 (en) | 2001-03-23 | 2004-08-18 | Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-85224 | 2001-03-23 | ||
| JP2001085224 | 2001-03-23 | ||
| JP2002076226A JP2002353619A (ja) | 2001-03-23 | 2002-03-19 | 多層配線板、多層配線用基材及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002353619A JP2002353619A (ja) | 2002-12-06 |
| JP2002353619A5 true JP2002353619A5 (enrdf_load_stackoverflow) | 2005-09-08 |
Family
ID=26611921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002076226A Pending JP2002353619A (ja) | 2001-03-23 | 2002-03-19 | 多層配線板、多層配線用基材及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002353619A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4821276B2 (ja) * | 2005-11-10 | 2011-11-24 | 住友電気工業株式会社 | 多層プリント配線板の製造方法及び多層プリント配線板 |
| JP4587974B2 (ja) * | 2006-02-21 | 2010-11-24 | 新日鐵化学株式会社 | 多層プリント配線板の製造方法 |
| KR101262135B1 (ko) | 2006-02-21 | 2013-05-14 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 다층 프린트 배선판 및 그 제조방법 |
| JP5151265B2 (ja) * | 2007-06-14 | 2013-02-27 | 日立電線株式会社 | 多層配線基板及び多層配線基板の製造方法 |
| JP5979516B2 (ja) * | 2015-02-18 | 2016-08-24 | パナソニックIpマネジメント株式会社 | プリント配線板及びその製造方法 |
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2002
- 2002-03-19 JP JP2002076226A patent/JP2002353619A/ja active Pending