JP2002290027A - 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 - Google Patents

電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置

Info

Publication number
JP2002290027A
JP2002290027A JP2001091914A JP2001091914A JP2002290027A JP 2002290027 A JP2002290027 A JP 2002290027A JP 2001091914 A JP2001091914 A JP 2001091914A JP 2001091914 A JP2001091914 A JP 2001091914A JP 2002290027 A JP2002290027 A JP 2002290027A
Authority
JP
Japan
Prior art keywords
wiring board
temperature
manufacturing
circuit module
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001091914A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002290027A5 (enExample
Inventor
Ikuya Miyazawa
郁也 宮沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2001091914A priority Critical patent/JP2002290027A/ja
Priority to US10/079,432 priority patent/US6730173B2/en
Priority to TW091104039A priority patent/TW552833B/zh
Publication of JP2002290027A publication Critical patent/JP2002290027A/ja
Publication of JP2002290027A5 publication Critical patent/JP2002290027A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP2001091914A 2001-03-28 2001-03-28 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 Withdrawn JP2002290027A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001091914A JP2002290027A (ja) 2001-03-28 2001-03-28 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
US10/079,432 US6730173B2 (en) 2001-03-28 2002-02-22 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
TW091104039A TW552833B (en) 2001-03-28 2002-03-05 Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001091914A JP2002290027A (ja) 2001-03-28 2001-03-28 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置

Publications (2)

Publication Number Publication Date
JP2002290027A true JP2002290027A (ja) 2002-10-04
JP2002290027A5 JP2002290027A5 (enExample) 2004-11-25

Family

ID=18946463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001091914A Withdrawn JP2002290027A (ja) 2001-03-28 2001-03-28 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置

Country Status (3)

Country Link
US (1) US6730173B2 (enExample)
JP (1) JP2002290027A (enExample)
TW (1) TW552833B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197632A (ja) * 2013-03-29 2014-10-16 株式会社デンソー 基板加熱装置及びはんだ付装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3867768B2 (ja) * 2001-03-16 2007-01-10 セイコーエプソン株式会社 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
US7098534B2 (en) * 2004-03-31 2006-08-29 Intel Corporation Sacrificial component
JP2006179817A (ja) * 2004-12-24 2006-07-06 Tekuto:Kk 電子部品の製造方法及び電子部品の製造装置
KR101739752B1 (ko) * 2010-11-05 2017-05-26 삼성전자 주식회사 와이어 본딩 장치 및 이를 이용한 와이어 본딩 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604611A (en) * 1969-01-07 1971-09-14 Dee Electric Co Soldering apparatus
JPS6186069A (ja) * 1984-10-02 1986-05-01 Tamura Seisakusho Co Ltd 自動はんだ付けシステムの制御装置
EP0280022A1 (de) * 1987-01-28 1988-08-31 Epm Ag Verfahren und Anlage zum Löten von bestückten Leiterplatten
JPH06292964A (ja) 1992-07-22 1994-10-21 A Tec Tekutoron Kk 自動半田付け装置
JP3162827B2 (ja) 1992-09-18 2001-05-08 三洋電機株式会社 温度制御装置
US5439160A (en) 1993-03-31 1995-08-08 Siemens Corporate Research, Inc. Method and apparatus for obtaining reflow oven settings for soldering a PCB
JP3390268B2 (ja) 1994-10-18 2003-03-24 日本電熱計器株式会社 はんだ付け装置
US5560537A (en) * 1995-04-11 1996-10-01 Vlt Corporation Automatic soldering
JP2002204060A (ja) 2001-01-04 2002-07-19 Matsushita Electric Ind Co Ltd はんだ付け方法およびフローはんだ付け装置
JP3867768B2 (ja) * 2001-03-16 2007-01-10 セイコーエプソン株式会社 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014197632A (ja) * 2013-03-29 2014-10-16 株式会社デンソー 基板加熱装置及びはんだ付装置

Also Published As

Publication number Publication date
US6730173B2 (en) 2004-05-04
US20020182842A1 (en) 2002-12-05
TW552833B (en) 2003-09-11

Similar Documents

Publication Publication Date Title
JP2002290027A (ja) 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
CN100405532C (zh) 半导体部件的钎焊方法及半导体部件的安装构造
JP3867768B2 (ja) ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
JP2009231415A (ja) リフロー半田付け方法及びその装置
JP2002280721A5 (enExample)
KR102017202B1 (ko) Pcb기판 부품의 리드핀 합선을 방지하는 납땜장치
JP2004106061A (ja) プリント基板ユニットの製造方法ならびにはんだ付け装置
JP2002290026A (ja) 電子回路モジュール及びその製造方法
JP4045019B2 (ja) 半田付け方法
JP2002270987A (ja) 電子部品、これを備えた配線基板、及びはんだ付け方法、並びにはんだ付け装置
JP2001320163A (ja) リフロー装置およびその基板加熱方法
JP2007299816A (ja) 電子部品実装基板及び電子部品実装基板の製造方法
JP2001326454A (ja) 半田付け方法及び装置
JP2000124593A (ja) リフロー装置およびリフロー方法
JP2597695Y2 (ja) リフロー炉
JP2791158B2 (ja) 加熱装置
JP3171179B2 (ja) リフロー装置とリフロー装置内の温度制御方法
JP2001085834A (ja) リフロー半田付け方法とそれを用いた部品実装システム
CN121174407A (zh) 回流焊接方法和电子电路板组件系统
JP2002185121A (ja) プリント配線板のリフロー方法およびリフロー炉
JP2000332404A (ja) リフロー装置
KR100658901B1 (ko) 반도체패키지 실장장치 및 그에 의한 실장방법
JPH11186707A5 (enExample)
JP2003304037A (ja) プリント基板およびプリント基板ユニットの製造方法
JP2005129572A (ja) はんだ付け装置及び方法

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20051220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060816

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20061013