TW552833B - Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module - Google Patents
Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module Download PDFInfo
- Publication number
- TW552833B TW552833B TW091104039A TW91104039A TW552833B TW 552833 B TW552833 B TW 552833B TW 091104039 A TW091104039 A TW 091104039A TW 91104039 A TW91104039 A TW 91104039A TW 552833 B TW552833 B TW 552833B
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- wiring substrate
- heater
- electronic circuit
- circuit module
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 229910000679 solder Inorganic materials 0.000 claims abstract description 84
- 238000010438 heat treatment Methods 0.000 claims description 47
- 230000002079 cooperative effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 230000001276 controlling effect Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001091914A JP2002290027A (ja) | 2001-03-28 | 2001-03-28 | 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW552833B true TW552833B (en) | 2003-09-11 |
Family
ID=18946463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091104039A TW552833B (en) | 2001-03-28 | 2002-03-05 | Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6730173B2 (enExample) |
| JP (1) | JP2002290027A (enExample) |
| TW (1) | TW552833B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3867768B2 (ja) * | 2001-03-16 | 2007-01-10 | セイコーエプソン株式会社 | ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 |
| US7098534B2 (en) * | 2004-03-31 | 2006-08-29 | Intel Corporation | Sacrificial component |
| JP2006179817A (ja) * | 2004-12-24 | 2006-07-06 | Tekuto:Kk | 電子部品の製造方法及び電子部品の製造装置 |
| KR101739752B1 (ko) * | 2010-11-05 | 2017-05-26 | 삼성전자 주식회사 | 와이어 본딩 장치 및 이를 이용한 와이어 본딩 방법 |
| JP6200182B2 (ja) * | 2013-03-29 | 2017-09-20 | 株式会社デンソー | 基板加熱装置及びはんだ付装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3604611A (en) * | 1969-01-07 | 1971-09-14 | Dee Electric Co | Soldering apparatus |
| JPS6186069A (ja) * | 1984-10-02 | 1986-05-01 | Tamura Seisakusho Co Ltd | 自動はんだ付けシステムの制御装置 |
| EP0280022A1 (de) * | 1987-01-28 | 1988-08-31 | Epm Ag | Verfahren und Anlage zum Löten von bestückten Leiterplatten |
| JPH06292964A (ja) | 1992-07-22 | 1994-10-21 | A Tec Tekutoron Kk | 自動半田付け装置 |
| JP3162827B2 (ja) | 1992-09-18 | 2001-05-08 | 三洋電機株式会社 | 温度制御装置 |
| US5439160A (en) | 1993-03-31 | 1995-08-08 | Siemens Corporate Research, Inc. | Method and apparatus for obtaining reflow oven settings for soldering a PCB |
| JP3390268B2 (ja) | 1994-10-18 | 2003-03-24 | 日本電熱計器株式会社 | はんだ付け装置 |
| US5560537A (en) * | 1995-04-11 | 1996-10-01 | Vlt Corporation | Automatic soldering |
| JP2002204060A (ja) | 2001-01-04 | 2002-07-19 | Matsushita Electric Ind Co Ltd | はんだ付け方法およびフローはんだ付け装置 |
| JP3867768B2 (ja) * | 2001-03-16 | 2007-01-10 | セイコーエプソン株式会社 | ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置 |
-
2001
- 2001-03-28 JP JP2001091914A patent/JP2002290027A/ja not_active Withdrawn
-
2002
- 2002-02-22 US US10/079,432 patent/US6730173B2/en not_active Expired - Fee Related
- 2002-03-05 TW TW091104039A patent/TW552833B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US6730173B2 (en) | 2004-05-04 |
| JP2002290027A (ja) | 2002-10-04 |
| US20020182842A1 (en) | 2002-12-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |