JP2002266087A - 銅のエッチング液およびそれを用いたプリント配線板の製造方法 - Google Patents
銅のエッチング液およびそれを用いたプリント配線板の製造方法Info
- Publication number
- JP2002266087A JP2002266087A JP2001063714A JP2001063714A JP2002266087A JP 2002266087 A JP2002266087 A JP 2002266087A JP 2001063714 A JP2001063714 A JP 2001063714A JP 2001063714 A JP2001063714 A JP 2001063714A JP 2002266087 A JP2002266087 A JP 2002266087A
- Authority
- JP
- Japan
- Prior art keywords
- sulfate
- copper
- hydrogen
- circuit
- sulfuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 57
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000004020 conductor Substances 0.000 claims abstract description 38
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 22
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 22
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 21
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 claims abstract description 15
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 10
- -1 sulfuric acid ions Chemical class 0.000 claims abstract description 7
- 150000002500 ions Chemical class 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 238000005530 etching Methods 0.000 claims description 45
- 238000007747 plating Methods 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 229910000358 iron sulfate Inorganic materials 0.000 claims description 3
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 3
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 3
- 229960001763 zinc sulfate Drugs 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 229910052936 alkali metal sulfate Inorganic materials 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 230000003449 preventive effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 24
- 239000000243 solution Substances 0.000 description 24
- 239000000758 substrate Substances 0.000 description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052804 chromium Inorganic materials 0.000 description 9
- 239000011651 chromium Substances 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- KQHXBDOEECKORE-UHFFFAOYSA-L beryllium sulfate Chemical compound [Be+2].[O-]S([O-])(=O)=O KQHXBDOEECKORE-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 102100031083 Uteroglobin Human genes 0.000 description 1
- 108090000203 Uteroglobin Proteins 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 150000001261 hydroxy acids Chemical group 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- INHCSSUBVCNVSK-UHFFFAOYSA-L lithium sulfate Inorganic materials [Li+].[Li+].[O-]S([O-])(=O)=O INHCSSUBVCNVSK-UHFFFAOYSA-L 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 description 1
- 229910052939 potassium sulfate Inorganic materials 0.000 description 1
- 235000011151 potassium sulphates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- RBTVSNLYYIMMKS-UHFFFAOYSA-N tert-butyl 3-aminoazetidine-1-carboxylate;hydrochloride Chemical group Cl.CC(C)(C)OC(=O)N1CC(N)C1 RBTVSNLYYIMMKS-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001063714A JP2002266087A (ja) | 2001-03-07 | 2001-03-07 | 銅のエッチング液およびそれを用いたプリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001063714A JP2002266087A (ja) | 2001-03-07 | 2001-03-07 | 銅のエッチング液およびそれを用いたプリント配線板の製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004341563A Division JP2005167240A (ja) | 2004-11-26 | 2004-11-26 | 銅のエッチング液を用いたプリント配線板の製造方法 |
| JP2008267473A Division JP2009041112A (ja) | 2008-10-16 | 2008-10-16 | 銅のエッチング液およびそれを用いたプリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002266087A true JP2002266087A (ja) | 2002-09-18 |
| JP2002266087A5 JP2002266087A5 (enExample) | 2005-05-26 |
Family
ID=18922655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001063714A Pending JP2002266087A (ja) | 2001-03-07 | 2001-03-07 | 銅のエッチング液およびそれを用いたプリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002266087A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013105650A1 (ja) * | 2012-01-11 | 2013-07-18 | 三井金属鉱業株式会社 | 接着剤層付銅箔、銅張積層板及びプリント配線板 |
| JP5576525B1 (ja) * | 2013-03-29 | 2014-08-20 | メルテックス株式会社 | 銅エッチング液 |
| CN105734571A (zh) * | 2016-04-21 | 2016-07-06 | 广州恩源化工科技有限公司 | 一种金属表面微蚀液 |
| US10301581B2 (en) | 2015-10-08 | 2019-05-28 | Mitsubishi Gas Chemical Company, Inc. | Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61591A (ja) * | 1984-06-13 | 1986-01-06 | Fujitsu Ltd | 銅のエツチング方法 |
| JPH0533172A (ja) * | 1991-07-25 | 1993-02-09 | Hitachi Cable Ltd | 金属表面処理剤 |
| JPH07297519A (ja) * | 1994-04-21 | 1995-11-10 | Hitachi Chem Co Ltd | 配線板の製造法 |
| JPH09153661A (ja) * | 1995-12-01 | 1997-06-10 | Hitachi Chem Co Ltd | 配線板及びその製造法 |
| JP2000151073A (ja) * | 1998-11-13 | 2000-05-30 | Hitachi Chem Co Ltd | 配線板の製造法 |
| JP2002302780A (ja) * | 2000-12-20 | 2002-10-18 | Lg Phillips Lcd Co Ltd | エッチング溶液及びエッチング溶液でパターン形成された銅配線を有する電子機器用アレー基板 |
-
2001
- 2001-03-07 JP JP2001063714A patent/JP2002266087A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61591A (ja) * | 1984-06-13 | 1986-01-06 | Fujitsu Ltd | 銅のエツチング方法 |
| JPH0533172A (ja) * | 1991-07-25 | 1993-02-09 | Hitachi Cable Ltd | 金属表面処理剤 |
| JPH07297519A (ja) * | 1994-04-21 | 1995-11-10 | Hitachi Chem Co Ltd | 配線板の製造法 |
| JPH09153661A (ja) * | 1995-12-01 | 1997-06-10 | Hitachi Chem Co Ltd | 配線板及びその製造法 |
| JP2000151073A (ja) * | 1998-11-13 | 2000-05-30 | Hitachi Chem Co Ltd | 配線板の製造法 |
| JP2002302780A (ja) * | 2000-12-20 | 2002-10-18 | Lg Phillips Lcd Co Ltd | エッチング溶液及びエッチング溶液でパターン形成された銅配線を有する電子機器用アレー基板 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013105650A1 (ja) * | 2012-01-11 | 2013-07-18 | 三井金属鉱業株式会社 | 接着剤層付銅箔、銅張積層板及びプリント配線板 |
| CN104041198A (zh) * | 2012-01-11 | 2014-09-10 | 三井金属矿业株式会社 | 带有粘合剂层的铜箔、覆铜层压板及印刷布线板 |
| JPWO2013105650A1 (ja) * | 2012-01-11 | 2015-05-11 | 三井金属鉱業株式会社 | 接着剤層付銅箔、銅張積層板及びプリント配線板 |
| JP5576525B1 (ja) * | 2013-03-29 | 2014-08-20 | メルテックス株式会社 | 銅エッチング液 |
| WO2014156414A1 (ja) * | 2013-03-29 | 2014-10-02 | メルテックス株式会社 | 銅エッチング液 |
| KR20150110481A (ko) * | 2013-03-29 | 2015-10-02 | 멜텍스 가부시키가이샤 | 구리 에칭액 |
| KR101682127B1 (ko) | 2013-03-29 | 2016-12-02 | 멜텍스 가부시키가이샤 | 구리 에칭액 |
| US10301581B2 (en) | 2015-10-08 | 2019-05-28 | Mitsubishi Gas Chemical Company, Inc. | Liquid composition for cleaning semiconductor device, method for cleaning semiconductor device, and method for fabricating semiconductor device |
| CN105734571A (zh) * | 2016-04-21 | 2016-07-06 | 广州恩源化工科技有限公司 | 一种金属表面微蚀液 |
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