JP2002254248A5 - - Google Patents

Download PDF

Info

Publication number
JP2002254248A5
JP2002254248A5 JP2001056027A JP2001056027A JP2002254248A5 JP 2002254248 A5 JP2002254248 A5 JP 2002254248A5 JP 2001056027 A JP2001056027 A JP 2001056027A JP 2001056027 A JP2001056027 A JP 2001056027A JP 2002254248 A5 JP2002254248 A5 JP 2002254248A5
Authority
JP
Japan
Prior art keywords
workpiece
electrode
processing apparatus
electrolytic processing
wiper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001056027A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002254248A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001056027A priority Critical patent/JP2002254248A/ja
Priority claimed from JP2001056027A external-priority patent/JP2002254248A/ja
Priority to TW091103600A priority patent/TW541609B/zh
Priority to US10/085,747 priority patent/US6846227B2/en
Publication of JP2002254248A publication Critical patent/JP2002254248A/ja
Priority to US10/818,818 priority patent/US20040188244A1/en
Priority to US10/983,545 priority patent/US20050082165A1/en
Publication of JP2002254248A5 publication Critical patent/JP2002254248A5/ja
Pending legal-status Critical Current

Links

JP2001056027A 2001-02-28 2001-02-28 電解加工装置 Pending JP2002254248A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001056027A JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置
TW091103600A TW541609B (en) 2001-02-28 2002-02-27 Electro-chemical machining apparatus
US10/085,747 US6846227B2 (en) 2001-02-28 2002-02-28 Electro-chemical machining appartus
US10/818,818 US20040188244A1 (en) 2001-02-28 2004-04-06 Electro-chemical machining apparatus
US10/983,545 US20050082165A1 (en) 2001-02-28 2004-11-08 Electro-chemical machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001056027A JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置

Publications (2)

Publication Number Publication Date
JP2002254248A JP2002254248A (ja) 2002-09-10
JP2002254248A5 true JP2002254248A5 (enExample) 2008-03-21

Family

ID=18916119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001056027A Pending JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置

Country Status (3)

Country Link
US (3) US6846227B2 (enExample)
JP (1) JP2002254248A (enExample)
TW (1) TW541609B (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6797623B2 (en) * 2000-03-09 2004-09-28 Sony Corporation Methods of producing and polishing semiconductor device and polishing apparatus
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7078308B2 (en) * 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7074113B1 (en) * 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US7582564B2 (en) 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US6811680B2 (en) 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) 2001-04-10 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7323416B2 (en) 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
US7160432B2 (en) * 2001-03-14 2007-01-09 Applied Materials, Inc. Method and composition for polishing a substrate
US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
KR100939096B1 (ko) * 2001-05-29 2010-01-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
JP2003332274A (ja) * 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd 化学的機械研磨方法及び化学的機械研磨装置
JP2004255753A (ja) * 2003-02-26 2004-09-16 Canon Inc インクジェット記録装置
JP4534983B2 (ja) * 2003-03-25 2010-09-01 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置
JP2004296644A (ja) * 2003-03-26 2004-10-21 Toshiba Corp 半導体装置
US7390429B2 (en) 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
WO2005090648A2 (en) * 2004-03-19 2005-09-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP3910973B2 (ja) * 2004-04-22 2007-04-25 株式会社東芝 半導体装置の製造方法
IL161771A0 (en) * 2004-05-04 2005-11-20 J G Systems Inc Method and composition to minimize dishing in semiconductor wafer processing
US7563348B2 (en) * 2004-06-28 2009-07-21 Lam Research Corporation Electroplating head and method for operating the same
US7210988B2 (en) * 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning
US20060043534A1 (en) * 2004-08-26 2006-03-02 Kirby Kyle K Microfeature dies with porous regions, and associated methods and systems
US7566391B2 (en) * 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
JP2006167824A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
WO2007094869A2 (en) * 2005-10-31 2007-08-23 Applied Materials, Inc. Electrochemical method for ecmp polishing pad conditioning
JP4162001B2 (ja) * 2005-11-24 2008-10-08 株式会社東京精密 ウェーハ研磨装置及びウェーハ研磨方法
US20070227902A1 (en) * 2006-03-29 2007-10-04 Applied Materials, Inc. Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
KR100744419B1 (ko) * 2006-08-03 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자 및 반도체 소자의 제조 방법
KR100744424B1 (ko) * 2006-08-29 2007-07-30 동부일렉트로닉스 주식회사 반도체소자의 제조방법
US20080067077A1 (en) * 2006-09-04 2008-03-20 Akira Kodera Electrolytic liquid for electrolytic polishing and electrolytic polishing method
US7824526B2 (en) * 2006-12-11 2010-11-02 General Electric Company Adaptive spindle assembly for electroerosion machining on a CNC machine tool
JP4786518B2 (ja) * 2006-12-19 2011-10-05 株式会社東芝 半導体装置の製造方法
US8560110B2 (en) 2009-06-19 2013-10-15 General Electric Company Electroerosion control system and a dual mode control system
US9744642B2 (en) * 2013-10-29 2017-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry feed system and method of providing slurry to chemical mechanical planarization station
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
CN104227159B (zh) * 2014-08-06 2016-07-06 安徽工业大学 一种微细凹凸结构的电解加工方法
US9623492B2 (en) 2015-03-27 2017-04-18 General Electric Company Milling tool for portion of slot in rotor
US9943920B2 (en) 2015-03-27 2018-04-17 General Electric Company Method for electro-chemical machining turbine wheel in-situ
US9827628B2 (en) 2015-03-27 2017-11-28 General Electric Company Fixture for electro-chemical machining electrode
US10005139B2 (en) 2015-12-21 2018-06-26 General Electric Company Portable milling tool with method for turbomachine milling
TWI615224B (zh) * 2016-12-09 2018-02-21 財團法人金屬工業研究發展中心 感應式電化學加工裝置
TWI615225B (zh) * 2016-12-12 2018-02-21 財團法人金屬工業研究發展中心 電化學加工裝置
JP2020105590A (ja) * 2018-12-27 2020-07-09 キオクシア株式会社 基板処理装置および基板処理方法
TW202212640A (zh) * 2020-04-24 2022-04-01 紐西蘭商西洛斯材料科學有限公司 在合金上施加著色塗層的方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6313105A (ja) * 1986-07-04 1988-01-20 Hitachi Ltd 磁性材料の研磨方法
JPS63288620A (ja) * 1987-05-22 1988-11-25 Kobe Steel Ltd アルミニウムの電解複合超鏡面加工方法
JP3429513B2 (ja) * 1992-06-26 2003-07-22 旭テック株式会社 電解複合バフ加工方法
US5562529A (en) * 1992-10-08 1996-10-08 Fujitsu Limited Apparatus and method for uniformly polishing a wafer
JPH06315828A (ja) * 1993-05-07 1994-11-15 Hitachi Zosen Corp 難削材のベベリング加工方法
JP3629716B2 (ja) * 1994-03-02 2005-03-16 セイコーエプソン株式会社 配線膜の製造方法、液晶表示装置の製造方法、及び半導体装置の製造方法
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
JPH1158205A (ja) * 1997-08-25 1999-03-02 Unique Technol Internatl Pte Ltd 電解研磨併用ポリシング・テクスチャー加工装置および加工方法ならびにそれに使用する電解研磨併用ポリシング・テクスチャーテープ
JP3909619B2 (ja) * 1998-05-19 2007-04-25 独立行政法人理化学研究所 磁気ディスク基板の鏡面加工装置及び方法
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6413388B1 (en) * 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6368190B1 (en) * 2000-01-26 2002-04-09 Agere Systems Guardian Corp. Electrochemical mechanical planarization apparatus and method
US6582281B2 (en) * 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
US6484855B1 (en) * 2000-04-24 2002-11-26 Winfred E. Yaple Motor vehicle handlebars and hydraulic system therefor
US6464855B1 (en) * 2000-10-04 2002-10-15 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US6558231B1 (en) * 2000-10-17 2003-05-06 Faraday Technology Marketing Goup, Llc Sequential electromachining and electropolishing of metals and the like using modulated electric fields
US6716084B2 (en) * 2001-01-11 2004-04-06 Nutool, Inc. Carrier head for holding a wafer and allowing processing on a front face thereof to occur
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing

Similar Documents

Publication Publication Date Title
JP2002254248A5 (enExample)
SU1618538A1 (ru) Устройство дл электрохимикомеханического полировани и доводки деталей
JP2010501730A (ja) アルミニウムホイール内の凹部を電解研磨する装置および方法
CN108977866B (zh) 一种激光辅助喷雾微弧氧化装置
KR101510042B1 (ko) 회전형 금속봉 전해연마 장치
CN211057260U (zh) 晶圆电镀机
CN210394557U (zh) 一种造粒机转子表面电刷镀修复装置
DE60033314D1 (de) Plattierungsverfahren, -vorrichtung und -system
CN217800931U (zh) 一种多工位不粘锅抛光装置
JP7561975B2 (ja) めっき電極及び該めっき電極を用いためっき方法
JP4413993B2 (ja) 金属部品のための特に電気分解による表面処理設備
CN218089839U (zh) 一种阴极辊氧化装置
EP4019670A1 (en) Oxidation device for planar metal surfaces, such as sheet, fabric or wire mesh of metal and treatment application method
KR200381299Y1 (ko) 전해 연마 장치
KR20100077447A (ko) 기판도금장치
CN220116711U (zh) 一种金属丝电镀悬架
JP2001316869A5 (ja) 電解メッキ装置及び電解メッキ方法
JP3261582B2 (ja) 電解銅箔の製造装置
KR20200070489A (ko) 연속 전해연마장치
CN219808029U (zh) 一种管状植入物的电化学抛光装置
CN221421272U (zh) 一种导线熔断头批量电解抛光制样设备
JP3237313U (ja) 金属表面補修用器具
RU97108908A (ru) Электролизер для производства металлической ленты из водных растворов
RU2009805C1 (ru) Устройство для электрохимико-механического полирования и доводки деталей
JP2004084054A5 (enExample)