JP2002254248A - 電解加工装置 - Google Patents

電解加工装置

Info

Publication number
JP2002254248A
JP2002254248A JP2001056027A JP2001056027A JP2002254248A JP 2002254248 A JP2002254248 A JP 2002254248A JP 2001056027 A JP2001056027 A JP 2001056027A JP 2001056027 A JP2001056027 A JP 2001056027A JP 2002254248 A JP2002254248 A JP 2002254248A
Authority
JP
Japan
Prior art keywords
workpiece
processing apparatus
electrode
electrolytic
wiper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001056027A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002254248A5 (enExample
Inventor
Shuzo Sato
修三 佐藤
Yoshiya Yasuda
善哉 安田
Shigeo Ishihara
成郎 石原
Suguru Otorii
英 大鳥居
Takeshi Nogami
毅 野上
Hisanori Komai
尚紀 駒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2001056027A priority Critical patent/JP2002254248A/ja
Priority to TW091103600A priority patent/TW541609B/zh
Priority to US10/085,747 priority patent/US6846227B2/en
Publication of JP2002254248A publication Critical patent/JP2002254248A/ja
Priority to US10/818,818 priority patent/US20040188244A1/en
Priority to US10/983,545 priority patent/US20050082165A1/en
Publication of JP2002254248A5 publication Critical patent/JP2002254248A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/908—Electrical abrading

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2001056027A 2001-02-28 2001-02-28 電解加工装置 Pending JP2002254248A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2001056027A JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置
TW091103600A TW541609B (en) 2001-02-28 2002-02-27 Electro-chemical machining apparatus
US10/085,747 US6846227B2 (en) 2001-02-28 2002-02-28 Electro-chemical machining appartus
US10/818,818 US20040188244A1 (en) 2001-02-28 2004-04-06 Electro-chemical machining apparatus
US10/983,545 US20050082165A1 (en) 2001-02-28 2004-11-08 Electro-chemical machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001056027A JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置

Publications (2)

Publication Number Publication Date
JP2002254248A true JP2002254248A (ja) 2002-09-10
JP2002254248A5 JP2002254248A5 (enExample) 2008-03-21

Family

ID=18916119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001056027A Pending JP2002254248A (ja) 2001-02-28 2001-02-28 電解加工装置

Country Status (3)

Country Link
US (3) US6846227B2 (enExample)
JP (1) JP2002254248A (enExample)
TW (1) TW541609B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167824A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
JP2023523702A (ja) * 2020-04-24 2023-06-07 シーラス マテリアルズ サイエンス リミティド 合金に色皮膜を施すための方法

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US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
US6797623B2 (en) * 2000-03-09 2004-09-28 Sony Corporation Methods of producing and polishing semiconductor device and polishing apparatus
US7134934B2 (en) * 2000-08-30 2006-11-14 Micron Technology, Inc. Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
US7078308B2 (en) * 2002-08-29 2006-07-18 Micron Technology, Inc. Method and apparatus for removing adjacent conductive and nonconductive materials of a microelectronic substrate
US7112121B2 (en) * 2000-08-30 2006-09-26 Micron Technology, Inc. Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
US7160176B2 (en) * 2000-08-30 2007-01-09 Micron Technology, Inc. Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
US7129160B2 (en) * 2002-08-29 2006-10-31 Micron Technology, Inc. Method for simultaneously removing multiple conductive materials from microelectronic substrates
US7192335B2 (en) * 2002-08-29 2007-03-20 Micron Technology, Inc. Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
US7220166B2 (en) * 2000-08-30 2007-05-22 Micron Technology, Inc. Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
US7153195B2 (en) 2000-08-30 2006-12-26 Micron Technology, Inc. Methods and apparatus for selectively removing conductive material from a microelectronic substrate
US7074113B1 (en) * 2000-08-30 2006-07-11 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US7582564B2 (en) 2001-03-14 2009-09-01 Applied Materials, Inc. Process and composition for conductive material removal by electrochemical mechanical polishing
US6811680B2 (en) 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate
US6899804B2 (en) 2001-04-10 2005-05-31 Applied Materials, Inc. Electrolyte composition and treatment for electrolytic chemical mechanical polishing
US7323416B2 (en) 2001-03-14 2008-01-29 Applied Materials, Inc. Method and composition for polishing a substrate
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US7232514B2 (en) * 2001-03-14 2007-06-19 Applied Materials, Inc. Method and composition for polishing a substrate
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JP2004255753A (ja) * 2003-02-26 2004-09-16 Canon Inc インクジェット記録装置
JP4534983B2 (ja) * 2003-03-25 2010-09-01 凸版印刷株式会社 電気銅めっき液の分析方法、その分析装置
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US7390429B2 (en) 2003-06-06 2008-06-24 Applied Materials, Inc. Method and composition for electrochemical mechanical polishing processing
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7112122B2 (en) * 2003-09-17 2006-09-26 Micron Technology, Inc. Methods and apparatus for removing conductive material from a microelectronic substrate
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7153777B2 (en) 2004-02-20 2006-12-26 Micron Technology, Inc. Methods and apparatuses for electrochemical-mechanical polishing
WO2005090648A2 (en) * 2004-03-19 2005-09-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
JP3910973B2 (ja) * 2004-04-22 2007-04-25 株式会社東芝 半導体装置の製造方法
IL161771A0 (en) * 2004-05-04 2005-11-20 J G Systems Inc Method and composition to minimize dishing in semiconductor wafer processing
US7563348B2 (en) * 2004-06-28 2009-07-21 Lam Research Corporation Electroplating head and method for operating the same
US7210988B2 (en) * 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning
US20060043534A1 (en) * 2004-08-26 2006-03-02 Kirby Kyle K Microfeature dies with porous regions, and associated methods and systems
US7566391B2 (en) * 2004-09-01 2009-07-28 Micron Technology, Inc. Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
WO2007094869A2 (en) * 2005-10-31 2007-08-23 Applied Materials, Inc. Electrochemical method for ecmp polishing pad conditioning
JP4162001B2 (ja) * 2005-11-24 2008-10-08 株式会社東京精密 ウェーハ研磨装置及びウェーハ研磨方法
US20070227902A1 (en) * 2006-03-29 2007-10-04 Applied Materials, Inc. Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
KR100744419B1 (ko) * 2006-08-03 2007-07-30 동부일렉트로닉스 주식회사 반도체 소자 및 반도체 소자의 제조 방법
KR100744424B1 (ko) * 2006-08-29 2007-07-30 동부일렉트로닉스 주식회사 반도체소자의 제조방법
US20080067077A1 (en) * 2006-09-04 2008-03-20 Akira Kodera Electrolytic liquid for electrolytic polishing and electrolytic polishing method
US7824526B2 (en) * 2006-12-11 2010-11-02 General Electric Company Adaptive spindle assembly for electroerosion machining on a CNC machine tool
JP4786518B2 (ja) * 2006-12-19 2011-10-05 株式会社東芝 半導体装置の製造方法
US8560110B2 (en) 2009-06-19 2013-10-15 General Electric Company Electroerosion control system and a dual mode control system
US9744642B2 (en) * 2013-10-29 2017-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Slurry feed system and method of providing slurry to chemical mechanical planarization station
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
CN104227159B (zh) * 2014-08-06 2016-07-06 安徽工业大学 一种微细凹凸结构的电解加工方法
US9623492B2 (en) 2015-03-27 2017-04-18 General Electric Company Milling tool for portion of slot in rotor
US9943920B2 (en) 2015-03-27 2018-04-17 General Electric Company Method for electro-chemical machining turbine wheel in-situ
US9827628B2 (en) 2015-03-27 2017-11-28 General Electric Company Fixture for electro-chemical machining electrode
US10005139B2 (en) 2015-12-21 2018-06-26 General Electric Company Portable milling tool with method for turbomachine milling
TWI615224B (zh) * 2016-12-09 2018-02-21 財團法人金屬工業研究發展中心 感應式電化學加工裝置
TWI615225B (zh) * 2016-12-12 2018-02-21 財團法人金屬工業研究發展中心 電化學加工裝置
JP2020105590A (ja) * 2018-12-27 2020-07-09 キオクシア株式会社 基板処理装置および基板処理方法

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JPH0691432A (ja) * 1992-06-26 1994-04-05 Asahi Tec Corp 電解複合バフ加工方法
JPH06315828A (ja) * 1993-05-07 1994-11-15 Hitachi Zosen Corp 難削材のベベリング加工方法
JPH07245434A (ja) * 1994-03-02 1995-09-19 Seiko Epson Corp 配線膜の製造方法及び非線形抵抗素子の製造方法及び薄膜トランジスタの製造方法及び半導体装置の製造方法及び配線膜及び非線形抵抗素子及び薄膜トランジスタ及び液晶表示装置及び半導体装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006167824A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法
JP2023523702A (ja) * 2020-04-24 2023-06-07 シーラス マテリアルズ サイエンス リミティド 合金に色皮膜を施すための方法

Also Published As

Publication number Publication date
US6846227B2 (en) 2005-01-25
US20040188244A1 (en) 2004-09-30
US20020160698A1 (en) 2002-10-31
TW541609B (en) 2003-07-11
US20050082165A1 (en) 2005-04-21

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