JP2002226584A - 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法 - Google Patents
回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法Info
- Publication number
- JP2002226584A JP2002226584A JP2001390580A JP2001390580A JP2002226584A JP 2002226584 A JP2002226584 A JP 2002226584A JP 2001390580 A JP2001390580 A JP 2001390580A JP 2001390580 A JP2001390580 A JP 2001390580A JP 2002226584 A JP2002226584 A JP 2002226584A
- Authority
- JP
- Japan
- Prior art keywords
- melt
- dianhydride
- odpa
- copolyimide
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 49
- 229920001169 thermoplastic Polymers 0.000 title claims description 8
- 239000004416 thermosoftening plastic Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 230000008569 process Effects 0.000 title description 11
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims abstract description 133
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 99
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims abstract description 56
- 125000003118 aryl group Chemical group 0.000 claims abstract description 30
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 29
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims abstract description 25
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims abstract description 22
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims abstract description 20
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000001747 exhibiting effect Effects 0.000 claims abstract description 14
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 7
- 229920001721 polyimide Polymers 0.000 claims description 188
- 239000004642 Polyimide Substances 0.000 claims description 185
- BCJIMAHNJOIWKQ-UHFFFAOYSA-N 4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]-2-benzofuran-1,3-dione Chemical compound O=C1OC(=O)C2=C1C=CC=C2OC1=CC=CC2=C1C(=O)OC2=O BCJIMAHNJOIWKQ-UHFFFAOYSA-N 0.000 claims description 135
- 238000002844 melting Methods 0.000 claims description 108
- 230000008018 melting Effects 0.000 claims description 108
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 90
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 90
- 238000002425 crystallisation Methods 0.000 claims description 89
- 230000008025 crystallization Effects 0.000 claims description 89
- 239000000203 mixture Substances 0.000 claims description 76
- 239000000155 melt Substances 0.000 claims description 75
- 238000010438 heat treatment Methods 0.000 claims description 68
- 238000006243 chemical reaction Methods 0.000 claims description 60
- 238000006116 polymerization reaction Methods 0.000 claims description 58
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 43
- 238000001816 cooling Methods 0.000 claims description 38
- 238000003303 reheating Methods 0.000 claims description 36
- 238000002156 mixing Methods 0.000 claims description 16
- 238000004458 analytical method Methods 0.000 claims description 12
- 238000010128 melt processing Methods 0.000 claims description 11
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 6
- GRSMWKLPSNHDHA-UHFFFAOYSA-N Naphthalic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=CC3=C1 GRSMWKLPSNHDHA-UHFFFAOYSA-N 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 3
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 claims 1
- 230000006835 compression Effects 0.000 claims 1
- 238000007906 compression Methods 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 50
- 229920000642 polymer Polymers 0.000 description 50
- 239000011541 reaction mixture Substances 0.000 description 45
- 150000004985 diamines Chemical class 0.000 description 40
- 238000002360 preparation method Methods 0.000 description 39
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 36
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 25
- 229910052757 nitrogen Inorganic materials 0.000 description 25
- 229920005575 poly(amic acid) Polymers 0.000 description 25
- 239000000178 monomer Substances 0.000 description 22
- 239000000243 solution Substances 0.000 description 22
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 21
- 230000009477 glass transition Effects 0.000 description 19
- 239000000047 product Substances 0.000 description 16
- 238000003756 stirring Methods 0.000 description 16
- 238000010926 purge Methods 0.000 description 13
- 239000002904 solvent Substances 0.000 description 13
- 239000000498 cooling water Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000010583 slow cooling Methods 0.000 description 9
- 239000002002 slurry Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000010791 quenching Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 125000006159 dianhydride group Chemical group 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229920006362 Teflon® Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000006358 imidation reaction Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 238000013329 compounding Methods 0.000 description 3
- 229920006126 semicrystalline polymer Polymers 0.000 description 3
- 238000002076 thermal analysis method Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 239000008186 active pharmaceutical agent Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 229910000856 hastalloy Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- -1 laminates Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001338 liquidmetal Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010907 mechanical stirring Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- 241000132092 Aster Species 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 241001555133 Picrodendron baccatum Species 0.000 description 1
- 235000009984 Pterocarpus indicus Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- IZJDCINIYIMFGX-UHFFFAOYSA-N benzo[f][2]benzofuran-1,3-dione Chemical compound C1=CC=C2C=C3C(=O)OC(=O)C3=CC2=C1 IZJDCINIYIMFGX-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
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- 230000006378 damage Effects 0.000 description 1
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- 230000001627 detrimental effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
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- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
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- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- 238000003828 vacuum filtration Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Treatment Of Fiber Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/742,860 | 2000-12-21 | ||
| US09/742,860 US6476177B2 (en) | 2000-12-21 | 2000-12-21 | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002226584A true JP2002226584A (ja) | 2002-08-14 |
| JP2002226584A5 JP2002226584A5 (enExample) | 2005-07-14 |
Family
ID=24986541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001390580A Pending JP2002226584A (ja) | 2000-12-21 | 2001-12-21 | 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6476177B2 (enExample) |
| EP (1) | EP1217026B1 (enExample) |
| JP (1) | JP2002226584A (enExample) |
| DE (1) | DE60114131T2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009041309A1 (ja) * | 2007-09-28 | 2009-04-02 | Fujifilm Corporation | 溶融押出装置及び熱可塑性樹脂フィルムの製造方法 |
| WO2012081644A1 (ja) * | 2010-12-15 | 2012-06-21 | 宇部興産株式会社 | ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物 |
| KR101430974B1 (ko) | 2007-12-27 | 2014-08-19 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| JPWO2022085619A1 (enExample) * | 2020-10-22 | 2022-04-28 | ||
| JP7791097B2 (ja) | 2020-10-22 | 2025-12-23 | 株式会社カネカ | 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6852826B2 (en) * | 2001-12-21 | 2005-02-08 | Kanera Corporation | Manufacturing method of polyamic acid, and polyamic acid solution |
| US6956098B2 (en) * | 2002-09-20 | 2005-10-18 | E. I. Du Pont De Nemours And Company | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto |
| US7452944B2 (en) * | 2004-06-28 | 2008-11-18 | Sabic Innovative Plastics Ip B.V. | Miscible polyimide blends |
| US20060194070A1 (en) * | 2005-02-25 | 2006-08-31 | Joshua Croll | Polyetherimide film and multilayer structure |
| US8263691B2 (en) * | 2006-02-21 | 2012-09-11 | Sabic Innovative Plastics Ip B.V. | Release agent for transparent polyimide blends |
| US20080119616A1 (en) * | 2006-11-22 | 2008-05-22 | General Electric Company | Polyimide resin compositions |
| US8399573B2 (en) | 2006-11-22 | 2013-03-19 | Sabic Innovative Plastics Ip B.V. | Polymer blend compositions |
| US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
| US8784993B2 (en) | 2010-12-15 | 2014-07-22 | General Electric Company | High temperature high frequency magnet wire and method of making |
| WO2013003397A2 (en) * | 2011-06-28 | 2013-01-03 | E. I. Du Pont De Nemours And Company | Polyimide-coated fillers |
| CN105778092B (zh) * | 2016-03-09 | 2018-03-16 | 哈尔滨工业大学 | 一种聚醚酰亚胺高温热缩管及其制备方法 |
| US10487177B2 (en) * | 2016-08-04 | 2019-11-26 | Tetramer Technologies, Inc. | Copolymers exhibiting improved thermo-oxidative stability |
| CN106313474B (zh) * | 2016-08-16 | 2019-04-19 | 李泽英 | 用于制备热塑性聚合物制品的挤出装置、设备和方法 |
| CN112574565B (zh) * | 2020-12-08 | 2023-04-25 | 黄山金石木塑料科技有限公司 | 低热膨胀芳香类冷压型聚酰亚胺树脂及其合成方法和应用 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US5741883A (en) * | 1994-12-16 | 1998-04-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Tough, soluble, aromatic, thermoplastic copolyimides |
| US6114494A (en) * | 1998-12-03 | 2000-09-05 | Ranbar Electrical Materials, Inc. | Polyimide material and method of manufacture |
-
2000
- 2000-12-21 US US09/742,860 patent/US6476177B2/en not_active Expired - Lifetime
-
2001
- 2001-10-29 EP EP01125757A patent/EP1217026B1/en not_active Expired - Lifetime
- 2001-10-29 DE DE60114131T patent/DE60114131T2/de not_active Expired - Fee Related
- 2001-12-21 JP JP2001390580A patent/JP2002226584A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009041309A1 (ja) * | 2007-09-28 | 2009-04-02 | Fujifilm Corporation | 溶融押出装置及び熱可塑性樹脂フィルムの製造方法 |
| JP2009083312A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 溶融押出装置及び熱可塑性樹脂フィルムの製造方法 |
| KR101430974B1 (ko) | 2007-12-27 | 2014-08-19 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| WO2012081644A1 (ja) * | 2010-12-15 | 2012-06-21 | 宇部興産株式会社 | ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物 |
| JPWO2022085619A1 (enExample) * | 2020-10-22 | 2022-04-28 | ||
| JP7791097B2 (ja) | 2020-10-22 | 2025-12-23 | 株式会社カネカ | 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1217026A2 (en) | 2002-06-26 |
| US6476177B2 (en) | 2002-11-05 |
| EP1217026A3 (en) | 2003-03-26 |
| EP1217026B1 (en) | 2005-10-19 |
| DE60114131T2 (de) | 2006-07-27 |
| US20020128424A1 (en) | 2002-09-12 |
| DE60114131D1 (de) | 2005-11-24 |
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