JP2002226584A5 - - Google Patents
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- Publication number
- JP2002226584A5 JP2002226584A5 JP2001390580A JP2001390580A JP2002226584A5 JP 2002226584 A5 JP2002226584 A5 JP 2002226584A5 JP 2001390580 A JP2001390580 A JP 2001390580A JP 2001390580 A JP2001390580 A JP 2001390580A JP 2002226584 A5 JP2002226584 A5 JP 2002226584A5
- Authority
- JP
- Japan
- Prior art keywords
- copolyimide
- dianhydride
- odpa
- molar ratio
- bpda
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims 23
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims 18
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 7
- 125000003118 aryl group Chemical group 0.000 claims 7
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 claims 6
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims 6
- 150000004984 aromatic diamines Chemical class 0.000 claims 6
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims 4
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 claims 4
- 238000002425 crystallisation Methods 0.000 claims 4
- 230000008025 crystallization Effects 0.000 claims 4
- 238000000113 differential scanning calorimetry Methods 0.000 claims 4
- 238000003303 reheating Methods 0.000 claims 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000000047 product Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/742,860 | 2000-12-21 | ||
| US09/742,860 US6476177B2 (en) | 2000-12-21 | 2000-12-21 | Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002226584A JP2002226584A (ja) | 2002-08-14 |
| JP2002226584A5 true JP2002226584A5 (enExample) | 2005-07-14 |
Family
ID=24986541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001390580A Pending JP2002226584A (ja) | 2000-12-21 | 2001-12-21 | 回復可能な結晶化度を有する溶融加工可能な熱可塑性ランダムコポリイミドおよびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6476177B2 (enExample) |
| EP (1) | EP1217026B1 (enExample) |
| JP (1) | JP2002226584A (enExample) |
| DE (1) | DE60114131T2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6852826B2 (en) * | 2001-12-21 | 2005-02-08 | Kanera Corporation | Manufacturing method of polyamic acid, and polyamic acid solution |
| US6956098B2 (en) * | 2002-09-20 | 2005-10-18 | E. I. Du Pont De Nemours And Company | High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto |
| US7452944B2 (en) * | 2004-06-28 | 2008-11-18 | Sabic Innovative Plastics Ip B.V. | Miscible polyimide blends |
| US20060194070A1 (en) * | 2005-02-25 | 2006-08-31 | Joshua Croll | Polyetherimide film and multilayer structure |
| US8263691B2 (en) * | 2006-02-21 | 2012-09-11 | Sabic Innovative Plastics Ip B.V. | Release agent for transparent polyimide blends |
| US20080119616A1 (en) * | 2006-11-22 | 2008-05-22 | General Electric Company | Polyimide resin compositions |
| US8399573B2 (en) | 2006-11-22 | 2013-03-19 | Sabic Innovative Plastics Ip B.V. | Polymer blend compositions |
| US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
| JP4886648B2 (ja) * | 2007-09-28 | 2012-02-29 | 富士フイルム株式会社 | 溶融押出装置及び熱可塑性樹脂フィルムの製造方法 |
| KR101430974B1 (ko) | 2007-12-27 | 2014-08-19 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 필름 및 그 제조방법 |
| US8784993B2 (en) | 2010-12-15 | 2014-07-22 | General Electric Company | High temperature high frequency magnet wire and method of making |
| WO2012081644A1 (ja) * | 2010-12-15 | 2012-06-21 | 宇部興産株式会社 | ポリイミドシームレスベルト、その製造方法、ポリイミド前駆体溶液組成物 |
| WO2013003397A2 (en) * | 2011-06-28 | 2013-01-03 | E. I. Du Pont De Nemours And Company | Polyimide-coated fillers |
| CN105778092B (zh) * | 2016-03-09 | 2018-03-16 | 哈尔滨工业大学 | 一种聚醚酰亚胺高温热缩管及其制备方法 |
| US10487177B2 (en) * | 2016-08-04 | 2019-11-26 | Tetramer Technologies, Inc. | Copolymers exhibiting improved thermo-oxidative stability |
| CN106313474B (zh) * | 2016-08-16 | 2019-04-19 | 李泽英 | 用于制备热塑性聚合物制品的挤出装置、设备和方法 |
| CN112574565B (zh) * | 2020-12-08 | 2023-04-25 | 黄山金石木塑料科技有限公司 | 低热膨胀芳香类冷压型聚酰亚胺树脂及其合成方法和应用 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3489725A (en) | 1965-10-12 | 1970-01-13 | American Cyanamid Co | Process for the preparation of polyimides using a melt polymerization technique |
| US3803085A (en) | 1972-12-29 | 1974-04-09 | Gen Electric | Method for making polyetherimides |
| US4073773A (en) | 1976-12-30 | 1978-02-14 | General Electric Company | Melt polymerization method for making polyetherimides |
| US4281100A (en) | 1979-05-09 | 1981-07-28 | General Electric Company | Injection moldable polyetherimide oligomers and method for making |
| US4485140A (en) | 1983-09-21 | 1984-11-27 | E. I. Du Pont De Nemours And Company | Melt-fusible polyimides |
| US4590258A (en) | 1983-12-30 | 1986-05-20 | International Business Machines Corporation | Polyamic acid copolymer system for improved semiconductor manufacturing |
| US4552931A (en) | 1984-09-11 | 1985-11-12 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process of end-capping a polyimide system |
| US4883718A (en) | 1985-02-12 | 1989-11-28 | Mitsui Toatsu Chemicals, Inc. | Flexible copper-clad circuit substrate |
| GB2174399B (en) | 1985-03-10 | 1988-05-18 | Nitto Electric Ind Co | Colorless transparent polyimide shaped articles and their production |
| US4837300A (en) | 1985-06-20 | 1989-06-06 | The United States Of America As Represented By The Administration Of The National Aeronautics And Space Administration | Copolyimide with a combination of flexibilizing groups |
| JP2622678B2 (ja) | 1987-01-12 | 1997-06-18 | チッソ株式会社 | 溶融成形可能な結晶性ポリイミド重合体 |
| US5116939A (en) | 1987-08-11 | 1992-05-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimide processing additives |
| JP2574162B2 (ja) | 1988-01-06 | 1997-01-22 | チッソ株式会社 | 低融点ポリイミド共重合体 |
| US5106938A (en) | 1989-06-08 | 1992-04-21 | General Electric Company | Melt crystalline polyetherimides |
| US5077382A (en) | 1989-10-26 | 1991-12-31 | Occidental Chemical Corporation | Copolyimide odpa/bpda/4,4'-oda or p-pda |
| US5171828A (en) | 1989-10-26 | 1992-12-15 | Occidental Chemical Corporation | Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA |
| US5145937A (en) | 1989-11-09 | 1992-09-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Polyimides with carbonyl and ether connecting groups between the aromatic rings |
| US5166308A (en) | 1990-04-30 | 1992-11-24 | E. I. Du Pont De Nemours And Company | Copolyimide film with improved properties |
| US5268447A (en) | 1990-06-01 | 1993-12-07 | Mitsui Toatsu Chemicals, Inc. | Readily processable polyimide and preparation process of same |
| DE69127137T2 (de) | 1990-06-01 | 1998-02-26 | Mitsui Toatsu Chemicals | Leicht zu verarbeitende Polyimide und deren Herstellung |
| US5268446A (en) | 1990-08-24 | 1993-12-07 | Mitsui Toatsu Chemicals, Incorporated | Readily processable polyimide and preparation process of same |
| EP0474054B1 (en) | 1990-08-27 | 1995-12-06 | E.I. Du Pont De Nemours And Company | Flexible multi-layer polyimide film laminates and preparation thereof |
| US5202412A (en) | 1990-10-02 | 1993-04-13 | E. I. Du Pont De Nemours And Company | Polyimide copolymer precursors |
| US5484879A (en) | 1990-12-17 | 1996-01-16 | Occidental Chemical Corporation | Polyimides containing fluorine |
| US5219977A (en) | 1990-12-17 | 1993-06-15 | E. I. Du Pont De Nemours And Company | Tetrapolyimide film containing oxydipthalic dianhydride |
| EP0518543B1 (en) | 1991-06-10 | 1997-03-12 | MITSUI TOATSU CHEMICALS, Inc. | Polyimide and process for the preparation thereof |
| US5406124A (en) | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
| US5302652A (en) | 1992-12-15 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Process for preparing a pigmented polyimide shaped article |
| US5478913A (en) | 1993-12-22 | 1995-12-26 | E. I. Du Pont De Nemours And Company | Melt-processible polyimides with high Tg |
| US5502157A (en) | 1994-08-31 | 1996-03-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Copolyimides prepared from ODPA, BTDA and 3,4'-ODA |
| US5478916A (en) | 1994-09-01 | 1995-12-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Solvent resistant copolyimide |
| US5464928A (en) | 1994-09-01 | 1995-11-07 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Direct process for preparing semi-crystalline polyimides |
| US6048959A (en) * | 1994-12-16 | 2000-04-11 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Tough soluble aromatic thermoplastic copolyimides |
| US5741883A (en) * | 1994-12-16 | 1998-04-21 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Tough, soluble, aromatic, thermoplastic copolyimides |
| US6114494A (en) * | 1998-12-03 | 2000-09-05 | Ranbar Electrical Materials, Inc. | Polyimide material and method of manufacture |
-
2000
- 2000-12-21 US US09/742,860 patent/US6476177B2/en not_active Expired - Lifetime
-
2001
- 2001-10-29 EP EP01125757A patent/EP1217026B1/en not_active Expired - Lifetime
- 2001-10-29 DE DE60114131T patent/DE60114131T2/de not_active Expired - Fee Related
- 2001-12-21 JP JP2001390580A patent/JP2002226584A/ja active Pending
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