JP2002127285A - Composite body and method for producing multi-layer printed-wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite body which dispenses with a packing resin to fill through holes and prevents the generation of recesses on the surface of the composite body laminated on an inner layer material when the inner layer material having the through holes is used. SOLUTION: The composite body is manufactured by applying a resin composition on one side of a support sheet and forming a resin layer. The product of the flexural modulus of elasticity and the thickness of the support sheet is at least 3,000 GPa.μm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite such as a resin-coated metal foil and an insulating film used for manufacturing a multilayer printed wiring board.

[0002]

2. Description of the Related Art In recent years, resin-coated metal foils and insulating films have been widely used in manufacturing multilayer printed wiring boards. These are all common in that they are composites composed of a sheet-shaped support and a resin composition. In addition, each of them is manufactured by applying a resin composition to one surface of the support and forming a resin layer. The resin-attached metal foil and the insulating film as such a composite are specifically produced as follows, respectively, and are used for manufacturing a multilayer printed wiring board.

When a metal foil with a resin is produced, a metal foil such as a copper foil is used as a support, and a resin composition such as an epoxy resin is used as a resin composition. Then, a resin composition is applied to one surface of the above-mentioned metal foil and heated to a B-stage state, whereby a semi-cured resin layer is formed and a metal foil with resin is produced.

[0004] When a multilayer printed wiring board is manufactured using the metal foil with resin manufactured as described above, it can be performed as follows. First, by laminating the resin layer side of the above-mentioned metal foil with resin on one side or both sides of an inner layer material having a circuit pattern (inner layer pattern) formed on the surface in advance, and laminating this by heating and pressing, A multilayer wiring board for processing into a multilayer printed wiring board can be manufactured. Next, a hole or the like is formed on one or both surfaces of the multilayer wiring board by using a laser or the like, and a circuit pattern (outer layer pattern) is formed on an outer metal foil by a subtractive method or the like. A printed wiring board can be manufactured. In the multilayer printed wiring board manufactured as described above, the continuity between the inner layer pattern and the outer layer pattern is established by the via hole or the like.

On the other hand, when producing an insulating film,
Polyethylene terephthalate resin (PE
T), a resin film such as a polybutylene terephthalate resin (PBT) or a polyimide resin is used, and a resin composition such as an epoxy resin is used as the resin composition. Then, a resin composition is applied to one surface of the above-mentioned resin film and heated to a B-stage state, whereby a semi-cured resin layer is formed to produce an insulating film.

[0006] When a multilayer printed wiring board is manufactured using the insulating film thus manufactured, it can be performed as follows. First, as in the case of the metal foil with resin, the resin layer side of the insulating film is superimposed on one side or both sides of an inner layer material having a circuit pattern (inner layer pattern) formed on the surface in advance, and this is heated. By pressing and laminating, a multilayer wiring board for processing into a multilayer printed wiring board can be manufactured. Next, the resin film located outside the multilayer wiring board is peeled off, and a hole is formed in the exposed resin layer by laser or the like, and a circuit pattern (outer layer) is formed on the surface of the resin layer by an additive method or the like. By forming the pattern, a multilayer printed wiring board can be manufactured. In the multilayer printed wiring board manufactured as described above, the continuity between the inner layer pattern and the outer layer pattern is established by the via hole or the like.

Here, in manufacturing a multilayer printed wiring board, regardless of whether a metal foil with resin or an insulating film is used as a composite material as described above, the inner layer material has a through hole on the surface. One having an opening can be used. Normally, when using such an inner layer material, it is necessary to protect the through-hole. Therefore, using a filling resin, after filling this resin into the inside of the through-hole, lamination molding of a metal foil with resin or an insulating film. Is what is being done.

[0008]

However, as described above, the step of filling the inside of the through-hole with the filling resin is performed only for the inner layer material having the through-hole. It is not performed for the inner layer material that does not have it. For this reason, when manufacturing a multilayer printed wiring board, there was a problem that the number of steps was different depending on the presence or absence of a through hole in the inner layer material.

Therefore, when manufacturing a multilayer printed wiring board using an inner layer material having a through hole, the filling of the through hole with a filling resin is simplified to simplify the process. This is intended to fill a part of the resin composition of the resin layer of the resin-coated metal foil or the insulating film laminated on the inner layer material into the through-hole, thereby eliminating the need for the filling resin. .

However, in the conventional resin-attached metal foil and insulating film, as a part of the resin composition forming the resin layer is filled in the through-hole, the outer metal foil or the support serving as the support is required. The resin film was drawn in the direction of the through-hole, and a dent was formed particularly on the surface of the support located near the through-hole.

For this reason, for example, when a metal foil with a resin is used, even if a dry film is placed on the outer metal foil to perform the subtractive method, the entire surface cannot be brought into close contact with each other. Voids were formed at the dent portions of the. Therefore, even if exposure and development are performed in this state to form an etching resist, the metal foil in the above-mentioned concave portion is not protected by the etching resist, but is removed by the etching solution, and the circuit pattern is removed. However, there is a problem that the chip is missing.

The present invention has been made in view of the above points, and when an inner layer material having a through hole is used, there is no need to use a filling resin to fill the through hole, and the present invention is applied to an inner layer material. It is an object of the present invention to provide a composite in which dents do not occur on the surface of the composite.

[0013]

According to a first aspect of the present invention, there is provided a composite prepared by applying a resin composition to one surface of a sheet-shaped support to form a resin layer. The product of the bending elastic modulus and the thickness of the support is 3000 GP.
a · μm or more.

According to a second aspect of the present invention, in the first aspect, the support is a metal foil.

The invention of claim 3 is characterized in that, in claim 2, the metal foil is a copper foil.

According to a fourth aspect of the present invention, in the first aspect, the support is a resin film.

According to a fifth aspect of the present invention, in the fourth aspect, the resin film is formed of a polyethylene terephthalate resin.

According to a sixth aspect of the present invention, in the first aspect, the support is formed of a metal foil and a resin film.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the thickness of the resin layer is 30 to 150 μm.

According to a eighth aspect of the present invention, there is provided a method of manufacturing a multilayer printed wiring board, comprising: using the composite according to any one of the first to seventh aspects and an inner layer material having through holes formed therein. In manufacturing the board, the resin layer side of the composite is overlapped on the surface of the inner layer material where the through hole is formed under vacuum, and the inside of the through hole is filled with the resin composition of the resin layer. It is assumed that.

[0021]

Embodiments of the present invention will be described below.

In the present invention, the resin for preparing the resin composition is not particularly limited, but it is preferable to use a thermosetting resin such as an epoxy resin or a polyimide resin. In preparing the resin composition, a known curing agent, curing accelerator and other additives can be used in addition to such a resin, and these can be mixed. The preparation at this time may be carried out without a solvent, but may be carried out by adding a solvent such as methyl ethyl ketone (MEK), methoxypropanol (MP), dimethylformamide (DMF) or the like. it can.

In the present invention, the composite is formed by applying the above-mentioned resin composition to one surface of a sheet-like support to form a resin layer, and the flexural modulus of the above-mentioned support is obtained. And a product having a thickness of 3000 GPa · μm or more, which can be used for manufacturing a multilayer printed wiring board. When using such a composite, when performing lamination molding using an inner layer material having an opening of a through hole on the surface, it is not necessary to fill the inside of the through hole with a filling resin as in the related art. In addition, no dent is formed on the outer surface of the composite to be laminated, that is, the surface of the support exposed to the outside. Conversely, if the product of the bending elastic modulus and the thickness of the support is less than 3000 GPa · μm, in the above case, if the inside of the through-hole is not filled with the filling resin, instead of the filling resin, As a part of the resin composition forming the resin layer is filled into the through hole, the support near the through hole is drawn in the direction of the through hole, and a dent is formed on the surface of the support exposed to the outside. It will happen.
The substantial upper limit of the product of the flexural modulus and the thickness of the support is
30,000 GPa · μm.

In the present invention, specific examples of the composite include:
Examples thereof include a metal foil with a resin and an insulating film. Hereinafter, these two things will be described.

In the metal foil with resin, as a support,
A metal foil having a product of the bending elastic modulus and the thickness of 3000 GPa · μm or more is used. For example, a copper foil, an aluminum foil, a stainless steel foil, or the like can be used. Among them, copper foil is preferable, and when this is used, the electrical reliability of the manufactured multilayer printed wiring board is further improved.

Here, a laminate of metal foils of the same type or different types can be used as a support, but one of the metal foils serves as a carrier film, and a resin layer described later is not formed thereon. In this case, the sum of the product of the bending elastic modulus and the thickness of each metal foil is 3000 GPa · μ.
m or more. Further, a material obtained by laminating a resin film described later on a metal foil can also be used as a support. In this case, the resin film becomes a carrier film, and a resin layer is formed on the metal foil. In this case, the sum of the product of the bending elastic modulus and the thickness of each of the metal foil and the resin film is 3000 GPa · μm.
The above is to be done. When the support is formed of a metal foil and a carrier film (metal foil or resin film) in this manner, the carrier film may be appropriately formed even if the product of the bending elastic modulus and the thickness is less than 3000 GPa · μm using only the metal foil. Is selected and superimposed on the above metal foil, so that the above value can be obtained.

In producing a metal foil with resin using the above-mentioned support and the resin composition, a comma coater,
By using a transfer coater, a curtain coater, a die coater, or the like, a resin composition is applied to one surface of a metal foil, and this is continuously or discontinuously heated and dried to a B-stage state. . Here, the thickness of the resin layer formed by semi-curing on one surface of the metal foil is 20 to
It is generally 200 μm, but 30 to 150 μm
It is preferable to set m. The thickness of the resin layer is 30 μm
If it is less than, when using an inner layer material having an opening of a through hole on the surface during lamination molding, unless the inside of the through hole is filled with a filling resin as in the past, the resin laminated on this surface There is a possibility that a dent may occur on the outer surface of the attached metal foil. Conversely, if the thickness of the resin layer exceeds 150 μm, the productivity of drilling holes in the resin layer may decrease during the production of the multilayer printed wiring board.

Then, the resin layer side of the above-mentioned resin-coated metal foil is superimposed on one or both surfaces of an inner layer material having a circuit pattern (inner layer pattern) formed on the surface in advance, and this is laminated under heat and pressure. Thus, a multilayer wiring board for processing into a multilayer printed wiring board can be manufactured. When a carrier film is included in the support of the metal foil with resin, the carrier film is disposed on the outermost surface of the multilayer wiring board after lamination molding, and the carrier film is peeled off. As a result, the metal foil is exposed.

In the multilayer wiring board manufactured as described above, when a through-hole is formed as the inner layer material, a part of the resin composition of the resin layer of the metal foil with resin is used. Fills the inside of the through hole, so that it is not necessary to fill the through hole resin in advance. In addition, since the above-described support is used as the support for the metal foil with a resin, this support resists the flow and curing shrinkage of the uncured resin composition, and smoothes the outermost surface of the resin layer. While holding, the resin layer can be completely cured in this state, and no dent is formed on the surface of the metal foil.

Here, in manufacturing the multilayer wiring board as described above, it is preferable to laminate-mold under a vacuum rather than an atmospheric pressure. Such lamination molding under vacuum has been conventionally performed for the purpose of preventing voids from being generated inside the through holes. However, in the conventional lamination molding under vacuum, as the resin composition of the resin layer near the through-hole rapidly flows into the inside of the through-hole, the support near the through-hole forms the support of the through-hole. Direction, a depression was formed on the outer surface of the support, and the depression became deeper. On the other hand, in the present invention, the resin composition is completely filled in the through-hole, the remaining of the voids is reliably prevented, and the support has no effect when the resin composition flows into the through-hole. The smoothness can be maintained without suffering from any dents, and no dents are formed on the outer surface of the support.

Then, a hole is formed by drilling one or both surfaces of the multilayer wiring board with a laser or the like, and a circuit pattern (outer layer pattern) is formed on the outer metal foil by a subtractive method or the like. And a multilayer printed wiring board can be manufactured. Here, in performing the above-described subtractive method, since there is no dent on the surface of the metal foil on which the circuit is formed, it is possible to bring both into close contact without generating a void between the metal foil and the dry film. Therefore, the etching resist formed by exposure / development can surely protect the portion of the metal foil that should be left as a circuit pattern from the etching solution, thereby preventing the circuit pattern from being chipped. is there.

On the other hand, a resin film having a product of flexural modulus and thickness of 3000 GPa · μm or more is used as a support in the insulating film. For example, polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT) And a film formed of a polyimide resin or the like can be used. Among them, it is preferable to use polyethylene terephthalate resin (PET) in that it is relatively inexpensive and has good heat resistance.

Here, the same or different types of resin films laminated on each other can be used as a support. In this case, both resin films serve as carrier films, but one resin film has a resin layer. It is formed. In this case, the sum of the product of the bending elastic modulus and the thickness of each resin film is set to be 3000 GPa · μm or more. Further, a resin film on which a metal foil as described above is overlapped can also be used as a support. In this case as well, both are carrier films, but a resin layer is formed on the resin film. In this case, the sum of the product of the bending elastic modulus and the thickness of each of the resin film and the metal foil is set to be 3000 GPa · μm or more. If the support is formed of a resin film and a carrier film (metal foil or resin film) in this way, the carrier film may be appropriately formed even if the product of the flexural modulus and the thickness of the resin film alone is less than 3000 GPa · μm. Is selected and superimposed on the above resin film, so that the above value can be obtained.

In preparing an insulating film using the above-mentioned support and resin composition, a resin coat is applied to one surface of the resin film using a comma coater, a transfer coater, a curtain coater, a die coater or the like. It can be performed by applying an object and heating and drying the object continuously or discontinuously to the B-stage state. Here, the thickness of the resin layer formed by semi-curing on one surface of the resin film is generally 30 to 200 μm, but preferably 30 to 150 μm.
When the thickness of the resin layer is less than 30 μm, when using an inner layer material having an opening of a through hole on the surface during lamination molding, if the inside of the through hole is not filled with a filling resin as in the related art, There is a possibility that dents may occur on the outer surface of the insulating film laminated on the surface. Conversely, if the thickness of the resin layer exceeds 150 μm, the productivity of drilling holes in the resin layer may decrease during the production of the multilayer printed wiring board.

Then, the resin layer side of the above-mentioned insulating film is superimposed on one or both sides of an inner layer material having a circuit pattern (inner layer pattern) formed on the surface in advance, and this is laminated by heating and pressing. Thereby, a multilayer wiring board for processing into a multilayer printed wiring board can be manufactured. The entire support of the insulating film is a carrier film as described above, and the resin layer is exposed by peeling off the carrier film.

In the multilayer wiring board manufactured as described above, when a through-hole is formed as the inner layer material, a part of the resin composition of the resin layer of the insulating film is used. Since the inside of the through hole is filled, there is no need to fill the through hole in advance. In addition, since the above-mentioned support is used as a support for the insulating film, the support smoothly holds the outermost surface of the resin layer against the flow and curing shrinkage of the uncured resin composition. However, in this state, the resin layer can be completely cured, and no dent occurs.

Here, in manufacturing the multilayer wiring board as described above, it is preferable to perform lamination molding under a vacuum rather than an atmospheric pressure. As described above, in the conventional lamination molding under vacuum, the depth of the recess formed on the outer surface of the support has been increased. On the other hand, in the present invention, the remaining of the void is reliably prevented, and no dent is formed on the outer surface of the support.

Then, a hole is formed by drilling one or both sides of the multilayer wiring board with a laser or the like, and a circuit pattern (outer layer pattern) is formed on the exposed surface of the resin layer by an additive method or the like. By doing so, a multilayer printed wiring board can be manufactured. Here, in performing the above-mentioned additive method, since there is no dent on the surface of the resin layer on which the circuit is formed, it is necessary to adhere both of them without generating voids between the surface of the resin layer and the dry film. Therefore, the plating resist formed by exposure and development can surely protect a portion where plating is not performed, so that a circuit pattern is not formed where it is not necessary.

When a multilayer printed wiring board is manufactured using an inner layer material having a through hole opening on the surface, a composite such as the above-mentioned resin-attached metal foil or insulating film is used. It is not necessary to fill the inside of the hole with a filling resin, which simplifies the process and eliminates the occurrence of a dent on the outermost surface of the multilayer wiring board, so that a desired circuit pattern can be reliably formed on this surface. It is possible to manufacture a highly reliable multilayer printed wiring board.

[0040]

The present invention will be specifically described below with reference to examples.

As a resin for preparing the resin composition,
The following epoxy resin was used.

That is, brominated bisphenol A type epoxy resin ("YDB-500" manufactured by Toto Kasei Co., Ltd .: epoxy equivalent 500, bromination ratio about 24% by mass), cresol novolac type epoxy resin ("YDCN-22" manufactured by Toto Kasei Co., Ltd.)
0 ": epoxy equivalent 220, bromination ratio about 24% by mass).

As a curing agent, phenol novolak ("PSM6200" manufactured by Gunei Chemical Co., Ltd.), dicyandiamide (molecular weight: 84, theoretically active hydrogen equivalent: 21), a curing accelerator: 2-ethyl-4-methylimidazole, and a solvent: Methyl ethyl ketone (MEK), methoxypropanol (MP), and dimethylformamide (DMF) were used.

<Preparation of Varnish of Epoxy Resin Composition> The above “YDB-500” and “YDCN-220” are charged into a predetermined solvent, and “Homomixer” manufactured by Tokushu Kika Kogyo Co., Ltd.
For about 90 minutes at about 1000 rpm. Thereafter, a curing accelerator (2-ethyl-4-methylimidazole) is blended, and the mixture is again stirred for about 15 minutes, then degassed, and at 25 ° C., about 500 to 1000 centi-pois
e) A varnish of the epoxy resin composition was prepared.

<Preparation of Metal Foil with Resin> As a support,
Only copper foil, using a copper carrier film is arranged on the copper foil, the varnish of the epoxy resin composition prepared as described above on the roughened surface of the copper foil is applied at room temperature with a comma coater, Thereafter, by heating at about 130 to 170 ° C. by a non-contact type heating unit, the solvent in the varnish is dried and removed, and the epoxy resin composition is semi-cured, whereby the thickness of the resin layer is 75 to 85 μm. A metal foil with resin was produced.

<Preparation of insulating film>
Only PET film, PET film with stainless steel carrier film is used.
A varnish of the epoxy resin composition prepared as described above is applied to one surface of the T film with a comma coater at room temperature, and then heated at about 130 to 170 ° C. by a non-contact type heating unit. Then, the solvent in the varnish was dried and removed, and the epoxy resin composition was semi-cured to prepare an insulating film having a resin layer thickness of 75 to 85 μm.

<Evaluation Items> Indentation of upper and lower portions of inner layer through hole As the inner layer material, a 0.8 mm thick inner core double-sided board (“CR1766” manufactured by Matsushita Electric Works, Ltd .: copper foil thickness 35 μm, size: 340 mm long, 510 mm wide) was used. A through hole having a diameter of 0.3 mm was formed in this inner layer material by drilling, and the through hole was made conductive by desmearing, electroless plating, and electrolytic plating. Then, the inner layer material is subjected to an inner layer treatment (blackening treatment), and the resin-coated metal foil and the insulating film produced as described above are laminated on both sides on the resin layer side, and heated at 170 ° C. for 90 minutes.
A multilayer wiring board was manufactured by applying pressure at 2.94 MPa. In the case where a carrier in which a carrier film was arranged on a copper foil or an insulating film was used as the support, the carrier film on the surface was peeled off to obtain a multilayer wiring board.

Thereafter, the amount of depression (depth of the depression) on the surface of the resin layer above and below the through hole was measured by cross-sectional observation using an optical microscope. Depression amount is 0 μm or more 3
Those with a size of less than μm were rated as “○”, those with a size of 3 μm or more and less than 5 μm were rated as “Δ”, and those with a size of 5 μm or more were rated as “×”.

In this embodiment, the laminating direction is the vertical direction for convenience.

2. Void inside inner through hole In the multilayer wiring board manufactured in the above, the presence or absence of voids inside the through holes was confirmed by cross-sectional observation using an optical microscope.

3. Circuit pattern defects at upper and lower portions of inner layer through hole. Circuits were formed on both sides of the multilayer wiring board manufactured in the above step, and defects of the circuit patterns formed on the surfaces of the resin layers above and below the through holes were observed. A case where there was no defect in the circuit pattern was marked with “○”, a case where a defect was found in a part of the circuit pattern was marked with “△”, and a case where there was a defect in all circuit patterns was marked with “×”.

4. Resin residue at the bottom of IVH after laser processing As inner layer material, inner layer processing (blackening processing) on copper foil on the surface in advance
Using a 0.2 mm thick inner layer core double-sided board (“CR1766” manufactured by Matsushita Electric Works: copper foil thickness 35 μm)
The metal foil with resin produced as described above was laminated on both sides of the inner layer material on the side of the resin layer, and pressurized at 2.94 MPa while heating at 170 ° C. for 90 minutes to produce a multilayer wiring board. Thereafter, the copper foil on the surface was removed by etching to obtain a sample for laser processing.

On the other hand, in the case of an insulating film, the same kind of inner layer material as described above is used, and the insulating film produced as described above is superposed on both surfaces of the inner layer material on the resin layer side.
While heating at 90 ° C. for 90 minutes, pressure was applied at 2.94 MPa to produce a multilayer wiring board. Thereafter, the carrier film on the surface was peeled off to obtain a laser processing sample.

Next, a laser machine “ML505” manufactured by Mitsubishi Electric Corporation was used.
GT ", using a pulse frequency of 1500 Hz, a pulse width of 20 μs, an output of 5.4 mj / pulse, and an irradiation pulse number of 3 shots, the IVH (interstitial) was applied to the laser processing sample obtained as described above. via hol
e) After drilling, a scanning electron microscope (SE
M) was used to observe the inside of the hole to investigate the presence or absence of resin residue.

[0055]

[Table 1]

[0056]

[Table 2]

As shown in Tables 1 and 2, Examples 1 to
8 is a good result in all the evaluation items.

In Example 9, the thickness of the resin layer was 3
Since the thickness was less than 0 μm, some dents remained on the surface of the resin layer above and below the through holes of the inner layer material, and some of the circuit patterns formed on the surface of the resin layer were defective.

In Example 10, the thickness of the resin layer exceeded 150 μm, so that the resin residue remained at the bottom of the hole after laser processing.

In the case of the eleventh embodiment, since the lamination molding was performed under the atmospheric pressure, voids were generated inside the through holes of the inner layer material.

On the other hand, in the case of Comparative Example 1, the product of the bending elastic modulus and the thickness of the copper foil as the support was 3000 GPa · μm.
Because of this, large depressions were formed on the surface of the resin layer above and below the through holes of the inner layer material, and all the circuit patterns formed on the surface of the resin layer were defective.

[0062]

As described above, the composite according to claim 1 of the present invention is a composite prepared by applying a resin composition to one surface of a sheet-shaped support and forming a resin layer,
The product of the bending elastic modulus and the thickness of the support is 3000 GPa.
μm or more, so when performing lamination molding using an inner layer material having a through hole opening on the surface, it is not necessary to fill the inside of the through hole with a filling resin, simplifying the process, and This eliminates the occurrence of dents on the surface of the support near the holes.

According to a second aspect of the present invention, in the first aspect, since the support is a metal foil, the product of the flexural modulus and the thickness can be easily made 3000 GPa · μm or more.
The surface of the resin layer can be kept smooth until it is completely cured.

According to a third aspect of the present invention, in the second aspect, since the metal foil is a copper foil, the product of the flexural modulus and the thickness can be easily made 3000 GPa · μm or more, and the resin layer is completely formed. The surface of this layer can be kept smooth until it is cured, and the electrical reliability of the manufactured multilayer printed wiring board can be further improved.

According to a fourth aspect of the present invention, in the first aspect, since the support is a resin film, the surface of the resin layer can be kept smooth until the resin layer is completely cured. After that, the surface of the smooth resin layer can be exposed by peeling off the resin film.

According to a fifth aspect of the present invention, in the fourth aspect, the resin film is formed of a polyethylene terephthalate resin. Therefore, the polyethylene terephthalate resin which is relatively inexpensive and has good heat resistance is used. The surface of this layer can be kept smooth until the layer is completely cured, and after curing, the surface of the smooth resin layer can be exposed by peeling off the resin film.

According to a sixth aspect of the present invention, in the first aspect, since the support is formed of a metal foil and a resin film, the product of the flexural modulus and the thickness of only one of the metal foil and the resin film is used. Is less than 3000 GPa.mu.m, the other can be more than the above value by superposing the other as a carrier film.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, since the thickness of the resin layer is 30 to 150 μm, lamination molding is performed using an inner layer material having a through hole opening on the surface. In this case, it is not necessary to fill the inside of the through-hole with a filling resin, which simplifies the process, prevents dents from being formed on the outer surface of the laminated composite, and allows a hole to be formed in the resin layer. The productivity can be maintained at a high level without generating a resin residue at the bottom.

According to a eighth aspect of the present invention, there is provided a method of manufacturing a multilayer printed wiring board using the composite according to any one of the first to seventh aspects and an inner layer material having through holes formed therein. In doing so, under vacuum, the resin layer side of the above composite is overlapped with the surface of the inner layer material where the through hole is formed, and the inside of the through hole is filled with the resin composition of the resin layer. When performing lamination molding using an inner layer material having an opening, voids can be surely eliminated from the inside of the through hole without using a filling resin, and the inside of the through hole is filled with the resin composition. As a result, the support can maintain its smoothness without being affected at all, and no dent is formed on the outer surface of the support.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/46 H05K 3/46 G // H05K 3/00 3/00 RF term (Reference) 4F100 AB01A AB17 AB17A AB33A AK01A AK01B AK01C AK42 AK42A AK53 AT00A AT00C BA02 BA03 BA07 BA10A BA10B BA10C BA15 CA02 EH46 EH46B GB43 JA20A JA20B JK07A JL02 YY00A YY00B 5E314 AA32 FF05 FF12 AFF12 FF05 FF19 FF05 FF12 FF05 FF12 FF05 FF12 FF05 FF12 FF05 FF12 FF05 FF08 FF05 FF19 FF05 FF08 FF05 FF08

Claims (8)

[Claims] 1. A composite formed by applying a resin composition to one surface of a sheet-like support to form a resin layer, wherein the product of the flexural modulus and the thickness of the support is 3000G.
A composite having a Pa · μm or more. 2. The composite according to claim 1, wherein the support is a metal foil. 3. The composite according to claim 2, wherein the metal foil is a copper foil. 4. The composite according to claim 1, wherein the support is a resin film. 5. The composite according to claim 4, wherein the resin film is formed of a polyethylene terephthalate resin. 6. The composite according to claim 1, wherein the support is formed of a metal foil and a resin film. 7. The composite according to claim 1, wherein the thickness of the resin layer is 30 to 150 μm. 8. When manufacturing a multilayer printed wiring board using the composite according to any one of claims 1 to 7 and an inner layer material in which a through hole is formed, under a vacuum,
A method of manufacturing a multilayer printed wiring board, comprising: laminating a resin layer side of the above-mentioned composite on a surface of an inner layer material on which a through hole is formed, and filling the inside of the through hole with a resin composition of the resin layer.