JP2002126998A5 - - Google Patents

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Publication number
JP2002126998A5
JP2002126998A5 JP2000332134A JP2000332134A JP2002126998A5 JP 2002126998 A5 JP2002126998 A5 JP 2002126998A5 JP 2000332134 A JP2000332134 A JP 2000332134A JP 2000332134 A JP2000332134 A JP 2000332134A JP 2002126998 A5 JP2002126998 A5 JP 2002126998A5
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JP
Japan
Prior art keywords
polishing
tool
layer
workpiece
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000332134A
Other languages
English (en)
Japanese (ja)
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JP2002126998A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000332134A priority Critical patent/JP2002126998A/ja
Priority claimed from JP2000332134A external-priority patent/JP2002126998A/ja
Priority to US09/949,642 priority patent/US6531399B2/en
Priority to SG200105586A priority patent/SG106633A1/en
Priority to US09/949,605 priority patent/US6648728B2/en
Publication of JP2002126998A publication Critical patent/JP2002126998A/ja
Publication of JP2002126998A5 publication Critical patent/JP2002126998A5/ja
Pending legal-status Critical Current

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JP2000332134A 2000-10-26 2000-10-26 研磨方法および研磨装置 Pending JP2002126998A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000332134A JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置
US09/949,642 US6531399B2 (en) 2000-10-26 2001-09-12 Polishing method
SG200105586A SG106633A1 (en) 2000-10-26 2001-09-12 Polishing system
US09/949,605 US6648728B2 (en) 2000-10-26 2001-09-12 Polishing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332134A JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
JP2002126998A JP2002126998A (ja) 2002-05-08
JP2002126998A5 true JP2002126998A5 (enExample) 2004-11-11

Family

ID=18808376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000332134A Pending JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置

Country Status (3)

Country Link
US (2) US6648728B2 (enExample)
JP (1) JP2002126998A (enExample)
SG (1) SG106633A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7094695B2 (en) 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
JP2005347568A (ja) * 2004-06-03 2005-12-15 Ebara Corp 基板研磨方法及び基板研磨装置
US6939200B2 (en) 2003-09-16 2005-09-06 Hitachi Global Storage Technologies Netherlands B.V. Method of predicting plate lapping properties to improve slider fabrication yield
US6918815B2 (en) * 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
WO2005032763A1 (en) * 2003-09-30 2005-04-14 Advanced Micro Devices, Inc. A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
JP2005131732A (ja) * 2003-10-30 2005-05-26 Ebara Corp 研磨装置
US20050153631A1 (en) * 2004-01-13 2005-07-14 Psiloquest System and method for monitoring quality control of chemical mechanical polishing pads
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7077722B2 (en) * 2004-08-02 2006-07-18 Micron Technology, Inc. Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
US7914362B2 (en) * 2005-11-30 2011-03-29 Hitachi Global Storage Technologies, Netherlands B.V. Method of evaluating the quality of a lapping plate
US8047894B2 (en) * 2005-11-30 2011-11-01 Hitachi Global Storage Technologies, Netherlands, B.V. Apparatus for evaluating the quality of a lapping plate
US20100099333A1 (en) * 2008-10-20 2010-04-22 Fransisca Maria Astrid Sudargho Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishing
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
CN102501174A (zh) * 2011-11-02 2012-06-20 上海宏力半导体制造有限公司 化学机械研磨设备中的金刚石修整器的修整能力识别方法
US10643853B2 (en) * 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
GB201321899D0 (en) * 2013-12-11 2014-01-22 Element Six Ltd Post-synthesis processing of diamond and related super-hard materials
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
EP3218147B1 (en) * 2014-11-12 2022-08-10 Illinois Tool Works Inc. Planar grinder
CN105619206B (zh) * 2014-11-27 2018-04-13 上海中晶企业发展有限公司 校正盘自动除颤装置
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
CN115533753B (zh) * 2022-10-09 2024-06-14 湘潭大学 抛光装置和抛光装置在线修整方法
CN116515214A (zh) * 2023-05-18 2023-08-01 杭州人通管业有限公司 一种高强度pvc管及其制备工艺
US20250326085A1 (en) * 2024-04-23 2025-10-23 Wolfspeed, Inc. Method and System for Conditioning a Polishing Pad

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2298960B (en) 1992-05-26 1997-01-08 Toshiba Kk Polishing apparatus and method for planarizing layer on a semiconductor wafer
US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3278532B2 (ja) 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
US5743784A (en) 1995-12-19 1998-04-28 Applied Materials, Inc. Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
JPH10315124A (ja) 1997-05-16 1998-12-02 Hitachi Ltd 研磨方法および研磨装置
US6191038B1 (en) 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP2977543B2 (ja) 1997-09-02 1999-11-15 松下電子工業株式会社 化学的機械研磨装置及び化学的機械研磨方法
JP2956694B1 (ja) * 1998-05-19 1999-10-04 日本電気株式会社 研磨装置及び研磨方法
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

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