JP2002126998A - 研磨方法および研磨装置 - Google Patents

研磨方法および研磨装置

Info

Publication number
JP2002126998A
JP2002126998A JP2000332134A JP2000332134A JP2002126998A JP 2002126998 A JP2002126998 A JP 2002126998A JP 2000332134 A JP2000332134 A JP 2000332134A JP 2000332134 A JP2000332134 A JP 2000332134A JP 2002126998 A JP2002126998 A JP 2002126998A
Authority
JP
Japan
Prior art keywords
polishing
workpiece
tool
polishing tool
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000332134A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002126998A5 (enExample
Inventor
Hiroyuki Kojima
弘之 小島
Tetsuo Okawa
哲男 大川
Hidemi Sato
秀己 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000332134A priority Critical patent/JP2002126998A/ja
Priority to SG200105586A priority patent/SG106633A1/en
Priority to US09/949,642 priority patent/US6531399B2/en
Priority to US09/949,605 priority patent/US6648728B2/en
Publication of JP2002126998A publication Critical patent/JP2002126998A/ja
Publication of JP2002126998A5 publication Critical patent/JP2002126998A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2000332134A 2000-10-26 2000-10-26 研磨方法および研磨装置 Pending JP2002126998A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000332134A JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置
SG200105586A SG106633A1 (en) 2000-10-26 2001-09-12 Polishing system
US09/949,642 US6531399B2 (en) 2000-10-26 2001-09-12 Polishing method
US09/949,605 US6648728B2 (en) 2000-10-26 2001-09-12 Polishing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332134A JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置

Publications (2)

Publication Number Publication Date
JP2002126998A true JP2002126998A (ja) 2002-05-08
JP2002126998A5 JP2002126998A5 (enExample) 2004-11-11

Family

ID=18808376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000332134A Pending JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置

Country Status (3)

Country Link
US (2) US6648728B2 (enExample)
JP (1) JP2002126998A (enExample)
SG (1) SG106633A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347568A (ja) * 2004-06-03 2005-12-15 Ebara Corp 基板研磨方法及び基板研磨装置
JP2007524518A (ja) * 2003-09-30 2007-08-30 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム
US7413986B2 (en) 2001-06-19 2008-08-19 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
TWI705873B (zh) * 2016-09-30 2020-10-01 日商荏原製作所股份有限公司 基板研磨裝置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US7094695B2 (en) 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US6939200B2 (en) * 2003-09-16 2005-09-06 Hitachi Global Storage Technologies Netherlands B.V. Method of predicting plate lapping properties to improve slider fabrication yield
US6918815B2 (en) * 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
WO2005032763A1 (en) * 2003-09-30 2005-04-14 Advanced Micro Devices, Inc. A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
JP2005131732A (ja) * 2003-10-30 2005-05-26 Ebara Corp 研磨装置
US20050153631A1 (en) * 2004-01-13 2005-07-14 Psiloquest System and method for monitoring quality control of chemical mechanical polishing pads
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7077722B2 (en) * 2004-08-02 2006-07-18 Micron Technology, Inc. Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
US8047894B2 (en) * 2005-11-30 2011-11-01 Hitachi Global Storage Technologies, Netherlands, B.V. Apparatus for evaluating the quality of a lapping plate
US7914362B2 (en) * 2005-11-30 2011-03-29 Hitachi Global Storage Technologies, Netherlands B.V. Method of evaluating the quality of a lapping plate
US20100099333A1 (en) * 2008-10-20 2010-04-22 Fransisca Maria Astrid Sudargho Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishing
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
CN102501174A (zh) * 2011-11-02 2012-06-20 上海宏力半导体制造有限公司 化学机械研磨设备中的金刚石修整器的修整能力识别方法
US10643853B2 (en) * 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
GB201321899D0 (en) * 2013-12-11 2014-01-22 Element Six Ltd Post-synthesis processing of diamond and related super-hard materials
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
CN113290500A (zh) 2014-11-12 2021-08-24 伊利诺斯工具制品有限公司 平面研磨机
CN105619206B (zh) * 2014-11-27 2018-04-13 上海中晶企业发展有限公司 校正盘自动除颤装置
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
CN115533753B (zh) * 2022-10-09 2024-06-14 湘潭大学 抛光装置和抛光装置在线修整方法
CN116515214A (zh) * 2023-05-18 2023-08-01 杭州人通管业有限公司 一种高强度pvc管及其制备工艺
US20250326085A1 (en) * 2024-04-23 2025-10-23 Wolfspeed, Inc. Method and System for Conditioning a Polishing Pad

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2299895B (en) 1992-05-26 1997-01-08 Toshiba Kk polishing apparatus for planarizing layer on a semiconductor wafer
US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3278532B2 (ja) 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
US5743784A (en) 1995-12-19 1998-04-28 Applied Materials, Inc. Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
JPH10315124A (ja) * 1997-05-16 1998-12-02 Hitachi Ltd 研磨方法および研磨装置
JP2977543B2 (ja) * 1997-09-02 1999-11-15 松下電子工業株式会社 化学的機械研磨装置及び化学的機械研磨方法
US6191038B1 (en) 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
JP2956694B1 (ja) 1998-05-19 1999-10-04 日本電気株式会社 研磨装置及び研磨方法
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7413986B2 (en) 2001-06-19 2008-08-19 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
JP2007524518A (ja) * 2003-09-30 2007-08-30 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム
JP4815351B2 (ja) * 2003-09-30 2011-11-16 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド パッドコンディショナーのセンサー信号を使用して化学機械研磨を制御する方法およびシステム
JP2005347568A (ja) * 2004-06-03 2005-12-15 Ebara Corp 基板研磨方法及び基板研磨装置
TWI705873B (zh) * 2016-09-30 2020-10-01 日商荏原製作所股份有限公司 基板研磨裝置

Also Published As

Publication number Publication date
SG106633A1 (en) 2004-10-29
US20020076838A1 (en) 2002-06-20
US6531399B2 (en) 2003-03-11
US20020052166A1 (en) 2002-05-02
US6648728B2 (en) 2003-11-18

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