SG106633A1 - Polishing system - Google Patents

Polishing system

Info

Publication number
SG106633A1
SG106633A1 SG200105586A SG200105586A SG106633A1 SG 106633 A1 SG106633 A1 SG 106633A1 SG 200105586 A SG200105586 A SG 200105586A SG 200105586 A SG200105586 A SG 200105586A SG 106633 A1 SG106633 A1 SG 106633A1
Authority
SG
Singapore
Prior art keywords
polishing system
polishing
Prior art date
Application number
SG200105586A
Other languages
English (en)
Inventor
Kojima Hiroyuki
Ohkawa Tetsuo
Sato Hidemi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG106633A1 publication Critical patent/SG106633A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG200105586A 2000-10-26 2001-09-12 Polishing system SG106633A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332134A JP2002126998A (ja) 2000-10-26 2000-10-26 研磨方法および研磨装置

Publications (1)

Publication Number Publication Date
SG106633A1 true SG106633A1 (en) 2004-10-29

Family

ID=18808376

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200105586A SG106633A1 (en) 2000-10-26 2001-09-12 Polishing system

Country Status (3)

Country Link
US (2) US6531399B2 (enExample)
JP (1) JP2002126998A (enExample)
SG (1) SG106633A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7094695B2 (en) 2002-08-21 2006-08-22 Micron Technology, Inc. Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
JP2005347568A (ja) * 2004-06-03 2005-12-15 Ebara Corp 基板研磨方法及び基板研磨装置
US6939200B2 (en) * 2003-09-16 2005-09-06 Hitachi Global Storage Technologies Netherlands B.V. Method of predicting plate lapping properties to improve slider fabrication yield
US6918815B2 (en) * 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
WO2005032763A1 (en) * 2003-09-30 2005-04-14 Advanced Micro Devices, Inc. A method and system for controlling the chemical mechanical polishing by using a sensor signal of a pad conditioner
DE10345381B4 (de) * 2003-09-30 2013-04-11 Advanced Micro Devices, Inc. Verfahren und System zum Steuern des chemisch-mechanischen Polierens unter Anwendung eines Sensorsignals eines Kissenkonditionierers
JP2005131732A (ja) * 2003-10-30 2005-05-26 Ebara Corp 研磨装置
US20050153631A1 (en) * 2004-01-13 2005-07-14 Psiloquest System and method for monitoring quality control of chemical mechanical polishing pads
US7004814B2 (en) * 2004-03-19 2006-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. CMP process control method
US7077722B2 (en) * 2004-08-02 2006-07-18 Micron Technology, Inc. Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
US7914362B2 (en) * 2005-11-30 2011-03-29 Hitachi Global Storage Technologies, Netherlands B.V. Method of evaluating the quality of a lapping plate
US8047894B2 (en) * 2005-11-30 2011-11-01 Hitachi Global Storage Technologies, Netherlands, B.V. Apparatus for evaluating the quality of a lapping plate
US20100099333A1 (en) * 2008-10-20 2010-04-22 Fransisca Maria Astrid Sudargho Method and apparatus for determining shear force between the wafer head and polishing pad in chemical mechanical polishing
KR101126382B1 (ko) * 2010-05-10 2012-03-28 주식회사 케이씨텍 화학 기계식 연마시스템의 컨디셔너
JP5511600B2 (ja) * 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
CN102501174A (zh) * 2011-11-02 2012-06-20 上海宏力半导体制造有限公司 化学机械研磨设备中的金刚石修整器的修整能力识别方法
US10643853B2 (en) 2012-02-10 2020-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer thinning apparatus having feedback control and method of using
GB201321899D0 (en) * 2013-12-11 2014-01-22 Element Six Ltd Post-synthesis processing of diamond and related super-hard materials
JP6327958B2 (ja) * 2014-06-03 2018-05-23 株式会社荏原製作所 研磨装置
CN113290500A (zh) * 2014-11-12 2021-08-24 伊利诺斯工具制品有限公司 平面研磨机
CN105619206B (zh) * 2014-11-27 2018-04-13 上海中晶企业发展有限公司 校正盘自动除颤装置
JP6715153B2 (ja) * 2016-09-30 2020-07-01 株式会社荏原製作所 基板研磨装置
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
CN115533753B (zh) * 2022-10-09 2024-06-14 湘潭大学 抛光装置和抛光装置在线修整方法
CN116515214A (zh) * 2023-05-18 2023-08-01 杭州人通管业有限公司 一种高强度pvc管及其制备工艺
US20250326085A1 (en) * 2024-04-23 2025-10-23 Wolfspeed, Inc. Method and System for Conditioning a Polishing Pad

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2298960A (en) * 1992-05-26 1996-09-18 Toshiba Kk Polishing apparatus and method
JPH10315124A (ja) * 1997-05-16 1998-12-02 Hitachi Ltd 研磨方法および研磨装置
JPH11138418A (ja) * 1997-09-02 1999-05-25 Matsushita Electron Corp 化学的機械研磨装置及び化学的機械研磨方法
US6093080A (en) * 1998-05-19 2000-07-25 Nec Corporation Polishing apparatus and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700180A (en) 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3278532B2 (ja) * 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
US5743784A (en) 1995-12-19 1998-04-28 Applied Materials, Inc. Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
US6191038B1 (en) 1997-09-02 2001-02-20 Matsushita Electronics Corporation Apparatus and method for chemical/mechanical polishing
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2298960A (en) * 1992-05-26 1996-09-18 Toshiba Kk Polishing apparatus and method
JPH10315124A (ja) * 1997-05-16 1998-12-02 Hitachi Ltd 研磨方法および研磨装置
JPH11138418A (ja) * 1997-09-02 1999-05-25 Matsushita Electron Corp 化学的機械研磨装置及び化学的機械研磨方法
US6093080A (en) * 1998-05-19 2000-07-25 Nec Corporation Polishing apparatus and method

Also Published As

Publication number Publication date
US6648728B2 (en) 2003-11-18
US20020076838A1 (en) 2002-06-20
JP2002126998A (ja) 2002-05-08
US6531399B2 (en) 2003-03-11
US20020052166A1 (en) 2002-05-02

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