JPH10202522A5 - - Google Patents

Info

Publication number
JPH10202522A5
JPH10202522A5 JP1997010357A JP1035797A JPH10202522A5 JP H10202522 A5 JPH10202522 A5 JP H10202522A5 JP 1997010357 A JP1997010357 A JP 1997010357A JP 1035797 A JP1035797 A JP 1035797A JP H10202522 A5 JPH10202522 A5 JP H10202522A5
Authority
JP
Japan
Prior art keywords
polishing
progress
torque
integral value
drive mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997010357A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10202522A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP1035797A priority Critical patent/JPH10202522A/ja
Priority claimed from JP1035797A external-priority patent/JPH10202522A/ja
Publication of JPH10202522A publication Critical patent/JPH10202522A/ja
Publication of JPH10202522A5 publication Critical patent/JPH10202522A5/ja
Pending legal-status Critical Current

Links

JP1035797A 1997-01-23 1997-01-23 研磨方法 Pending JPH10202522A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1035797A JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1035797A JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Publications (2)

Publication Number Publication Date
JPH10202522A JPH10202522A (ja) 1998-08-04
JPH10202522A5 true JPH10202522A5 (enExample) 2004-12-24

Family

ID=11747930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1035797A Pending JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Country Status (1)

Country Link
JP (1) JPH10202522A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191037B1 (en) * 1998-09-03 2001-02-20 Micron Technology, Inc. Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
JP4615275B2 (ja) * 2004-09-21 2011-01-19 株式会社ディスコ ウェーハ研磨装置及びウェーハの研磨方法
US9289876B2 (en) * 2012-06-25 2016-03-22 Sumco Corporation Method and apparatus for polishing work
CN107363712B (zh) * 2017-08-18 2019-04-23 清华大学 用于化学机械抛光工艺的在线终点检测控制系统及方法
CN117810110B (zh) * 2024-02-29 2024-05-17 江苏元夫半导体科技有限公司 检测窗口确定方法及装置

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