JPH10202522A - 研磨方法 - Google Patents

研磨方法

Info

Publication number
JPH10202522A
JPH10202522A JP1035797A JP1035797A JPH10202522A JP H10202522 A JPH10202522 A JP H10202522A JP 1035797 A JP1035797 A JP 1035797A JP 1035797 A JP1035797 A JP 1035797A JP H10202522 A JPH10202522 A JP H10202522A
Authority
JP
Japan
Prior art keywords
polishing
torque
wafer
progress
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1035797A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10202522A5 (enExample
Inventor
Kiyoshi Miura
潔 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP1035797A priority Critical patent/JPH10202522A/ja
Publication of JPH10202522A publication Critical patent/JPH10202522A/ja
Publication of JPH10202522A5 publication Critical patent/JPH10202522A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP1035797A 1997-01-23 1997-01-23 研磨方法 Pending JPH10202522A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1035797A JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1035797A JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Publications (2)

Publication Number Publication Date
JPH10202522A true JPH10202522A (ja) 1998-08-04
JPH10202522A5 JPH10202522A5 (enExample) 2004-12-24

Family

ID=11747930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1035797A Pending JPH10202522A (ja) 1997-01-23 1997-01-23 研磨方法

Country Status (1)

Country Link
JP (1) JPH10202522A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093192A (ja) * 2004-09-21 2006-04-06 Disco Abrasive Syst Ltd ウェーハ研磨装置及びウェーハの研磨方法
US7132035B2 (en) * 1998-09-03 2006-11-07 Micron Technology, Inc. Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
TWI465317B (zh) * 2012-06-25 2014-12-21 Sumco Corp 工作件的硏磨方法及工作件的硏磨裝置
CN107363712A (zh) * 2017-08-18 2017-11-21 清华大学 用于化学机械抛光工艺的在线终点检测控制系统及方法
CN117810110A (zh) * 2024-02-29 2024-04-02 江苏元夫半导体科技有限公司 检测窗口确定方法及装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7132035B2 (en) * 1998-09-03 2006-11-07 Micron Technology, Inc. Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes
JP2006093192A (ja) * 2004-09-21 2006-04-06 Disco Abrasive Syst Ltd ウェーハ研磨装置及びウェーハの研磨方法
TWI465317B (zh) * 2012-06-25 2014-12-21 Sumco Corp 工作件的硏磨方法及工作件的硏磨裝置
CN107363712A (zh) * 2017-08-18 2017-11-21 清华大学 用于化学机械抛光工艺的在线终点检测控制系统及方法
CN107363712B (zh) * 2017-08-18 2019-04-23 清华大学 用于化学机械抛光工艺的在线终点检测控制系统及方法
CN117810110A (zh) * 2024-02-29 2024-04-02 江苏元夫半导体科技有限公司 检测窗口确定方法及装置
CN117810110B (zh) * 2024-02-29 2024-05-17 江苏元夫半导体科技有限公司 检测窗口确定方法及装置

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