JP2002124576A5 - - Google Patents

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Publication number
JP2002124576A5
JP2002124576A5 JP2001262668A JP2001262668A JP2002124576A5 JP 2002124576 A5 JP2002124576 A5 JP 2002124576A5 JP 2001262668 A JP2001262668 A JP 2001262668A JP 2001262668 A JP2001262668 A JP 2001262668A JP 2002124576 A5 JP2002124576 A5 JP 2002124576A5
Authority
JP
Japan
Prior art keywords
layer
conductive
insulating layer
landing
tapered landing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2001262668A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002124576A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2002124576A publication Critical patent/JP2002124576A/ja
Publication of JP2002124576A5 publication Critical patent/JP2002124576A5/ja
Abandoned legal-status Critical Current

Links

JP2001262668A 2000-08-31 2001-08-31 テーパランディングを有する構造及び製造方法 Abandoned JP2002124576A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65349200A 2000-08-31 2000-08-31
US09/653492 2000-08-31

Publications (2)

Publication Number Publication Date
JP2002124576A JP2002124576A (ja) 2002-04-26
JP2002124576A5 true JP2002124576A5 (enrdf_load_stackoverflow) 2004-09-09

Family

ID=24621097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001262668A Abandoned JP2002124576A (ja) 2000-08-31 2001-08-31 テーパランディングを有する構造及び製造方法

Country Status (4)

Country Link
JP (1) JP2002124576A (enrdf_load_stackoverflow)
KR (1) KR20020018606A (enrdf_load_stackoverflow)
GB (1) GB2371408B (enrdf_load_stackoverflow)
TW (1) TW582090B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4949656B2 (ja) * 2005-08-12 2012-06-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US11869725B2 (en) 2021-11-30 2024-01-09 Texas Instruments Incorporated Multi-stacked capacitor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5838605A (en) * 1996-03-20 1998-11-17 Ramtron International Corporation Iridium oxide local interconnect
US6114766A (en) * 1997-12-18 2000-09-05 Advanced Micro Devices, Inc. Integrated circuit with metal features presenting a larger landing area for vias

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