JP2002164430A5 - - Google Patents

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Publication number
JP2002164430A5
JP2002164430A5 JP2001262581A JP2001262581A JP2002164430A5 JP 2002164430 A5 JP2002164430 A5 JP 2002164430A5 JP 2001262581 A JP2001262581 A JP 2001262581A JP 2001262581 A JP2001262581 A JP 2001262581A JP 2002164430 A5 JP2002164430 A5 JP 2002164430A5
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JP
Japan
Prior art keywords
layer
conductive
semiconductor
level
narrow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2001262581A
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English (en)
Japanese (ja)
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JP2002164430A (ja
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Publication date
Application filed filed Critical
Publication of JP2002164430A publication Critical patent/JP2002164430A/ja
Publication of JP2002164430A5 publication Critical patent/JP2002164430A5/ja
Withdrawn legal-status Critical Current

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JP2001262581A 2000-08-31 2001-08-31 集積デバイス用デュアルダマシン接触 Withdrawn JP2002164430A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65244900A 2000-08-31 2000-08-31
US09/652449 2000-08-31

Publications (2)

Publication Number Publication Date
JP2002164430A JP2002164430A (ja) 2002-06-07
JP2002164430A5 true JP2002164430A5 (enrdf_load_stackoverflow) 2004-09-09

Family

ID=24616872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001262581A Withdrawn JP2002164430A (ja) 2000-08-31 2001-08-31 集積デバイス用デュアルダマシン接触

Country Status (3)

Country Link
JP (1) JP2002164430A (enrdf_load_stackoverflow)
KR (1) KR20020018610A (enrdf_load_stackoverflow)
GB (1) GB2371146A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100505682B1 (ko) * 2003-04-03 2005-08-03 삼성전자주식회사 금속-절연체-금속 커패시터를 포함하는 이중 다마신 배선구조 및 그 제조방법
US7859112B2 (en) * 2006-01-13 2010-12-28 Micron Technology, Inc. Additional metal routing in semiconductor devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5693563A (en) * 1996-07-15 1997-12-02 Chartered Semiconductor Manufacturing Pte Ltd. Etch stop for copper damascene process
FR2754391B1 (fr) * 1996-10-08 1999-04-16 Sgs Thomson Microelectronics Structure de contact a facteur de forme eleve pour circuits integres
JP3228181B2 (ja) * 1997-05-12 2001-11-12 ヤマハ株式会社 平坦配線形成法
US6100190A (en) * 1998-02-19 2000-08-08 Rohm Co., Ltd. Method of fabricating semiconductor device, and semiconductor device
JP3293792B2 (ja) * 1999-01-12 2002-06-17 日本電気株式会社 半導体装置及びその製造方法

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