JP2002164430A5 - - Google Patents
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- Publication number
- JP2002164430A5 JP2002164430A5 JP2001262581A JP2001262581A JP2002164430A5 JP 2002164430 A5 JP2002164430 A5 JP 2002164430A5 JP 2001262581 A JP2001262581 A JP 2001262581A JP 2001262581 A JP2001262581 A JP 2001262581A JP 2002164430 A5 JP2002164430 A5 JP 2002164430A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- semiconductor
- level
- narrow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000004020 conductor Substances 0.000 claims 9
- 238000001465 metallisation Methods 0.000 claims 5
- 239000003989 dielectric material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65244900A | 2000-08-31 | 2000-08-31 | |
US09/652449 | 2000-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002164430A JP2002164430A (ja) | 2002-06-07 |
JP2002164430A5 true JP2002164430A5 (enrdf_load_stackoverflow) | 2004-09-09 |
Family
ID=24616872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001262581A Withdrawn JP2002164430A (ja) | 2000-08-31 | 2001-08-31 | 集積デバイス用デュアルダマシン接触 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2002164430A (enrdf_load_stackoverflow) |
KR (1) | KR20020018610A (enrdf_load_stackoverflow) |
GB (1) | GB2371146A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100505682B1 (ko) * | 2003-04-03 | 2005-08-03 | 삼성전자주식회사 | 금속-절연체-금속 커패시터를 포함하는 이중 다마신 배선구조 및 그 제조방법 |
US7859112B2 (en) * | 2006-01-13 | 2010-12-28 | Micron Technology, Inc. | Additional metal routing in semiconductor devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5693563A (en) * | 1996-07-15 | 1997-12-02 | Chartered Semiconductor Manufacturing Pte Ltd. | Etch stop for copper damascene process |
FR2754391B1 (fr) * | 1996-10-08 | 1999-04-16 | Sgs Thomson Microelectronics | Structure de contact a facteur de forme eleve pour circuits integres |
JP3228181B2 (ja) * | 1997-05-12 | 2001-11-12 | ヤマハ株式会社 | 平坦配線形成法 |
US6100190A (en) * | 1998-02-19 | 2000-08-08 | Rohm Co., Ltd. | Method of fabricating semiconductor device, and semiconductor device |
JP3293792B2 (ja) * | 1999-01-12 | 2002-06-17 | 日本電気株式会社 | 半導体装置及びその製造方法 |
-
2001
- 2001-08-31 KR KR1020010053317A patent/KR20020018610A/ko not_active Withdrawn
- 2001-08-31 JP JP2001262581A patent/JP2002164430A/ja not_active Withdrawn
- 2001-08-31 GB GB0121198A patent/GB2371146A/en not_active Withdrawn
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