US7235432B2 - Method for producing an electrical conductor element - Google Patents
Method for producing an electrical conductor element Download PDFInfo
- Publication number
- US7235432B2 US7235432B2 US10/922,360 US92236004A US7235432B2 US 7235432 B2 US7235432 B2 US 7235432B2 US 92236004 A US92236004 A US 92236004A US 7235432 B2 US7235432 B2 US 7235432B2
- Authority
- US
- United States
- Prior art keywords
- layer
- conductor
- housing
- producing
- top layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 65
- 238000000465 moulding Methods 0.000 claims abstract description 16
- 238000005323 electroforming Methods 0.000 claims abstract description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
- Y10T29/49172—Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
Definitions
- the invention pertains to a method of producing an electrical conductor element and to an electrical conductor element produced by a molding process.
- a three-dimensional injection-molding conductor support in which conductors are embedded directly into a three-dimensional housing.
- several layers of conductors can be encapsulated within a housing.
- the conductors may be arranged on the surface of the housing which extend into three spatial directions.
- An electrical conductor element can, however, be produced by manufacturing a plastic foil and depositing a conductor trace on the plastic foil, for example by a screen-printing process. Subsequently, the plastic foil is thermoformed and the backside of the thermoformed foil is over-molding by a thicker layer providing the stability for a three-dimensional conductor element.
- a circuit structure is also known in the state of the art to deposit a circuit structure on a carrier film.
- a work piece is produced on the carrier film by a molding process. After the molding process, the carrier film is removed from the work piece.
- the work piece with the circuit structure constitutes an electrical conductor element with a housing.
- European patent application EP 1 246 308 A2 describes a pair of electrical conductors using resin solder in one conductor.
- the electrical conductor comprises a first housing which is made of a synthetic resin and a first terminal which has a contacting part and a connecting part, both being exposed on the surface of the first housing.
- a second electrical conductor comprises a second housing which is made of an insulating material, and a second terminal which is made of a conductive material of which the elasticity is higher than of the material of the first conductor.
- U.S. Pat. No. 4,147,740 describes a process for fabricating conductive patterns having sub-half micron dimensions.
- a mask and a lithographic process is disclosed for the formation of conductive patterns on substrates, particularly connection with the formation of high-electromobility transistors and metal semiconductor field effect transistors.
- the technique allows the formation of sub-half micron conductive patterns on semiconductor substrates using optical lithography and a multilayer portable conformable mask.
- the method includes the application of optical contact lithography to a conventional photoresist followed by a deep UV-flood exposure of an underlying multilayer portion.
- Metal is deposited on a semiconductor substrate through the mask formed by the photoresist and the underlying multilayer to produce sub-half micron conductive patterns.
- U.S. Pat. No. 6,218,203 B1 describes a method of producing a contact structure for achieving an electrical connection with a contact target.
- the contact structure includes a contactor formed on a planar surface of a substrate by means of a micro-fabrication technology.
- the production method involves a plastic molding technology.
- the production method involves a photolithography technology using a grey-tone photomask.
- the contactor has at least a horizontal portion formed on the substrate and a contact portion formed on one end of the horizontal portion. A spring force of the horizontal portion of the contactor provides a contact force when the contactor is pressed against the contact target.
- the contact structure includes a recess for providing a free space for the contactor when the contactor is pressed against the contact target.
- US patent application publication US 2002/0031905 A1 describes a method of producing a connection component.
- the method provides a movable layer having first and second surfaces and forming vias at spaced-apart first locations of a removable layer.
- a conductive material such as copper, is deposited over the first surface of the removable layer and in each of the vias to form one or more flexible leads including projections which downwardly extend to the wires towards the removable layer.
- Each lead includes a first end integrally connected to one of the projections and a second end.
- a substrate is provided over the conductive material. The removable layer is removed so that the first and the second ends of the leads can be moved away from each other. As a result, at least first or second ends of the leads are connected to the substrate without using a bonding or welding step.
- the metallic layer is covered with a photoresist layer.
- the photoresist layer is structured with a pattern of the conductor.
- the structured photoresist layer is used as a mask for forming a conductor by an electroforming process of the metallic layer. Using the photoresist layer as a mask for the electroforming process results in a simple and relatively inexpensive process.
- the photoresist layer is removed and the conductor element and the surface of the metallic layer is covered with a molding material by a molding process.
- the metallic layer is removed by an etching process.
- the conductor is formed with a smaller face upon the metallic layer and with a broader face with a shoulder upon the photoresist layer.
- FIG. 1 is a sectional view showing the first step in a process for producing an electrical connection element.
- FIG. 2 is a cross sectional view showing a subsequent step in the process wherein a photoresist layer is removed.
- FIG. 3 is cross sectional view showing a further step in the process wherein a starting layer is deposited.
- FIG. 4 is cross sectional view of a further step in the process wherein a filling layer is deposited.
- FIG. 5 is cross sectional view showing a further step in the process wherein a second top layer is applied.
- FIG. 6 is a perspective view of a flexible circuit film formed according to the invention.
- FIG. 7 is a cross sectional view showing a further step wherein molding of a housing over the conductors is shown.
- FIG. 8 is a cross sectional view showing a further step of the process wherein the metallic layer is removed.
- FIGS. 1 to 8 show different steps of the production process for producing an electrical connection element with a housing and a conductor embedded therein.
- FIG. 1 shows a sectional view of a metallic layer 10 that is covered with a top layer 16 .
- An aluminium foil is preferably used for the metallic layer 10 .
- the thickness of the aluminium foil may vary between 50 and 100 ⁇ m.
- the top layer 16 may be a copper layer with a thickness between 1 and 10 ⁇ m.
- On the top layer 16 a photoresist layer 12 is deposited.
- the photoresist layer 12 is covered with a photomask layer 11 .
- the photoresist layer 12 is structured using the photomask layer 11 according to a pattern of a conductor. For this purpose, the photoresist layer 12 is removed in the given pattern from the metallic layer 10 as shown in FIG. 2 .
- Recesses 14 of the photoresist layer 12 have the shape of the conductor 13 . Then the photomask layer 11 is removed from the photoresist layer 12 .
- a starting layer 17 made of nickel is deposited by an electroforming process on the free surface of the top layer 16 .
- the starting layer may have a thickness of about 2 to 8 ⁇ m.
- a filling layer 18 is deposited on the starting layer 17 by means of an electroforming process.
- the filling layer 18 may be made of copper and have a plane end face to the photoresist layer 12 .
- the starting layer 17 and the filling layer 18 constitute the conductor 13 that are shaped as lines. This is shown in FIG. 3 .
- the metallic layer of these conductors 13 is made for example of an aluminium or copper or a combination of a aluminium/copper layer.
- the filling layer 18 is deposited with shoulders 19 that are arranged on the surface of the photoresist layer 12 .
- the filling layer 18 may take a mushroom like shape as shown in the cross-sectional view of FIG. 4 .
- the filling layer 18 is deposited in the recesses 14 of the photoresist layer 12 .
- material is also deposited onto the surface of the photoresist layer 12 at the border of the recesses 14 . Therefore, shoulders 19 of the conductor 13 are arranged on the photoresist layer 12 .
- a second top layer 20 is deposited on the top of the filling layer 18 as shown in FIG. 5 .
- the second top layer 20 is made of an alloy of nickel and gold by a plating process or is made of a tin layer produced by an immersion process.
- the metallic layer with the conductors 13 constitutes a flexible circuit film.
- the flexible circuit film may be cut and/or formed in three spatial directions, as shown in FIG. 6 .
- the photoresist layer 12 is removed for example by an etching process and the conductors 13 and the free surfaces of the metallic layer 10 are covered by a molding process with a molding material 21 .
- a molding material 21 For example, a plastic compound may be used as a molding material.
- the molding material constitutes a housing 15 in which the conductors 13 are embedded. This process step is shown in FIG. 7 .
- the metallic layer 10 is removed from the conductors 13 and the top layer 16 is removed by an etching process.
- the top layer 16 is removed and the starting layer 17 is covered with a third top layer 22 .
- the third top layer 22 is produced by the same process and the same material as the second top layer 20 .
- This process step is shown in FIG. 8 .
- the housing could have the shape of a small plate so that the housing constitutes an electrically isolated layer that could be formed by a subsequent forming process to create a three-dimensional molding interconnect device.
- the process could be used for producing an electrical conductor element, for example a coaxial conductor for mobile phones.
- the coax conductor could be used as a switching coax conductor for mobile phones used for testing and for car kit applications.
- the switching function of the coax conductor may be used for transmitting the signal from an internal phone antenna of the mobile phone to an external car antenna.
- An advantage of the invention is to use a combination of the electroforming process and the molding process to produce an electrical conductor element with an embedded conductor.
- the advantage of the process according to the claimed invention is that the two processes are well-known and could be advantageously combined to a new process which allows for a relatively inexpensive and reliable production for an electrical conductor element with an embedded conductor.
- the particular shape of the conductor having a shoulder has the advantage that the conductor is assuredly affixed in the housing by the shoulder.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03019030.0 | 2003-08-22 | ||
EP03019030 | 2003-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20050076499A1 US20050076499A1 (en) | 2005-04-14 |
US7235432B2 true US7235432B2 (en) | 2007-06-26 |
Family
ID=34400455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/922,360 Expired - Fee Related US7235432B2 (en) | 2003-08-22 | 2004-08-20 | Method for producing an electrical conductor element |
Country Status (3)
Country | Link |
---|---|
US (1) | US7235432B2 (en) |
JP (1) | JP4942291B2 (en) |
CN (1) | CN100543884C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI498062B (en) * | 2014-01-17 | 2015-08-21 | Kaitronic Technology Co Ltd | The process of carrying board |
TWI566309B (en) * | 2016-01-08 | 2017-01-11 | 恆勁科技股份有限公司 | Method of fabricating package substrates |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4147740A (en) | 1976-09-15 | 1979-04-03 | General Electric Company | Graft modified polyethylene process and product |
US6218203B1 (en) | 1999-06-28 | 2001-04-17 | Advantest Corp. | Method of producing a contact structure |
US20020031905A1 (en) | 2000-01-26 | 2002-03-14 | Masud Beroz | Methods of making a connection component |
EP1246308A2 (en) | 2001-03-30 | 2002-10-02 | J.S.T. Mfg. Co., Ltd. | A pair of electric connectors using resin solder in one connector |
US20060060981A1 (en) * | 2000-06-27 | 2006-03-23 | Infineon Technologies Ag | Production methods for a leadframe and electronic devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8824826D0 (en) * | 1988-10-24 | 1988-11-30 | Moran P | Moulded circuit board |
JPH04130792A (en) * | 1990-09-21 | 1992-05-01 | Tanaka Kikinzoku Kogyo Kk | Manufacture of circuit board |
JP2002004077A (en) * | 2000-06-20 | 2002-01-09 | Kyushu Hitachi Maxell Ltd | Electroforming product and method for manufacturing the same |
-
2004
- 2004-08-18 CN CN200410057810.7A patent/CN100543884C/en not_active Expired - Fee Related
- 2004-08-20 JP JP2004240665A patent/JP4942291B2/en not_active Expired - Fee Related
- 2004-08-20 US US10/922,360 patent/US7235432B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4147740A (en) | 1976-09-15 | 1979-04-03 | General Electric Company | Graft modified polyethylene process and product |
US6218203B1 (en) | 1999-06-28 | 2001-04-17 | Advantest Corp. | Method of producing a contact structure |
US20020031905A1 (en) | 2000-01-26 | 2002-03-14 | Masud Beroz | Methods of making a connection component |
US20060060981A1 (en) * | 2000-06-27 | 2006-03-23 | Infineon Technologies Ag | Production methods for a leadframe and electronic devices |
EP1246308A2 (en) | 2001-03-30 | 2002-10-02 | J.S.T. Mfg. Co., Ltd. | A pair of electric connectors using resin solder in one connector |
Also Published As
Publication number | Publication date |
---|---|
US20050076499A1 (en) | 2005-04-14 |
CN100543884C (en) | 2009-09-23 |
JP4942291B2 (en) | 2012-05-30 |
JP2005072001A (en) | 2005-03-17 |
CN1591703A (en) | 2005-03-09 |
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Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
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Effective date: 20190626 |