JP2002097424A - 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 - Google Patents

熱硬化型導電性接着シート、それを用いた接続構造及び接続方法

Info

Publication number
JP2002097424A
JP2002097424A JP2000273119A JP2000273119A JP2002097424A JP 2002097424 A JP2002097424 A JP 2002097424A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2002097424 A JP2002097424 A JP 2002097424A
Authority
JP
Japan
Prior art keywords
conductive
adhesive
thermosetting
layer
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2000273119A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002097424A5 (https=
Inventor
Koichiro Kawate
恒一郎 川手
Yuji Hirasawa
雄二 平澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2000273119A priority Critical patent/JP2002097424A/ja
Priority to CNB018154077A priority patent/CN100469851C/zh
Priority to KR1020037003369A priority patent/KR100617410B1/ko
Priority to EP01968695A priority patent/EP1315780A2/en
Priority to PCT/US2001/028141 priority patent/WO2002020686A2/en
Priority to AU2001288925A priority patent/AU2001288925A1/en
Publication of JP2002097424A publication Critical patent/JP2002097424A/ja
Publication of JP2002097424A5 publication Critical patent/JP2002097424A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)
JP2000273119A 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 Ceased JP2002097424A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000273119A JP2002097424A (ja) 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法
CNB018154077A CN100469851C (zh) 2000-09-08 2001-09-07 可热固化的导电性粘合片、连接结构以及使用它们的连接方法
KR1020037003369A KR100617410B1 (ko) 2000-09-08 2001-09-07 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법
EP01968695A EP1315780A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
PCT/US2001/028141 WO2002020686A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same
AU2001288925A AU2001288925A1 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000273119A JP2002097424A (ja) 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法

Publications (2)

Publication Number Publication Date
JP2002097424A true JP2002097424A (ja) 2002-04-02
JP2002097424A5 JP2002097424A5 (https=) 2007-10-25

Family

ID=18759125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000273119A Ceased JP2002097424A (ja) 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法

Country Status (6)

Country Link
EP (1) EP1315780A2 (https=)
JP (1) JP2002097424A (https=)
KR (1) KR100617410B1 (https=)
CN (1) CN100469851C (https=)
AU (1) AU2001288925A1 (https=)
WO (1) WO2002020686A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041526A1 (ja) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
WO2009041506A1 (ja) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
JP2023096565A (ja) * 2021-12-27 2023-07-07 株式会社レゾナック ランプユニットの製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624187B1 (en) 2000-06-12 2003-09-23 Health Research, Inc. Long wave length absorbing bacteriochlorin alkyl ether analogs
JP2007005640A (ja) 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
EP2146355A1 (en) * 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Conductor connection member, connection structure, and solar cell module
EP2255406A2 (en) * 2008-03-19 2010-12-01 Philips Intellectual Property & Standards GmbH Connector for establishing an electrical connection with conductive tape
DE102011100457A1 (de) * 2011-05-04 2012-11-08 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit einem Trägerelement, einer Verbindungsstruktur und einem Halbleiterchip
JP5952078B2 (ja) * 2011-06-23 2016-07-13 日東電工株式会社 導電性熱硬化型接着テープ
JP2013116929A (ja) * 2011-12-01 2013-06-13 Nitto Denko Corp 導電性接着シート、その製造方法、集電電極および太陽電池モジュール
US9238760B2 (en) 2012-03-30 2016-01-19 Adhesives Research, Inc. Charge collection side adhesive tape
CN210120253U (zh) 2016-07-28 2020-02-28 3M创新有限公司 电缆和电缆组件
JP6959948B2 (ja) * 2017-02-13 2021-11-05 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
KR20210094195A (ko) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176037A (ja) * 1983-01-24 1984-10-05 ミネソタ　マイニング　アンド　マニユフアクチユアリング　コンパニー 電気的接続に用いるシ−ト物質
JPH10287848A (ja) * 1997-02-14 1998-10-27 Hitachi Chem Co Ltd 回路部材接続用接着剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497383A (en) * 1967-08-22 1970-02-24 Minnesota Mining & Mfg Electrically conductive adhesive tape
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A3 (en) * 1986-02-07 1988-12-28 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
JPS62227986A (ja) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd 導電性両面テ−プ
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59176037A (ja) * 1983-01-24 1984-10-05 ミネソタ　マイニング　アンド　マニユフアクチユアリング　コンパニー 電気的接続に用いるシ−ト物質
JPH10287848A (ja) * 1997-02-14 1998-10-27 Hitachi Chem Co Ltd 回路部材接続用接着剤

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041526A1 (ja) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
WO2009041506A1 (ja) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
US20100288328A1 (en) * 2007-09-26 2010-11-18 Hitachi Chemical Company, Ltd. Conductor-connecting member, method for producing the same, connection structure, and solar cell module
JPWO2009041506A1 (ja) * 2007-09-26 2011-01-27 日立化成工業株式会社 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
KR101108862B1 (ko) * 2007-09-26 2012-01-31 히다치 가세고교 가부시끼가이샤 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈
JP5029695B2 (ja) * 2007-09-26 2012-09-19 日立化成工業株式会社 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
JP2023096565A (ja) * 2021-12-27 2023-07-07 株式会社レゾナック ランプユニットの製造方法

Also Published As

Publication number Publication date
WO2002020686A3 (en) 2002-06-06
CN1639290A (zh) 2005-07-13
EP1315780A2 (en) 2003-06-04
KR20040030406A (ko) 2004-04-09
KR100617410B1 (ko) 2006-09-01
AU2001288925A1 (en) 2002-03-22
WO2002020686A2 (en) 2002-03-14
CN100469851C (zh) 2009-03-18

Similar Documents

Publication Publication Date Title
US6908318B2 (en) Batch electrically connecting sheet
JP2002097424A (ja) 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法
EP1063737B1 (en) Method for manufacturing a film-type data carrier
EP0870346B1 (en) Electrical connection method
EP0134623B1 (en) Electrically and thermally conductive adhesive transfer tape
JPH06262375A (ja) 銅または銅合金の低温拡散接合方法およびそれを用いた導電ペーストおよび多層配線基板の製造方法
WO2006110634A2 (en) Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
JP2005064239A (ja) 半導体装置の製造方法
JP7484268B2 (ja) 金属部材の仮止め方法、接合体の製造方法、及び、絶縁回路基板の製造方法
JP5631654B2 (ja) 実装体の製造方法及び接続方法
JP2003069198A (ja) 一括電気接続用シート
JPH0628121B2 (ja) 異方導電フイルム
JP2006024751A (ja) 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP2019036588A (ja) 電磁波シールド電子機器の製造方法、および前記電磁波シールド電子機器の製造方法に用いられる電磁波シールドフィルム
JP2007122965A (ja) 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法
JP2005149877A (ja) 発熱体およびその製造方法
JP4241148B2 (ja) Ｉｃカード及びその製造方法
JPH0677980B2 (ja) 基板への貴金属箔の圧着方法
JPH0539464A (ja) 接着フイルムおよびフイルムキヤリアならびにそれを用いた接続構造
JP2001068832A (ja) 配線板とその製造方法
JP2003069216A (ja) 導電接続部同士の接続方法
JPH04180029A (ja) 回路の接続構造体
JP6286473B2 (ja) 接合体
JP2601015B2 (ja) メッキ装置
JPS59159587A (ja) 金属ベ−ス印刷回路用積層板及びその製造方法

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050323

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20050323

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070906

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100825

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100831

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20101129

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20101203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20111129

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111219

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120522

A045 Written measure of dismissal of application [lapsed due to lack of payment]

Free format text: JAPANESE INTERMEDIATE CODE: A045

Effective date: 20120925