KR100617410B1 - 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법 - Google Patents

열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법 Download PDF

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Publication number
KR100617410B1
KR100617410B1 KR1020037003369A KR20037003369A KR100617410B1 KR 100617410 B1 KR100617410 B1 KR 100617410B1 KR 1020037003369 A KR1020037003369 A KR 1020037003369A KR 20037003369 A KR20037003369 A KR 20037003369A KR 100617410 B1 KR100617410 B1 KR 100617410B1
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KR
South Korea
Prior art keywords
adhesive
thermosetting
layer
electrically conductive
sheet
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037003369A
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English (en)
Korean (ko)
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KR20040030406A (ko
Inventor
가와떼고오이찌로
히라사와유우지
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 캄파니
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Publication of KR20040030406A publication Critical patent/KR20040030406A/ko
Application granted granted Critical
Publication of KR100617410B1 publication Critical patent/KR100617410B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulating Bodies (AREA)
KR1020037003369A 2000-09-08 2001-09-07 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법 Expired - Fee Related KR100617410B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00273119 2000-09-08
JP2000273119A JP2002097424A (ja) 2000-09-08 2000-09-08 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法
PCT/US2001/028141 WO2002020686A2 (en) 2000-09-08 2001-09-07 Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same

Publications (2)

Publication Number Publication Date
KR20040030406A KR20040030406A (ko) 2004-04-09
KR100617410B1 true KR100617410B1 (ko) 2006-09-01

Family

ID=18759125

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037003369A Expired - Fee Related KR100617410B1 (ko) 2000-09-08 2001-09-07 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법

Country Status (6)

Country Link
EP (1) EP1315780A2 (https=)
JP (1) JP2002097424A (https=)
KR (1) KR100617410B1 (https=)
CN (1) CN100469851C (https=)
AU (1) AU2001288925A1 (https=)
WO (1) WO2002020686A2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624187B1 (en) 2000-06-12 2003-09-23 Health Research, Inc. Long wave length absorbing bacteriochlorin alkyl ether analogs
JP2007005640A (ja) 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
EP2146355A1 (en) * 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Conductor connection member, connection structure, and solar cell module
JPWO2009041506A1 (ja) * 2007-09-26 2011-01-27 日立化成工業株式会社 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
WO2009041526A1 (ja) * 2007-09-26 2009-04-02 Hitachi Chemical Company, Ltd. 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール
EP2255406A2 (en) * 2008-03-19 2010-12-01 Philips Intellectual Property & Standards GmbH Connector for establishing an electrical connection with conductive tape
DE102011100457A1 (de) * 2011-05-04 2012-11-08 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit einem Trägerelement, einer Verbindungsstruktur und einem Halbleiterchip
JP5952078B2 (ja) * 2011-06-23 2016-07-13 日東電工株式会社 導電性熱硬化型接着テープ
JP2013116929A (ja) * 2011-12-01 2013-06-13 Nitto Denko Corp 導電性接着シート、その製造方法、集電電極および太陽電池モジュール
US9238760B2 (en) 2012-03-30 2016-01-19 Adhesives Research, Inc. Charge collection side adhesive tape
CN210120253U (zh) 2016-07-28 2020-02-28 3M创新有限公司 电缆和电缆组件
JP6959948B2 (ja) * 2017-02-13 2021-11-05 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
KR20210094195A (ko) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법
JP2023096565A (ja) * 2021-12-27 2023-07-07 株式会社レゾナック ランプユニットの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3497383A (en) * 1967-08-22 1970-02-24 Minnesota Mining & Mfg Electrically conductive adhesive tape
ES276990Y (es) * 1983-01-24 1985-01-16 Minnesota Mining And Manufacturing Company Articulo laminar para efectuar conexiones electricas de union a un sustrato
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
EP0237176A3 (en) * 1986-02-07 1988-12-28 Minnesota Mining And Manufacturing Company Connector with fine-pitched conductive passages
JPS62227986A (ja) * 1986-03-31 1987-10-06 Fujikura Rubber Ltd 導電性両面テ−プ
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms
JP4514840B2 (ja) * 1997-02-14 2010-07-28 日立化成工業株式会社 回路部材接続用接着剤

Also Published As

Publication number Publication date
WO2002020686A3 (en) 2002-06-06
CN1639290A (zh) 2005-07-13
EP1315780A2 (en) 2003-06-04
KR20040030406A (ko) 2004-04-09
AU2001288925A1 (en) 2002-03-22
WO2002020686A2 (en) 2002-03-14
JP2002097424A (ja) 2002-04-02
CN100469851C (zh) 2009-03-18

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