JP2002097424A - 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 - Google Patents
熱硬化型導電性接着シート、それを用いた接続構造及び接続方法Info
- Publication number
- JP2002097424A JP2002097424A JP2000273119A JP2000273119A JP2002097424A JP 2002097424 A JP2002097424 A JP 2002097424A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2000273119 A JP2000273119 A JP 2000273119A JP 2002097424 A JP2002097424 A JP 2002097424A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive
- thermosetting
- adhesive layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Insulating Bodies (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000273119A JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
AU2001288925A AU2001288925A1 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
CNB018154077A CN100469851C (zh) | 2000-09-08 | 2001-09-07 | 可热固化的导电性粘合片、连接结构以及使用它们的连接方法 |
KR1020037003369A KR100617410B1 (ko) | 2000-09-08 | 2001-09-07 | 열경화성 전기전도성 접착 시트, 이를 이용한 연결 구조체및 연결 방법 |
EP01968695A EP1315780A2 (de) | 2000-09-08 | 2001-09-07 | Wärmevernetzbare, elektrisch leitende klebefolie, verbindungsstruktur und die folie verwendende verbindungsmethode |
PCT/US2001/028141 WO2002020686A2 (en) | 2000-09-08 | 2001-09-07 | Thermocurable electroconductive adhesive sheet, connection structure and connection method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000273119A JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002097424A true JP2002097424A (ja) | 2002-04-02 |
JP2002097424A5 JP2002097424A5 (de) | 2007-10-25 |
Family
ID=18759125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000273119A Ceased JP2002097424A (ja) | 2000-09-08 | 2000-09-08 | 熱硬化型導電性接着シート、それを用いた接続構造及び接続方法 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1315780A2 (de) |
JP (1) | JP2002097424A (de) |
KR (1) | KR100617410B1 (de) |
CN (1) | CN100469851C (de) |
AU (1) | AU2001288925A1 (de) |
WO (1) | WO2002020686A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009041506A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
WO2009041526A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6624187B1 (en) | 2000-06-12 | 2003-09-23 | Health Research, Inc. | Long wave length absorbing bacteriochlorin alkyl ether analogs |
JP2007005640A (ja) | 2005-06-24 | 2007-01-11 | Three M Innovative Properties Co | 回路基板の相互接続方法 |
CN102332478A (zh) * | 2007-05-09 | 2012-01-25 | 日立化成工业株式会社 | 导电体连接用部件、连接结构和太阳能电池组件 |
US8492653B2 (en) * | 2008-03-19 | 2013-07-23 | Koninklijke Philips Electronics N.V. | Connector for establishing an electrical connection with conductive tape |
DE102011100457A1 (de) * | 2011-05-04 | 2012-11-08 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit einem Trägerelement, einer Verbindungsstruktur und einem Halbleiterchip |
JP5952078B2 (ja) * | 2011-06-23 | 2016-07-13 | 日東電工株式会社 | 導電性熱硬化型接着テープ |
JP2013116929A (ja) * | 2011-12-01 | 2013-06-13 | Nitto Denko Corp | 導電性接着シート、その製造方法、集電電極および太陽電池モジュール |
WO2013148967A1 (en) * | 2012-03-30 | 2013-10-03 | Adhesives Research, Inc. | Charge collection tape |
WO2018022379A1 (en) | 2016-07-28 | 2018-02-01 | 3M Innovative Properties Company | Electrical cable |
WO2018147426A1 (ja) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法 |
KR20210094195A (ko) * | 2020-01-20 | 2021-07-29 | 삼성디스플레이 주식회사 | 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3497383A (en) * | 1967-08-22 | 1970-02-24 | Minnesota Mining & Mfg | Electrically conductive adhesive tape |
AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
EP0237176A3 (de) * | 1986-02-07 | 1988-12-28 | Minnesota Mining And Manufacturing Company | Verbinder mit Leiterbahnen mit kleinem Abstand |
JPS62227986A (ja) * | 1986-03-31 | 1987-10-06 | Fujikura Rubber Ltd | 導電性両面テ−プ |
WO1994024704A1 (en) * | 1993-04-12 | 1994-10-27 | Bolger Justin C | Area bonding conductive adhesive preforms |
-
2000
- 2000-09-08 JP JP2000273119A patent/JP2002097424A/ja not_active Ceased
-
2001
- 2001-09-07 EP EP01968695A patent/EP1315780A2/de not_active Withdrawn
- 2001-09-07 CN CNB018154077A patent/CN100469851C/zh not_active Expired - Fee Related
- 2001-09-07 WO PCT/US2001/028141 patent/WO2002020686A2/en active IP Right Grant
- 2001-09-07 AU AU2001288925A patent/AU2001288925A1/en not_active Abandoned
- 2001-09-07 KR KR1020037003369A patent/KR100617410B1/ko not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009041506A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
WO2009041526A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
US20100288328A1 (en) * | 2007-09-26 | 2010-11-18 | Hitachi Chemical Company, Ltd. | Conductor-connecting member, method for producing the same, connection structure, and solar cell module |
JPWO2009041506A1 (ja) * | 2007-09-26 | 2011-01-27 | 日立化成工業株式会社 | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
KR101108862B1 (ko) * | 2007-09-26 | 2012-01-31 | 히다치 가세고교 가부시끼가이샤 | 도전체 접속용 부재 및 그의 제조 방법, 접속 구조, 및 태양 전지 모듈 |
JP5029695B2 (ja) * | 2007-09-26 | 2012-09-19 | 日立化成工業株式会社 | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN100469851C (zh) | 2009-03-18 |
KR100617410B1 (ko) | 2006-09-01 |
EP1315780A2 (de) | 2003-06-04 |
WO2002020686A3 (en) | 2002-06-06 |
KR20040030406A (ko) | 2004-04-09 |
WO2002020686A2 (en) | 2002-03-14 |
CN1639290A (zh) | 2005-07-13 |
AU2001288925A1 (en) | 2002-03-22 |
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