|
US20030102527A1
(en)
*
|
1997-12-31 |
2003-06-05 |
Bily Wang |
Method of fabricating light emitting diode package
|
|
US7268479B2
(en)
*
|
2001-02-15 |
2007-09-11 |
Integral Technologies, Inc. |
Low cost lighting circuits manufactured from conductive loaded resin-based materials
|
|
DE10142654A1
(de)
*
|
2001-08-31 |
2003-04-03 |
Osram Opto Semiconductors Gmbh |
Sicherungsbauelement mit optischer Anzeige
|
|
US6906403B2
(en)
*
|
2002-06-04 |
2005-06-14 |
Micron Technology, Inc. |
Sealed electronic device packages with transparent coverings
|
|
DE10246786A1
(de)
*
|
2002-10-08 |
2004-04-22 |
Ultrastar Limited |
Gehäusekonstruktion einer LED für Oberflächenmontage sowie Verfahren zum Herstellen derselben
|
|
ITMI20022467A1
(it)
*
|
2002-11-20 |
2004-05-21 |
St Microelectronics Srl |
Processo per realizzare un transistore di selezione di byte per
|
|
TW560697U
(en)
*
|
2002-11-26 |
2003-11-01 |
Topson Technology Co Ltd |
Surface-mounting type light-emitting diode structure
|
|
JP4281363B2
(ja)
*
|
2003-01-20 |
2009-06-17 |
パナソニック電工株式会社 |
配線板及び発光装置
|
|
US7734168B2
(en)
*
|
2003-01-21 |
2010-06-08 |
Fujifilm Corporation |
Lighting apparatus, electronic flash apparatus and camera
|
|
JP3948417B2
(ja)
*
|
2003-02-28 |
2007-07-25 |
ノーリツ鋼機株式会社 |
光源ユニット
|
|
US20040173808A1
(en)
*
|
2003-03-07 |
2004-09-09 |
Bor-Jen Wu |
Flip-chip like light emitting device package
|
|
US7220020B2
(en)
*
|
2003-05-06 |
2007-05-22 |
Ji-Mei Tsuei |
Light source device
|
|
US6995402B2
(en)
*
|
2003-10-03 |
2006-02-07 |
Lumileds Lighting, U.S., Llc |
Integrated reflector cup for a light emitting device mount
|
|
KR100604602B1
(ko)
|
2004-05-19 |
2006-07-24 |
서울반도체 주식회사 |
발광 다이오드 렌즈 및 그것을 갖는 발광 다이오드
|
|
JP2006093672A
(ja)
*
|
2004-08-26 |
2006-04-06 |
Toshiba Corp |
半導体発光装置
|
|
US7405433B2
(en)
|
2005-02-22 |
2008-07-29 |
Avago Technologies Ecbu Ip Pte Ltd |
Semiconductor light emitting device
|
|
US20070200133A1
(en)
*
|
2005-04-01 |
2007-08-30 |
Akira Hashimoto |
Led assembly and manufacturing method
|
|
JP4915052B2
(ja)
*
|
2005-04-01 |
2012-04-11 |
パナソニック株式会社 |
Led部品およびその製造方法
|
|
US20080278954A1
(en)
*
|
2005-04-05 |
2008-11-13 |
Tir Systems Ltd. |
Mounting Assembly for Optoelectronic Devices
|
|
KR100691174B1
(ko)
|
2005-05-24 |
2007-03-09 |
삼성전기주식회사 |
측면형 발광 다이오드 및 그 제조방법
|
|
US7105863B1
(en)
|
2005-06-03 |
2006-09-12 |
Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. |
Light source with improved life
|
|
JP2007088155A
(ja)
*
|
2005-09-21 |
2007-04-05 |
Stanley Electric Co Ltd |
表面実装型led基板
|
|
US8011082B2
(en)
*
|
2005-11-09 |
2011-09-06 |
Koninklijke Philips Electronics N.V. |
Method of manufacturing a package carrier
|
|
US8044412B2
(en)
|
2006-01-20 |
2011-10-25 |
Taiwan Semiconductor Manufacturing Company, Ltd |
Package for a light emitting element
|
|
JP4654942B2
(ja)
*
|
2006-02-28 |
2011-03-23 |
ミネベア株式会社 |
面状照明装置
|
|
KR20080032882A
(ko)
*
|
2006-10-11 |
2008-04-16 |
삼성전기주식회사 |
발광 다이오드 패키지
|
|
US20080246397A1
(en)
*
|
2007-04-04 |
2008-10-09 |
Bily Wang |
Manufacturing method of white light led and structure thereof
|
|
DE102007043401A1
(de)
*
|
2007-09-12 |
2009-03-19 |
Osram Gesellschaft mit beschränkter Haftung |
Leuchtvorrichtung und Verfahren zur Herstellung derselben
|
|
TWI401820B
(zh)
*
|
2007-11-07 |
2013-07-11 |
財團法人工業技術研究院 |
發光元件及其製作方法
|
|
US8946987B2
(en)
|
2007-11-07 |
2015-02-03 |
Industrial Technology Research Institute |
Light emitting device and fabricating method thereof
|
|
GB2458345B
(en)
*
|
2008-03-12 |
2012-05-23 |
Dialight Lumidrives Ltd |
Method and apparatus for providing illumination
|
|
US7923739B2
(en)
|
2009-06-05 |
2011-04-12 |
Cree, Inc. |
Solid state lighting device
|
|
US8598602B2
(en)
|
2009-01-12 |
2013-12-03 |
Cree, Inc. |
Light emitting device packages with improved heat transfer
|
|
US8309973B2
(en)
*
|
2009-02-12 |
2012-11-13 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Silicon-based sub-mount for an opto-electronic device
|
|
US9111778B2
(en)
|
2009-06-05 |
2015-08-18 |
Cree, Inc. |
Light emitting diode (LED) devices, systems, and methods
|
|
US8860043B2
(en)
*
|
2009-06-05 |
2014-10-14 |
Cree, Inc. |
Light emitting device packages, systems and methods
|
|
JP5612355B2
(ja)
*
|
2009-07-15 |
2014-10-22 |
株式会社Kanzacc |
メッキ構造及び電気材料の製造方法
|
|
US8101962B2
(en)
*
|
2009-10-06 |
2012-01-24 |
Kuang Hong Precision Co., Ltd. |
Carrying structure of semiconductor
|
|
CN102237466B
(zh)
*
|
2010-04-28 |
2013-11-06 |
展晶科技(深圳)有限公司 |
发光组件封装结构及其制程
|
|
EP2390909A1
(en)
*
|
2010-05-24 |
2011-11-30 |
Jerry Hu |
Miniature packaging for discrete circuit components
|
|
US8269244B2
(en)
|
2010-06-28 |
2012-09-18 |
Cree, Inc. |
LED package with efficient, isolated thermal path
|
|
US11101408B2
(en)
|
2011-02-07 |
2021-08-24 |
Creeled, Inc. |
Components and methods for light emitting diode (LED) lighting
|
|
TW201251140A
(en)
|
2011-01-31 |
2012-12-16 |
Cree Inc |
High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
|
|
JP2014063967A
(ja)
*
|
2012-09-24 |
2014-04-10 |
Towa Corp |
発光デバイス及びその製造方法、並びに発光デバイス成形用金型
|
|
KR101912290B1
(ko)
*
|
2017-12-06 |
2018-10-29 |
삼성전기 주식회사 |
팬-아웃 반도체 패키지
|