JP2002064187A5 - - Google Patents

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Publication number
JP2002064187A5
JP2002064187A5 JP2000251436A JP2000251436A JP2002064187A5 JP 2002064187 A5 JP2002064187 A5 JP 2002064187A5 JP 2000251436 A JP2000251436 A JP 2000251436A JP 2000251436 A JP2000251436 A JP 2000251436A JP 2002064187 A5 JP2002064187 A5 JP 2002064187A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000251436A
Other languages
Japanese (ja)
Other versions
JP3901432B2 (ja
JP2002064187A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000251436A external-priority patent/JP3901432B2/ja
Priority to JP2000251436A priority Critical patent/JP3901432B2/ja
Priority to US09/931,915 priority patent/US6617627B2/en
Priority to EP01958382A priority patent/EP1263049A4/en
Priority to CN01802501.3A priority patent/CN1246905C/zh
Priority to PCT/JP2001/007143 priority patent/WO2002017403A1/ja
Publication of JP2002064187A publication Critical patent/JP2002064187A/ja
Priority to US10/618,688 priority patent/US6913937B2/en
Publication of JP2002064187A5 publication Critical patent/JP2002064187A5/ja
Publication of JP3901432B2 publication Critical patent/JP3901432B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000251436A 2000-08-22 2000-08-22 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法 Expired - Fee Related JP3901432B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000251436A JP3901432B2 (ja) 2000-08-22 2000-08-22 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法
US09/931,915 US6617627B2 (en) 2000-08-22 2001-08-20 Memory cell array having ferroelectric capacitors, method of fabricating the same, and ferroelectric memory device.
PCT/JP2001/007143 WO2002017403A1 (en) 2000-08-22 2001-08-21 Memory cell array with ferroelectric capacitor, method for manufacturing the same, and ferroelectric memory device
CN01802501.3A CN1246905C (zh) 2000-08-22 2001-08-21 存储单元阵列及其制造方法以及强电介质存储装置
EP01958382A EP1263049A4 (en) 2000-08-22 2001-08-21 FERROELECTRIC CAPACITOR MEMORY CELL ARRAY, METHOD FOR MANUFACTURING THE SAME, AND FERROELECTRIC MEMORY DEVICE
US10/618,688 US6913937B2 (en) 2000-08-22 2003-07-15 Memory cell array having ferroelectric capacity, method of manufacturing the same and ferroelectric memory device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000251436A JP3901432B2 (ja) 2000-08-22 2000-08-22 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法

Publications (3)

Publication Number Publication Date
JP2002064187A JP2002064187A (ja) 2002-02-28
JP2002064187A5 true JP2002064187A5 (enExample) 2006-10-26
JP3901432B2 JP3901432B2 (ja) 2007-04-04

Family

ID=18740844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000251436A Expired - Fee Related JP3901432B2 (ja) 2000-08-22 2000-08-22 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法

Country Status (5)

Country Link
US (2) US6617627B2 (enExample)
EP (1) EP1263049A4 (enExample)
JP (1) JP3901432B2 (enExample)
CN (1) CN1246905C (enExample)
WO (1) WO2002017403A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901432B2 (ja) * 2000-08-22 2007-04-04 セイコーエプソン株式会社 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法
US6858482B2 (en) * 2002-04-10 2005-02-22 Micron Technology, Inc. Method of manufacture of programmable switching circuits and memory cells employing a glass layer
CN100437902C (zh) * 2003-12-22 2008-11-26 皇家飞利浦电子股份有限公司 铁电聚合物层的构图方法
US20050156217A1 (en) * 2004-01-13 2005-07-21 Matsushita Electric Industrial Co., Ltd. Semiconductor memory device and method for fabricating the same
JP2005285190A (ja) * 2004-03-29 2005-10-13 Sanyo Electric Co Ltd メモリ
JP2005327919A (ja) * 2004-05-14 2005-11-24 Seiko Epson Corp デバイスの製造方法及びデバイス、電気光学素子、プリンタ
US7253502B2 (en) * 2004-07-28 2007-08-07 Endicott Interconnect Technologies, Inc. Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
DE102005017071B4 (de) 2004-12-29 2011-09-15 Hynix Semiconductor Inc. Schwebe-Gate-Speichereinrichtung
NO322202B1 (no) * 2004-12-30 2006-08-28 Thin Film Electronics Asa Fremgangsmate i fremstillingen av en elektronisk innretning
NO324539B1 (no) * 2005-06-14 2007-11-19 Thin Film Electronics Asa Fremgangsmate i fabrikasjonen av en ferroelektrisk minneinnretning
GB2436893A (en) * 2006-03-31 2007-10-10 Seiko Epson Corp Inkjet printing of cross point passive matrix devices
GB0809840D0 (en) * 2008-05-30 2008-07-09 Univ Catholique Louvain Ferroelectric organic memories with ultra-low voltage operation
US8357582B2 (en) 2010-11-01 2013-01-22 Micron Technology, Inc. Methods of forming electrical components and memory cells
TWI463641B (zh) * 2012-02-24 2014-12-01 Nat Applied Res Laboratories Ultra - high density resistive memory structure and its manufacturing method
DE102020108366A1 (de) 2020-03-26 2021-09-30 Bayerische Motoren Werke Aktiengesellschaft Informationsspeicher und Verfahren zum Programmieren und Auslesen von Informationen

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2788265B2 (ja) 1988-07-08 1998-08-20 オリンパス光学工業株式会社 強誘電体メモリ及びその駆動方法,製造方法
US5530667A (en) * 1991-03-01 1996-06-25 Olympus Optical Co., Ltd. Ferroelectric memory device
JP3480110B2 (ja) 1995-03-15 2003-12-15 ソニー株式会社 半導体メモリ及びその作製方法
JP3176840B2 (ja) * 1996-03-15 2001-06-18 富士通株式会社 半導体装置の製造方法
US5874364A (en) * 1995-03-27 1999-02-23 Fujitsu Limited Thin film deposition method, capacitor device and method for fabricating the same, and semiconductor device and method for fabricating the same
US6518168B1 (en) * 1995-08-18 2003-02-11 President And Fellows Of Harvard College Self-assembled monolayer directed patterning of surfaces
JPH0991970A (ja) 1995-09-26 1997-04-04 Olympus Optical Co Ltd 非破壊型強誘電体メモリ及びその駆動方法
JPH09102587A (ja) 1995-10-05 1997-04-15 Olympus Optical Co Ltd 強誘電体薄膜素子
US6163043A (en) * 1996-04-19 2000-12-19 Matsushita Electronics Corp. Semiconductor device
KR100413805B1 (ko) * 1996-10-31 2004-06-26 삼성전자주식회사 누설전류를이용한매트릭스형다진법강유전체랜덤액세서메모리
KR100370416B1 (ko) 1996-10-31 2003-04-08 삼성전기주식회사 고밀도 데이터의 기록/재생을 위한 부호화/복호화 방법 및 그에 따른 장치
NO309500B1 (no) 1997-08-15 2001-02-05 Thin Film Electronics Asa Ferroelektrisk databehandlingsinnretning, fremgangsmåter til dens fremstilling og utlesing, samt bruk av samme
US6316801B1 (en) * 1998-03-04 2001-11-13 Nec Corporation Semiconductor device having capacitive element structure and multilevel interconnection structure and method of fabricating the same
US5963466A (en) * 1998-04-13 1999-10-05 Radiant Technologies, Inc. Ferroelectric memory having a common plate electrode
US6239028B1 (en) * 1998-09-03 2001-05-29 Micron Technology, Inc. Methods for forming iridium-containing films on substrates
US6174735B1 (en) * 1998-10-23 2001-01-16 Ramtron International Corporation Method of manufacturing ferroelectric memory device useful for preventing hydrogen line degradation
JP4045406B2 (ja) 1999-06-04 2008-02-13 セイコーエプソン株式会社 強誘電体メモリ素子及びその製造方法
JP3901432B2 (ja) * 2000-08-22 2007-04-04 セイコーエプソン株式会社 強誘電体キャパシタを有するメモリセルアレイおよびその製造方法

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