JP2001203292A5 - - Google Patents
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- Publication number
- JP2001203292A5 JP2001203292A5 JP2000009208A JP2000009208A JP2001203292A5 JP 2001203292 A5 JP2001203292 A5 JP 2001203292A5 JP 2000009208 A JP2000009208 A JP 2000009208A JP 2000009208 A JP2000009208 A JP 2000009208A JP 2001203292 A5 JP2001203292 A5 JP 2001203292A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000009208A JP4405024B2 (ja) | 2000-01-18 | 2000-01-18 | 半導体装置 |
| US09/606,154 US6384485B1 (en) | 2000-01-18 | 2000-06-29 | Semiconductor device |
| TW089114590A TW454310B (en) | 2000-01-18 | 2000-07-21 | Semiconductor device |
| KR1020000051925A KR100353606B1 (ko) | 2000-01-18 | 2000-09-04 | 반도체 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000009208A JP4405024B2 (ja) | 2000-01-18 | 2000-01-18 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001203292A JP2001203292A (ja) | 2001-07-27 |
| JP2001203292A5 true JP2001203292A5 (enExample) | 2007-03-01 |
| JP4405024B2 JP4405024B2 (ja) | 2010-01-27 |
Family
ID=18537383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000009208A Expired - Fee Related JP4405024B2 (ja) | 2000-01-18 | 2000-01-18 | 半導体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6384485B1 (enExample) |
| JP (1) | JP4405024B2 (enExample) |
| KR (1) | KR100353606B1 (enExample) |
| TW (1) | TW454310B (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6583513B1 (en) * | 1999-10-12 | 2003-06-24 | Agilent Technologies, Inc. | Integrated circuit package with an IC chip and pads that dissipate heat away from the chip |
| JP2001217340A (ja) * | 2000-02-01 | 2001-08-10 | Nec Corp | 半導体装置及びその製造方法 |
| JP3854054B2 (ja) * | 2000-10-10 | 2006-12-06 | 株式会社東芝 | 半導体装置 |
| US6528892B2 (en) * | 2001-06-05 | 2003-03-04 | International Business Machines Corporation | Land grid array stiffener use with flexible chip carriers |
| KR100708041B1 (ko) * | 2001-07-28 | 2007-04-16 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 및 그 제조 방법 |
| SG115406A1 (en) * | 2001-09-17 | 2005-10-28 | Inst Of Microelectronics | An optical device carrier |
| JP4070470B2 (ja) * | 2002-01-24 | 2008-04-02 | 新光電気工業株式会社 | 半導体装置用多層回路基板及びその製造方法並びに半導体装置 |
| JP2007266623A (ja) * | 2002-01-31 | 2007-10-11 | Sumitomo Bakelite Co Ltd | 多層配線板および半導体デバイス |
| US6784531B2 (en) * | 2002-06-13 | 2004-08-31 | Hewlett-Packard Development Company, L.P. | Power distribution plane layout for VLSI packages |
| JP4057921B2 (ja) * | 2003-01-07 | 2008-03-05 | 株式会社東芝 | 半導体装置およびそのアセンブリ方法 |
| JP4272968B2 (ja) * | 2003-10-16 | 2009-06-03 | エルピーダメモリ株式会社 | 半導体装置および半導体チップ制御方法 |
| US6965170B2 (en) * | 2003-11-18 | 2005-11-15 | International Business Machines Corporation | High wireability microvia substrate |
| JP4686318B2 (ja) | 2005-09-28 | 2011-05-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| KR100800486B1 (ko) | 2006-11-24 | 2008-02-04 | 삼성전자주식회사 | 개선된 신호 전달 경로를 갖는 반도체 메모리 장치 및 그구동방법 |
| US8716867B2 (en) | 2010-05-12 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Forming interconnect structures using pre-ink-printed sheets |
| US20120188721A1 (en) * | 2011-01-21 | 2012-07-26 | Nxp B.V. | Non-metal stiffener ring for fcbga |
| US9117825B2 (en) | 2012-12-06 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Substrate pad structure |
| US9263370B2 (en) * | 2013-09-27 | 2016-02-16 | Qualcomm Mems Technologies, Inc. | Semiconductor device with via bar |
| WO2020227033A1 (en) * | 2019-05-07 | 2020-11-12 | Rambus Inc. | Crosstalk cancelation structures in semiconductor packages |
| JP7536686B2 (ja) | 2021-02-26 | 2024-08-20 | 京セラ株式会社 | 配線基板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05144971A (ja) | 1991-11-18 | 1993-06-11 | Nec Corp | チツプキヤリア構造 |
| JP3325351B2 (ja) * | 1993-08-18 | 2002-09-17 | 株式会社東芝 | 半導体装置 |
| JP3082579B2 (ja) | 1994-08-25 | 2000-08-28 | 松下電器産業株式会社 | シールドケース |
| JP3604248B2 (ja) * | 1997-02-25 | 2004-12-22 | 沖電気工業株式会社 | 半導体装置の製造方法 |
| JP3052899B2 (ja) | 1997-07-04 | 2000-06-19 | 日本電気株式会社 | 半導体装置 |
| JP3509507B2 (ja) * | 1997-11-10 | 2004-03-22 | 松下電器産業株式会社 | バンプ付電子部品の実装構造および実装方法 |
| US6081026A (en) * | 1998-11-13 | 2000-06-27 | Fujitsu Limited | High density signal interposer with power and ground wrap |
| US6239485B1 (en) * | 1998-11-13 | 2001-05-29 | Fujitsu Limited | Reduced cross-talk noise high density signal interposer with power and ground wrap |
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2000
- 2000-01-18 JP JP2000009208A patent/JP4405024B2/ja not_active Expired - Fee Related
- 2000-06-29 US US09/606,154 patent/US6384485B1/en not_active Expired - Fee Related
- 2000-07-21 TW TW089114590A patent/TW454310B/zh not_active IP Right Cessation
- 2000-09-04 KR KR1020000051925A patent/KR100353606B1/ko not_active Expired - Fee Related