JP2002052370A - 基板洗浄装置 - Google Patents

基板洗浄装置

Info

Publication number
JP2002052370A
JP2002052370A JP2000241794A JP2000241794A JP2002052370A JP 2002052370 A JP2002052370 A JP 2002052370A JP 2000241794 A JP2000241794 A JP 2000241794A JP 2000241794 A JP2000241794 A JP 2000241794A JP 2002052370 A JP2002052370 A JP 2002052370A
Authority
JP
Japan
Prior art keywords
substrate
cleaning
roller
cleaning member
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000241794A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002052370A5 (enExample
Inventor
Hiroshi Sotozaki
宏 外崎
Fumitoshi Oikawa
文利 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000241794A priority Critical patent/JP2002052370A/ja
Priority to KR1020010047491A priority patent/KR100776314B1/ko
Priority to US09/924,464 priority patent/US6851152B2/en
Publication of JP2002052370A publication Critical patent/JP2002052370A/ja
Publication of JP2002052370A5 publication Critical patent/JP2002052370A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/34—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000241794A 2000-08-09 2000-08-09 基板洗浄装置 Pending JP2002052370A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000241794A JP2002052370A (ja) 2000-08-09 2000-08-09 基板洗浄装置
KR1020010047491A KR100776314B1 (ko) 2000-08-09 2001-08-07 기판 세정 장치
US09/924,464 US6851152B2 (en) 2000-08-09 2001-08-09 Substrate cleaning apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000241794A JP2002052370A (ja) 2000-08-09 2000-08-09 基板洗浄装置

Publications (2)

Publication Number Publication Date
JP2002052370A true JP2002052370A (ja) 2002-02-19
JP2002052370A5 JP2002052370A5 (enExample) 2005-07-21

Family

ID=18732932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000241794A Pending JP2002052370A (ja) 2000-08-09 2000-08-09 基板洗浄装置

Country Status (3)

Country Link
US (1) US6851152B2 (enExample)
JP (1) JP2002052370A (enExample)
KR (1) KR100776314B1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539594A (ja) * 2005-04-25 2008-11-13 アプライド マテリアルズ インコーポレイテッド 基板の縁部を洗浄するための方法および装置
JP2016174077A (ja) * 2015-03-17 2016-09-29 株式会社東芝 基板洗浄装置および基板洗浄方法
US12100587B2 (en) 2019-10-15 2024-09-24 Ebara Corporation Substrate cleaning apparatus and cleaning method of substrate

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6904637B2 (en) * 2001-10-03 2005-06-14 Applied Materials, Inc. Scrubber with sonic nozzle
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US20070095367A1 (en) * 2005-10-28 2007-05-03 Yaxin Wang Apparatus and method for atomic layer cleaning and polishing
US7938130B2 (en) * 2006-03-31 2011-05-10 Ebara Corporation Substrate holding rotating mechanism, and substrate processing apparatus
US9202725B2 (en) * 2006-07-24 2015-12-01 Planar Semiconductor, Inc. Holding and rotary driving mechanism for flat objects
US7823241B2 (en) * 2007-03-22 2010-11-02 Taiwan Semiconductor Manufacturing Co., Ltd. System for cleaning a wafer
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8844546B2 (en) * 2008-10-01 2014-09-30 Applied Materials, Inc. Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP5535687B2 (ja) * 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
TWI420616B (zh) * 2010-08-05 2013-12-21 Au Optronics Corp 基板清洗機台與基板清洗方法
US9190881B1 (en) 2011-08-02 2015-11-17 Tooltek Engineering Corporation Rotary-powered mechanical oscillator
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置
KR101508513B1 (ko) 2013-07-22 2015-04-07 주식회사 케이씨텍 기판 세정에 사용되는 기판 회전 장치
KR101527898B1 (ko) * 2013-07-31 2015-06-10 세메스 주식회사 지지 유닛, 기판 처리 장치, 기판 처리 설비, 그리고 기판 처리 방법
KR20150075357A (ko) * 2013-12-25 2015-07-03 가부시키가이샤 에바라 세이사꾸쇼 기판 세정 장치 및 기판 처리 장치
US10096460B2 (en) 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
CN106898570B (zh) * 2017-04-14 2023-06-20 常州亿晶光电科技有限公司 硅片清洁装置
JP7491774B2 (ja) * 2020-08-24 2024-05-28 株式会社荏原製作所 基板保持回転機構、基板処理装置
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers
JP7679204B2 (ja) * 2021-01-25 2025-05-19 株式会社荏原製作所 基板洗浄装置、基板洗浄方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2584999B2 (ja) 1987-06-24 1997-02-26 本多電子株式会社 超音波駆動装置
JP3030796B2 (ja) * 1992-07-24 2000-04-10 東京エレクトロン株式会社 洗浄処理方法
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JPH08130200A (ja) * 1994-10-31 1996-05-21 Sigma Merutetsuku Kk 基板の洗浄方法と洗浄装置
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
US6230753B1 (en) 1996-07-15 2001-05-15 Lam Research Corporation Wafer cleaning apparatus
US5924154A (en) * 1996-08-29 1999-07-20 Ontrak Systems, Inc. Brush assembly apparatus
EP0837493B8 (en) 1996-10-21 2007-11-07 Ebara Corporation Cleaning apparatus
US5937469A (en) 1996-12-03 1999-08-17 Intel Corporation Apparatus for mechanically cleaning the edges of wafers
US5725414A (en) 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
US5933902A (en) * 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
JPH11179646A (ja) * 1997-12-19 1999-07-06 Speedfam Co Ltd 洗浄装置
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6594847B1 (en) * 2000-03-28 2003-07-22 Lam Research Corporation Single wafer residue, thin film removal and clean
US6622334B1 (en) * 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6427566B1 (en) * 2000-03-31 2002-08-06 Lam Research Corporation Self-aligning cylindrical mandrel assembly and wafer preparation apparatus including the same
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539594A (ja) * 2005-04-25 2008-11-13 アプライド マテリアルズ インコーポレイテッド 基板の縁部を洗浄するための方法および装置
JP2016174077A (ja) * 2015-03-17 2016-09-29 株式会社東芝 基板洗浄装置および基板洗浄方法
US12100587B2 (en) 2019-10-15 2024-09-24 Ebara Corporation Substrate cleaning apparatus and cleaning method of substrate

Also Published As

Publication number Publication date
US20020022445A1 (en) 2002-02-21
KR20020013419A (ko) 2002-02-20
US6851152B2 (en) 2005-02-08
KR100776314B1 (ko) 2007-11-13

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