JP2001526961A - レーザー穿孔方法 - Google Patents
レーザー穿孔方法Info
- Publication number
- JP2001526961A JP2001526961A JP2000508504A JP2000508504A JP2001526961A JP 2001526961 A JP2001526961 A JP 2001526961A JP 2000508504 A JP2000508504 A JP 2000508504A JP 2000508504 A JP2000508504 A JP 2000508504A JP 2001526961 A JP2001526961 A JP 2001526961A
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- hole
- cavity
- laser
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 73
- 238000005553 drilling Methods 0.000 title claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 251
- 230000008569 process Effects 0.000 claims abstract description 8
- 230000004888 barrier function Effects 0.000 claims description 43
- 230000003993 interaction Effects 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 12
- 229910009372 YVO4 Inorganic materials 0.000 claims description 8
- 238000002356 laser light scattering Methods 0.000 claims description 7
- 230000001276 controlling effect Effects 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000031700 light absorption Effects 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000000779 smoke Substances 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 230000003134 recirculating effect Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract description 16
- 239000007924 injection Substances 0.000 abstract description 16
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 16
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002283 diesel fuel Substances 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 239000000446 fuel Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 241000321713 Dromus Species 0.000 description 2
- 241000425571 Trepanes Species 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- KXXXUIKPSVVSAW-UHFFFAOYSA-K pyranine Chemical compound [Na+].[Na+].[Na+].C1=C2C(O)=CC(S([O-])(=O)=O)=C(C=C3)C2=C2C3=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1 KXXXUIKPSVVSAW-UHFFFAOYSA-K 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
- F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
- F02M61/168—Assembling; Disassembling; Manufacturing; Adjusting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9718549.0 | 1997-09-03 | ||
| GB9718549A GB2328894B (en) | 1997-09-03 | 1997-09-03 | Laser drilling |
| PCT/GB1998/002591 WO1999011419A1 (en) | 1997-09-03 | 1998-08-28 | Laser-drilling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001526961A true JP2001526961A (ja) | 2001-12-25 |
| JP2001526961A5 JP2001526961A5 (https=) | 2006-01-05 |
Family
ID=10818373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000508504A Pending JP2001526961A (ja) | 1997-09-03 | 1998-08-28 | レーザー穿孔方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6365871B1 (https=) |
| EP (1) | EP1027187A1 (https=) |
| JP (1) | JP2001526961A (https=) |
| GB (1) | GB2328894B (https=) |
| WO (1) | WO1999011419A1 (https=) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008033208A1 (de) | 2007-07-30 | 2009-02-05 | Honda Motor Co., Ltd. | Perforierverfahren und Perforiervorrichtung |
| JP2010201452A (ja) * | 2009-03-02 | 2010-09-16 | Honda Motor Co Ltd | 穴あけ装置 |
| JP2014058969A (ja) * | 2012-09-14 | 2014-04-03 | General Electric Co <Ge> | エアフォイル製造システム及び方法 |
| JP2015504783A (ja) * | 2011-12-07 | 2015-02-16 | ジェネラル アトミックス | レーザ加工で使用する方法およびシステム |
| JP2015140805A (ja) * | 2014-01-27 | 2015-08-03 | ゼネラル・エレクトリック・カンパニイ | エーロフォイルに穴開けするための方法 |
| JP2015145028A (ja) * | 2014-01-27 | 2015-08-13 | ゼネラル・エレクトリック・カンパニイ | 孔の完成を判定する方法 |
| KR20160137421A (ko) * | 2015-05-21 | 2016-11-30 | 로베르트 보쉬 게엠베하 | 공작물의 레이저 드릴링 또는 레이저 커팅을 위한 방법 및 레이저 드릴링 또는 레이저 커팅을 위한 시스템 |
| KR102235509B1 (ko) * | 2019-10-22 | 2021-04-05 | (주)아인테크놀러지 | 유리노즐 제조방법 |
Families Citing this family (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19832774B4 (de) * | 1998-07-22 | 2008-01-24 | Siemens Ag | Schutzvorrichtung zum Herstellen von Kleinstbohrungen in rohrartigen Bauteilen sowie Verfahren zum Herstellen von in einen Hohlraum mündenden Bohrungen |
| US6070813A (en) * | 1998-08-11 | 2000-06-06 | Caterpillar Inc. | Laser drilled nozzle in a tip of a fuel injector |
| DE10055483B4 (de) * | 2000-11-09 | 2007-11-29 | Robert Bosch Gmbh | Brennstoffeinspritzventil |
| DE10106809A1 (de) * | 2001-02-14 | 2002-09-19 | Siemens Ag | Verfahren zur Herstellung eines Lochs in einem Körper, insbesondere eines Einspritzlochs in einem Kraftstoffinjektor |
| US6603095B2 (en) | 2001-07-23 | 2003-08-05 | Siemens Automotive Corporation | Apparatus and method of overlapping formation of chamfers and orifices by laser light |
| US6642476B2 (en) | 2001-07-23 | 2003-11-04 | Siemens Automative Corporation | Apparatus and method of forming orifices and chamfers for uniform orifice coefficient and surface properties by laser |
| US6600132B2 (en) | 2001-07-31 | 2003-07-29 | John James Horsting | Method and apparatus to generate orifice disk entry geometry |
| US6720526B2 (en) | 2001-07-31 | 2004-04-13 | Siemens Automotive Corporation | Method and apparatus to form dimensionally consistent orifices and chamfers by laser using spatial filters |
| US6635847B2 (en) | 2001-07-31 | 2003-10-21 | Siemens Automotive Corporation | Method of forming orifices and chamfers by collimated and non-collimated light |
| US6642477B1 (en) * | 2001-10-23 | 2003-11-04 | Imra America, Inc. | Method for laser drilling a counter-tapered through-hole in a material |
| US6696666B2 (en) * | 2002-07-03 | 2004-02-24 | Scimed Life Systems, Inc. | Tubular cutting process and system |
| EP1416266B1 (de) * | 2002-11-04 | 2006-09-27 | Siemens Aktiengesellschaft | Verfahren zur Überprüfung der Struktur von Durchgangslöchern eines Bauteils |
| US6740847B1 (en) | 2003-03-10 | 2004-05-25 | Siemens Vdo Automotive Corporation | Method of forming multiple machining spots by a single laser |
| DE10314844B4 (de) * | 2003-04-01 | 2006-06-08 | Siemens Ag | Verfahren und Verwendung eines Verfahrens zur Herstellung von Durchgangsbohrungen und Düse eines Injektors |
| US7086931B2 (en) * | 2003-04-18 | 2006-08-08 | Tdk Corporation | Magnetic head bar holding unit, lapping device, and method of lapping medium-opposing surface of thin-film magnetic head |
| DE10329731A1 (de) * | 2003-07-02 | 2005-02-03 | Robert Bosch Gmbh | Kraftstoffeinspritzventil und ein Verfahren zur Herstellung desselben |
| US7063216B2 (en) * | 2003-09-04 | 2006-06-20 | Millipore Corporation | Underdrain useful in the construction of a filtration device |
| US20050075628A1 (en) * | 2003-10-02 | 2005-04-07 | Karl Cazzini | Variable intensity wide-angle illuminator |
| US8753588B2 (en) * | 2003-10-15 | 2014-06-17 | Emd Millipore Corporation | Support and stand-off ribs for underdrain for multi-well device |
| US8816244B2 (en) * | 2004-04-13 | 2014-08-26 | Boston Scientific Scimed, Inc. | Inverted stent cutting process |
| JP2005297012A (ja) * | 2004-04-13 | 2005-10-27 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| US20080271305A1 (en) * | 2005-01-19 | 2008-11-06 | Tosoh Smd Etna, Llc | Automated Sputtering Target Production |
| CN101189097B (zh) * | 2005-06-01 | 2011-04-20 | 飞腾股份有限公司 | 激光加工装置及激光加工方法 |
| US20070175872A1 (en) * | 2006-01-27 | 2007-08-02 | Rhoades Lawrence J | Laser back wall protection by particulate shading |
| US8779328B2 (en) * | 2007-05-31 | 2014-07-15 | Abbott Cardiovascular Systems Inc. | Methods for laser cutting tubing to make medical devices |
| US7932479B2 (en) * | 2007-05-31 | 2011-04-26 | Abbott Cardiovascular Systems Inc. | Method for laser cutting tubing using inert gas and a disposable mask |
| US8242408B2 (en) | 2007-08-15 | 2012-08-14 | Caterpillar Inc. | Masking device for laser machining system and method |
| US20090294416A1 (en) * | 2008-05-28 | 2009-12-03 | Caterpillar Inc. | Laser manufacturing system having real-time feedback |
| BRPI0806638B1 (pt) | 2008-11-28 | 2017-03-14 | Faculdades Católicas Mantenedora Da Pontifícia Univ Católica Do Rio De Janeiro - Puc Rio | processo de perfuração a laser |
| US20100219166A1 (en) * | 2009-03-02 | 2010-09-02 | Honda Motor Co., Ltd. | Hole-forming machine |
| BRPI1002337B1 (pt) | 2010-07-08 | 2017-02-14 | Faculdades Católicas | equipamento para perfuração a laser |
| US9677338B2 (en) | 2010-07-08 | 2017-06-13 | Faculdades Católicas, Associacão Sem Fins Lucrativos, Mantenedora Da Pontifícia Universidade Católica Do Rio De Janeiro-Puc-Rio | Device for laser drilling |
| DE102011078651A1 (de) * | 2011-07-05 | 2013-01-10 | Robert Bosch Gmbh | Verfahren zum Erzeugen zumindest einer Durchgangsbohrung und Vorrichtung zur Durchführung solch eines Verfahrens |
| DE102013212665B4 (de) * | 2013-06-28 | 2015-06-25 | Laser Zentrum Hannover E.V. | Verfahren zum Laserbohren oder Laserschneiden eines Werkstücks |
| DE102013218196A1 (de) * | 2013-09-11 | 2015-03-12 | Robert Bosch Gmbh | Verfahren zum Laserbohren eines Bauteils |
| DE102014220526A1 (de) * | 2014-10-09 | 2016-04-14 | Siemens Aktiengesellschaft | Verfahren zum Herstellen von Durchgangsbohrungen mittels Laserstrahlung in einer Wandung eines Bauteils |
| CN107211542B (zh) * | 2014-11-28 | 2020-11-24 | 英特尔公司 | 去钻污处理方法和多层印刷布线板的制造方法 |
| GB2537834A (en) * | 2015-04-27 | 2016-11-02 | Delphi Int Operations Luxembourg Sarl | Nozzle tip manufacturing |
| DE102015218760A1 (de) | 2015-09-29 | 2017-03-30 | Continental Automotive Gmbh | Verfahren und Vorrichtung zum Bohren eines Durchgangslochs in einem Werkstück mittels eines Laserstrahls |
| WO2017151122A1 (en) * | 2016-03-02 | 2017-09-08 | Cummins Inc. | Systems and methods for preventing laser back-wall damage |
| DE102017104044B4 (de) | 2017-02-27 | 2024-02-01 | Stoba Sondermaschinen Gmbh | Verfahren zum Herstellen einer Brennstoff- oder Hydraulikmittelleiteinheit unter Einbringung eines Schutzmediums und Werkzeugmaschine |
| JP2019069465A (ja) * | 2017-10-11 | 2019-05-09 | 株式会社ディスコ | レーザー加工装置 |
| CN108044244A (zh) * | 2017-12-18 | 2018-05-18 | 中国科学院西安光学精密机械研究所 | 利用激光在复杂型腔零件中加工制孔方法及填充清理装置 |
| CN108044243A (zh) * | 2017-12-18 | 2018-05-18 | 中国科学院西安光学精密机械研究所 | 具有复杂腔体工件的激光加工制孔方法及辅助填充系统 |
| WO2019162464A1 (en) | 2018-02-23 | 2019-08-29 | Avonisys Ag | A method of machining a bore extending from an outer wall of a workpiece with liquid-jet guided laser beam |
| JP7124507B2 (ja) * | 2018-07-17 | 2022-08-24 | 株式会社デンソー | レーザ加工装置 |
| DE102018218261A1 (de) * | 2018-10-25 | 2020-04-30 | Robert Bosch Gmbh | Verfahren zum Laserbohren eines Bauteils |
| US10888932B1 (en) | 2019-06-18 | 2021-01-12 | Honeywell Federal Manufacturing & Technologies, Llc | Assembly and method for microdrilling a tube |
| US12370630B2 (en) * | 2020-01-17 | 2025-07-29 | Rtx Corporation | Method and system for preventing back strikes when laser drilling hollow parts |
| CN114273802A (zh) * | 2020-09-27 | 2022-04-05 | 中国科学院宁波材料技术与工程研究所 | 一种激光打孔背伤防护方法及其装置 |
| CN113732534B (zh) * | 2021-08-03 | 2023-08-15 | 昆山锦林光电材料有限公司 | 一种防止反射纸热收缩变形的激光开孔加工装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4639572A (en) * | 1985-11-25 | 1987-01-27 | Ibm Corporation | Laser cutting of composite materials |
| US4808785A (en) * | 1986-11-13 | 1989-02-28 | Chromalloy Gas Turbine Corporation | Method and apparatus for making diffused cooling holes in an airfoil |
| US4873414A (en) * | 1988-06-13 | 1989-10-10 | Rolls Royce Inc. | Laser drilling of components |
| DE68907527T2 (de) * | 1988-06-13 | 1993-10-28 | Rolls Royce Plc | Laser-Bohren von Bauteilen. |
| GB2227965B (en) * | 1988-10-12 | 1993-02-10 | Rolls Royce Plc | Apparatus for drilling a shaped hole in a workpiece |
| ES2052034T3 (es) * | 1988-12-28 | 1994-07-01 | Mitsui Petrochemical Ind | Metodo y aparato para la fabricacion de tubos con agujeros. |
| DE3937460A1 (de) * | 1989-11-10 | 1990-11-08 | Daimler Benz Ag | Verfahren zum rueckstandsfreien anbringen von gratfreien durchbruechen in die wandung einer fluidleitung |
| GB2262712B (en) * | 1991-12-19 | 1995-04-26 | Butler Newall Ltd | Method of producing a multi-apertured component |
| GB2295115A (en) * | 1994-11-15 | 1996-05-22 | Rolls Royce Plc | Producing apertured components |
| GB9514447D0 (en) * | 1995-07-14 | 1995-09-13 | Rolls Royce Plc | Laser barrier material and method |
| US5767480A (en) * | 1995-07-28 | 1998-06-16 | National Semiconductor Corporation | Hole generation and lead forming for integrated circuit lead frames using laser machining |
| FR2739797B1 (fr) * | 1995-10-11 | 1997-11-14 | Snecma | Procede de percage de pieces au laser et materiau d'arret utilise |
| US6054673A (en) * | 1997-09-17 | 2000-04-25 | General Electric Company | Method and apparatus for laser drilling |
| US5994667A (en) * | 1997-10-15 | 1999-11-30 | Scimed Life Systems, Inc. | Method and apparatus for laser cutting hollow workpieces |
-
1997
- 1997-09-03 GB GB9718549A patent/GB2328894B/en not_active Expired - Fee Related
-
1998
- 1998-08-28 EP EP98940416A patent/EP1027187A1/en not_active Withdrawn
- 1998-08-28 US US09/486,964 patent/US6365871B1/en not_active Expired - Fee Related
- 1998-08-28 JP JP2000508504A patent/JP2001526961A/ja active Pending
- 1998-08-28 WO PCT/GB1998/002591 patent/WO1999011419A1/en not_active Ceased
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008033208A1 (de) | 2007-07-30 | 2009-02-05 | Honda Motor Co., Ltd. | Perforierverfahren und Perforiervorrichtung |
| DE102008033208B4 (de) * | 2007-07-30 | 2011-02-03 | Honda Motor Co., Ltd. | Perforierverfahren und Perforiervorrichtung |
| US8173932B2 (en) | 2007-07-30 | 2012-05-08 | Honda Motor Co., Ltd. | Perforation method and perforation apparatus |
| JP2010201452A (ja) * | 2009-03-02 | 2010-09-16 | Honda Motor Co Ltd | 穴あけ装置 |
| JP2015504783A (ja) * | 2011-12-07 | 2015-02-16 | ジェネラル アトミックス | レーザ加工で使用する方法およびシステム |
| US9815141B2 (en) | 2011-12-07 | 2017-11-14 | General Atomics | Methods and systems for use in laser machining |
| JP2014058969A (ja) * | 2012-09-14 | 2014-04-03 | General Electric Co <Ge> | エアフォイル製造システム及び方法 |
| JP2015140805A (ja) * | 2014-01-27 | 2015-08-03 | ゼネラル・エレクトリック・カンパニイ | エーロフォイルに穴開けするための方法 |
| JP2015145028A (ja) * | 2014-01-27 | 2015-08-13 | ゼネラル・エレクトリック・カンパニイ | 孔の完成を判定する方法 |
| KR20160137421A (ko) * | 2015-05-21 | 2016-11-30 | 로베르트 보쉬 게엠베하 | 공작물의 레이저 드릴링 또는 레이저 커팅을 위한 방법 및 레이저 드릴링 또는 레이저 커팅을 위한 시스템 |
| KR102553387B1 (ko) * | 2015-05-21 | 2023-07-11 | 로베르트 보쉬 게엠베하 | 공작물의 레이저 드릴링 또는 레이저 커팅을 위한 방법 및 레이저 드릴링 또는 레이저 커팅을 위한 시스템 |
| KR102235509B1 (ko) * | 2019-10-22 | 2021-04-05 | (주)아인테크놀러지 | 유리노즐 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6365871B1 (en) | 2002-04-02 |
| GB9718549D0 (en) | 1997-11-05 |
| EP1027187A1 (en) | 2000-08-16 |
| GB2328894B (en) | 1999-07-14 |
| WO1999011419A1 (en) | 1999-03-11 |
| GB2328894A (en) | 1999-03-10 |
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