JP2001523897A - 半導体ダイキャリア用の冷却システム - Google Patents

半導体ダイキャリア用の冷却システム

Info

Publication number
JP2001523897A
JP2001523897A JP2000521685A JP2000521685A JP2001523897A JP 2001523897 A JP2001523897 A JP 2001523897A JP 2000521685 A JP2000521685 A JP 2000521685A JP 2000521685 A JP2000521685 A JP 2000521685A JP 2001523897 A JP2001523897 A JP 2001523897A
Authority
JP
Japan
Prior art keywords
cooling
fins
cooling system
semiconductor die
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000521685A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001523897A5 (enExample
Inventor
ダブリュ．ジュニア クレーン，スタンフォード
クリシュナプラ，ラクシュミナラシムハ
ベハー，モイセス
デュッタ，アリンダム
ジェイ． リンク，ケビン
アハーン，ウィリアム
Original Assignee
ザ パンダ プロジェクト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ザ パンダ プロジェクト filed Critical ザ パンダ プロジェクト
Publication of JP2001523897A publication Critical patent/JP2001523897A/ja
Publication of JP2001523897A5 publication Critical patent/JP2001523897A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2000521685A 1997-11-14 1998-11-13 半導体ダイキャリア用の冷却システム Pending JP2001523897A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/970,503 1997-11-14
US08/970,503 US6031720A (en) 1997-11-14 1997-11-14 Cooling system for semiconductor die carrier
PCT/US1998/024251 WO1999026460A1 (en) 1997-11-14 1998-11-13 Cooling system for semiconductor die carrier

Publications (2)

Publication Number Publication Date
JP2001523897A true JP2001523897A (ja) 2001-11-27
JP2001523897A5 JP2001523897A5 (enExample) 2006-01-12

Family

ID=25517044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000521685A Pending JP2001523897A (ja) 1997-11-14 1998-11-13 半導体ダイキャリア用の冷却システム

Country Status (7)

Country Link
US (1) US6031720A (enExample)
EP (1) EP1036491B1 (enExample)
JP (1) JP2001523897A (enExample)
KR (1) KR20010024613A (enExample)
AU (1) AU1458399A (enExample)
DE (1) DE69824758D1 (enExample)
WO (1) WO1999026460A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258169A (ja) * 2002-03-05 2003-09-12 Fujikura Ltd ヒートシンク
JP2006013027A (ja) * 2004-06-24 2006-01-12 Hitachi Ltd ファン付きヒートシンク
JP5312690B2 (ja) * 2010-06-07 2013-10-09 三菱電機株式会社 ヒートシンクおよびその製造方法
JP2018161979A (ja) * 2017-03-27 2018-10-18 富士電機株式会社 鉄道車両用電力変換装置

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW484721U (en) * 2000-11-06 2002-04-21 Giga Byte Tech Co Ltd Improved airflow guiding structure of server
DE10063306A1 (de) * 2000-12-19 2002-07-04 Fujitsu Siemens Computers Gmbh Kühlvorrichtung
US6719038B2 (en) 2001-08-09 2004-04-13 Celestica International Inc. Heat removal system
JP2004538657A (ja) * 2001-08-09 2004-12-24 セレスティカ インターナショナル インク． 電子装置冷却構造
WO2003030608A1 (en) * 2001-10-04 2003-04-10 Celestica International Inc. Cooling system having independent fan location
US7064953B2 (en) * 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6891385B2 (en) * 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US6661665B2 (en) * 2002-03-11 2003-12-09 Sun Microsystems, Inc. Method and apparatus for removing heat from an electronic device
US6975509B2 (en) * 2002-05-16 2005-12-13 Sun Microsystems, Inc. Computing apparatus with cooling fan
US6678157B1 (en) * 2002-09-17 2004-01-13 Sun Microsystems, Inc. Electronics assembly with cooling arrangement
KR20040038162A (ko) * 2002-10-31 2004-05-08 삼성전자주식회사 컴퓨터 본체
KR100939992B1 (ko) * 2002-11-21 2010-02-03 삼성전자주식회사 전기전자기기의 냉각장치 및 이를 장착한 전기전자기기
CN2720626Y (zh) * 2004-06-25 2005-08-24 鸿富锦精密工业（深圳）有限公司 散热器
US20060098414A1 (en) * 2004-11-10 2006-05-11 Meng-Cheng Huang Heat sink
TWI268995B (en) * 2004-12-24 2006-12-21 Foxconn Tech Co Ltd Fan duct device
CN100464279C (zh) * 2005-11-17 2009-02-25 富准精密工业(深圳)有限公司 散热装置
US7251136B2 (en) * 2005-12-29 2007-07-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a ventilating duct
US7228889B1 (en) 2006-01-09 2007-06-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
KR101110434B1 (ko) * 2006-05-02 2012-02-24 엘지전자 주식회사 컴퓨터 냉각 장치
US20080112134A1 (en) * 2006-11-09 2008-05-15 Brandon Rubenstein Dust accumulation resistant heat sink
US7806167B2 (en) * 2007-06-22 2010-10-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
CN102654790A (zh) * 2011-03-03 2012-09-05 鸿富锦精密工业（深圳）有限公司 散热系统
US9871358B2 (en) * 2015-01-30 2018-01-16 Abb Schweiz Ag Electrical switchgear system
FI3342226T3 (fi) 2015-08-25 2024-05-24 Nokia Solutions & Networks Oy Radiokehyskonfiguraatio
JP6988148B2 (ja) * 2017-04-24 2022-01-05 富士電機株式会社 鉄道車両用電力変換装置
CN108932039B (zh) * 2017-05-26 2021-08-13 鸿富锦精密工业(武汉)有限公司 导风罩及散热系统
JP6888468B2 (ja) * 2017-08-01 2021-06-16 富士電機株式会社 鉄道車両用電力変換装置
JP2022178278A (ja) * 2021-05-19 2022-12-02 日本電産株式会社 放熱部材

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US4674004A (en) * 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
JPH0412559A (ja) * 1990-05-01 1992-01-17 Fujitsu Ltd 電子装置の冷却構造
JPH0521665A (ja) * 1991-07-11 1993-01-29 Nec Corp ヒートシンク付半導体パツケージ
JP2596682B2 (ja) * 1992-09-08 1997-04-02 株式会社日立製作所 電子機器冷却装置
US5428503A (en) * 1992-03-24 1995-06-27 Hitachi, Ltd. Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
JP3236137B2 (ja) * 1993-07-30 2001-12-10 富士通株式会社 半導体素子冷却装置
JPH08236664A (ja) * 1995-02-23 1996-09-13 Toshiba Corp 半導体の冷却装置
US5597035A (en) * 1995-08-18 1997-01-28 Dell Usa, L.P. For use with a heatsink a shroud having a varying cross-sectional area
US5563768A (en) * 1995-08-31 1996-10-08 At&T Global Information Solutions Company Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258169A (ja) * 2002-03-05 2003-09-12 Fujikura Ltd ヒートシンク
JP2006013027A (ja) * 2004-06-24 2006-01-12 Hitachi Ltd ファン付きヒートシンク
JP5312690B2 (ja) * 2010-06-07 2013-10-09 三菱電機株式会社 ヒートシンクおよびその製造方法
JP2018161979A (ja) * 2017-03-27 2018-10-18 富士電機株式会社 鉄道車両用電力変換装置

Also Published As

Publication number Publication date
EP1036491A1 (en) 2000-09-20
AU1458399A (en) 1999-06-07
DE69824758D1 (de) 2004-07-29
KR20010024613A (ko) 2001-03-26
US6031720A (en) 2000-02-29
WO1999026460A1 (en) 1999-05-27
EP1036491B1 (en) 2004-06-23
EP1036491A4 (en) 2001-05-16
WO1999026460A8 (en) 1999-07-01

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