JP2001511950A - BeTeバッファ層を有する▲II▼−▲VI▼族半導体デバイス - Google Patents
BeTeバッファ層を有する▲II▼−▲VI▼族半導体デバイスInfo
- Publication number
- JP2001511950A JP2001511950A JP53587398A JP53587398A JP2001511950A JP 2001511950 A JP2001511950 A JP 2001511950A JP 53587398 A JP53587398 A JP 53587398A JP 53587398 A JP53587398 A JP 53587398A JP 2001511950 A JP2001511950 A JP 2001511950A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- buffer layer
- bete
- layer
- bete buffer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/347—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIBVI compounds, e.g. ZnCdSe- laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02469—Group 12/16 materials
- H01L21/02477—Selenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02469—Group 12/16 materials
- H01L21/0248—Tellurides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02485—Other chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/0256—Selenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0083—Processes for devices with an active region comprising only II-VI compounds
- H01L33/0087—Processes for devices with an active region comprising only II-VI compounds with a substrate not being a II-VI compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/28—Materials of the light emitting region containing only elements of group II and group VI of the periodic system
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.積重ね状のII−VI族半導体層と、 前記積重ね状II−VI族半導体層に隣接するGaAs基板と、 前記GaAs基板と積重ね状II−VI族半導体層との間のBeTeバッファ層 とを有し、 前記BeTeバッファ層の厚さが約80Aより大であり、これにより、前記Ga As基板と積重ね状II−VI族半導体層との間のインターフェース近傍の領域にお ける積層欠陥を低減するようにしたことを特徴とするII−VI族半導体デバイ ス。 2.前記GaAs基板がn型であり、前記BeTeバッファ層がn型である、 請求項1記載のII−VI族半導体デバイス。 3.前記GaAs基板がp型であり、前記BeTeバッファ層がp型である、 請求項1記載のII−VI族半導体デバイス。 4.前記積重ね状II−VI族半導体層がレーザダイオードを形成する、請求 項1記載のII−VI族半導体デバイス。 5.前記BeTeバッファ層が約1000A未満の厚さを有する、請求項1記 載のII−VI族半導体デバイス。 6.前記GaAs基板と前記BeTeバッファ層との間に中間層を含む、請求 項1記載のII−VI族半導体デバイス。 7.前記中間層がGaAsバッファ層を有する、請求項6記載のII−VI族 半導体デバイス。 8.請求項1記載のII−VI族半導体デバイスを含む光学式データ格納シス テム。 9.請求項1記載のII−VI族半導体デバイスを含む電子ディスプレイシス テム。 10.請求項1記載のII−VI族半導体デバイスを含む光通信システム。 11.請求項1記載のII−VI族半導体デバイスを含むレーザポインタ。 12.GaAs基板を分子線エピタキシャー・チャンバ内に置くステップと、 BeTeバッファ層を前記GaAs基板と作用的に接触した(operational cont act)状態で約80Aより大きい厚さまで成長させるステップと、 前記BeTeバッファ層上に引き続いて層を成長させてII−VI族半導体デバ イスの積重ね状のII−VI族半導体層を形成するステップと、を含むII−VI族 半導体デバイスの製造方法。 13.BeTeバッファ層を成長させるステップの間、前記基板温度を300 ℃より高く維持することを含む、請求項12記載のII−VI族半導体デバイス の製造方法。 14.BeTeバッファ層を成長させるステップが、BeTeバッファ層を約 1000A未満の厚さまで成長させることを含む、請求項12記載のII−VI 族半導体デバイスの製造方法。 15.前記GaAs基板がn型であり、BeTeバッファ層を成長させるステ ップが前記BeTeバッファ層をn型にドーピングすることを含む、請求項12 記載のII−VI族半導体デバイスの製造方法。 16.前記GaAs基板がp型であり、BeTeバッファ層を成長させるステ ップが前記BeTeバッファ層をp型にドーピングすることを含む、請求項12 記載のII−VI族半導体デバイスの製造方法。 17.BeTeバッファ層を約0.25mm/時の速度で成長させた、請求項 12記載のII−VI族半導体デバイスの製造方法。 18.前記BeTeバッファ層を成長させるステップの前に前 記GaAs基板をBeに予め暴露するステップを含む、請求項12記載のII−V I族半導体デバイスの製造方法。 19.Beに予め暴露するステップが最大ではぼ単分子層のBe層を成長させ ることを含む、請求項18記載のII−VI族半導体デバイスの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3799397P | 1997-02-13 | 1997-02-13 | |
US60/037,993 | 1997-02-13 | ||
PCT/US1998/002650 WO1998036460A1 (en) | 1997-02-13 | 1998-02-10 | II-VI SEMICONDUCTOR DEVICE WITH BeTe BUFFER LAYER |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001511950A true JP2001511950A (ja) | 2001-08-14 |
JP2001511950A5 JP2001511950A5 (ja) | 2005-10-06 |
JP4286910B2 JP4286910B2 (ja) | 2009-07-01 |
Family
ID=21897496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53587398A Expired - Fee Related JP4286910B2 (ja) | 1997-02-13 | 1998-02-10 | BeTeバッファ層を有する▲II▼−▲VI▼族半導体デバイス |
Country Status (9)
Country | Link |
---|---|
US (3) | US6090637A (ja) |
EP (1) | EP1008189B1 (ja) |
JP (1) | JP4286910B2 (ja) |
KR (1) | KR100601115B1 (ja) |
CN (1) | CN1247638A (ja) |
AU (1) | AU6157798A (ja) |
DE (1) | DE69838841T2 (ja) |
MY (1) | MY115897A (ja) |
WO (1) | WO1998036460A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008124210A (ja) * | 2006-11-10 | 2008-05-29 | Sony Corp | 半導体発光素子およびその製造方法、並びに光装置 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US7136408B2 (en) * | 2004-06-14 | 2006-11-14 | Coherent, Inc. | InGaN diode-laser pumped II-VI semiconductor lasers |
US7203036B2 (en) * | 2004-07-30 | 2007-04-10 | Hitachi Global Storage Technologies Netherlands B.V. | Planar extraordinary magnetoresistance sensor |
US7708222B2 (en) * | 2007-04-27 | 2010-05-04 | Stratocomm Corporation | Long mission tethered aerostat and method of accomplishing |
CN101878239B (zh) * | 2007-09-28 | 2014-06-18 | 陶氏环球技术有限责任公司 | 环氧树脂配制物 |
JP2012532454A (ja) * | 2009-06-30 | 2012-12-13 | スリーエム イノベイティブ プロパティズ カンパニー | カドミウム非含有の再発光半導体構成体 |
US9049758B2 (en) | 2012-10-17 | 2015-06-02 | Elwha Llc | Multiple-filament tungsten-halogen lighting system having managed tungsten redeposition |
US8723421B2 (en) | 2012-10-17 | 2014-05-13 | Elwha Llc | Multiple-filament incandescent lighting system managed in response to a sensor detected aspect of a filament |
US8970110B2 (en) | 2012-10-17 | 2015-03-03 | Elwha Llc | Managed multiple-filament incandescent lighting system |
CN104322334B (zh) | 2014-09-30 | 2016-09-14 | 晏有贵 | 一种暖云催化剂、制备方法及其应用 |
KR102356683B1 (ko) | 2015-10-01 | 2022-01-27 | 삼성전자주식회사 | 열전 구조체, 열전 소자 및 이의 제조방법 |
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US5248631A (en) * | 1990-08-24 | 1993-09-28 | Minnesota Mining And Manufacturing Company | Doping of iib-via semiconductors during molecular beam epitaxy using neutral free radicals |
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CN1119358A (zh) * | 1991-05-15 | 1996-03-27 | 明尼苏达州采矿制造公司 | 蓝-绿激光二极管 |
US5291507A (en) * | 1991-05-15 | 1994-03-01 | Minnesota Mining And Manufacturing Company | Blue-green laser diode |
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US5404027A (en) * | 1991-05-15 | 1995-04-04 | Minnesota Mining & Manufacturing Compay | Buried ridge II-VI laser diode |
US5274269A (en) * | 1991-05-15 | 1993-12-28 | Minnesota Mining And Manufacturing Company | Ohmic contact for p-type group II-IV compound semiconductors |
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AU4378893A (en) * | 1992-05-22 | 1993-12-30 | Minnesota Mining And Manufacturing Company | Ii-vi laser diodes with quantum wells grown by atomic layer epitaxy and migration enhanced epitaxy |
JPH06104533A (ja) | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | 青色発光素子およびその製造方法 |
US5363395A (en) * | 1992-12-28 | 1994-11-08 | North American Philips Corporation | Blue-green injection laser structure utilizing II-VI compounds |
US5306386A (en) * | 1993-04-06 | 1994-04-26 | Hughes Aircraft Company | Arsenic passivation for epitaxial deposition of ternary chalcogenide semiconductor films onto silicon substrates |
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JPH0870155A (ja) | 1994-08-29 | 1996-03-12 | Nippon Telegr & Teleph Corp <Ntt> | 半導体発光素子 |
JPH0897518A (ja) | 1994-09-28 | 1996-04-12 | Sony Corp | 半導体発光素子 |
JP2586349B2 (ja) * | 1994-11-17 | 1997-02-26 | 日本電気株式会社 | 半導体発光素子 |
JP3457468B2 (ja) * | 1995-09-12 | 2003-10-20 | 株式会社東芝 | 多層構造半導体装置 |
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-
1997
- 1997-12-15 US US08/990,644 patent/US6090637A/en not_active Expired - Lifetime
-
1998
- 1998-02-10 WO PCT/US1998/002650 patent/WO1998036460A1/en active IP Right Grant
- 1998-02-10 EP EP98906327A patent/EP1008189B1/en not_active Expired - Lifetime
- 1998-02-10 DE DE69838841T patent/DE69838841T2/de not_active Expired - Lifetime
- 1998-02-10 JP JP53587398A patent/JP4286910B2/ja not_active Expired - Fee Related
- 1998-02-10 AU AU61577/98A patent/AU6157798A/en not_active Abandoned
- 1998-02-10 KR KR1019997007323A patent/KR100601115B1/ko not_active IP Right Cessation
- 1998-02-10 CN CN98802564A patent/CN1247638A/zh active Pending
- 1998-02-13 MY MYPI98000603A patent/MY115897A/en unknown
-
2000
- 2000-10-16 US US09/688,594 patent/US6583450B1/en not_active Expired - Fee Related
-
2003
- 2003-04-07 US US10/408,407 patent/US6759690B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008124210A (ja) * | 2006-11-10 | 2008-05-29 | Sony Corp | 半導体発光素子およびその製造方法、並びに光装置 |
Also Published As
Publication number | Publication date |
---|---|
DE69838841D1 (de) | 2008-01-24 |
US20030205705A1 (en) | 2003-11-06 |
US6759690B2 (en) | 2004-07-06 |
WO1998036460A1 (en) | 1998-08-20 |
JP4286910B2 (ja) | 2009-07-01 |
MY115897A (en) | 2003-09-30 |
US6583450B1 (en) | 2003-06-24 |
AU6157798A (en) | 1998-09-08 |
EP1008189B1 (en) | 2007-12-12 |
US6090637A (en) | 2000-07-18 |
DE69838841T2 (de) | 2008-12-11 |
KR100601115B1 (ko) | 2006-07-19 |
EP1008189A1 (en) | 2000-06-14 |
CN1247638A (zh) | 2000-03-15 |
KR20000071054A (ko) | 2000-11-25 |
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