JP2001345293A5 - - Google Patents

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Publication number
JP2001345293A5
JP2001345293A5 JP2000162174A JP2000162174A JP2001345293A5 JP 2001345293 A5 JP2001345293 A5 JP 2001345293A5 JP 2000162174 A JP2000162174 A JP 2000162174A JP 2000162174 A JP2000162174 A JP 2000162174A JP 2001345293 A5 JP2001345293 A5 JP 2001345293A5
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JP
Japan
Prior art keywords
film
etching
mechanical polishing
chemical mechanical
substrate
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Pending
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JP2000162174A
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English (en)
Japanese (ja)
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JP2001345293A (ja
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Priority to JP2000162174A priority Critical patent/JP2001345293A/ja
Priority claimed from JP2000162174A external-priority patent/JP2001345293A/ja
Publication of JP2001345293A publication Critical patent/JP2001345293A/ja
Publication of JP2001345293A5 publication Critical patent/JP2001345293A5/ja
Pending legal-status Critical Current

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JP2000162174A 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置 Pending JP2001345293A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000162174A JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162174A JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

Publications (2)

Publication Number Publication Date
JP2001345293A JP2001345293A (ja) 2001-12-14
JP2001345293A5 true JP2001345293A5 (enExample) 2005-06-30

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ID=18666106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000162174A Pending JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

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JP (1) JP2001345293A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI275436B (en) 2002-01-31 2007-03-11 Ebara Corp Electrochemical machining device, and substrate processing apparatus and method
JP4698144B2 (ja) 2003-07-31 2011-06-08 富士通セミコンダクター株式会社 半導体装置の製造方法
KR20060100602A (ko) * 2005-03-17 2006-09-21 삼성전자주식회사 폴리실리콘 박막 트랜지스터의 제조 방법 및 그에 의해제조된 폴리실리콘 박막 트랜지스터를 포함하는 액정 표시장치
JP4967110B2 (ja) * 2008-04-24 2012-07-04 スパンション エルエルシー 半導体装置の製造方法
KR101211138B1 (ko) * 2011-03-07 2012-12-11 이화다이아몬드공업 주식회사 연약패드용 컨디셔너 및 그 제조방법

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