JP2001345293A5 - - Google Patents

Claims (4)

An etching step for etching away all or part of the film on the substrate on which the film is deposited;
And chemical mechanical polishing the substrate after the etching step;
Chemical mechanical polishing method. An etching mechanism for etching the film on the substrate on which the film is deposited;
A chemical mechanical polishing mechanism for chemical mechanical polishing the substrate;
A transport mechanism for transporting the substrate from the etching mechanism to the chemical mechanical polishing mechanism;
Chemical mechanical polishing equipment.   The chemical mechanical polishing apparatus according to claim 2, wherein the etching mechanism includes a substrate holding unit that holds and rotates the substrate, and a nozzle that supplies an etching solution that etches the film to the film. A semiconductor wafer having a film deposited thereon;
Removing part of the deposited film by an etching process;
A semiconductor wafer from which the film has been removed by chemical mechanical polishing of the semiconductor wafer after the etching step.