JP2001345293A - 化学機械研磨方法及び化学機械研磨装置 - Google Patents

化学機械研磨方法及び化学機械研磨装置

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Publication number
JP2001345293A
JP2001345293A JP2000162174A JP2000162174A JP2001345293A JP 2001345293 A JP2001345293 A JP 2001345293A JP 2000162174 A JP2000162174 A JP 2000162174A JP 2000162174 A JP2000162174 A JP 2000162174A JP 2001345293 A JP2001345293 A JP 2001345293A
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JP
Japan
Prior art keywords
etching
film
chemical mechanical
mechanical polishing
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000162174A
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English (en)
Japanese (ja)
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JP2001345293A5 (enExample
Inventor
Ichiro Katakabe
一郎 片伯部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2000162174A priority Critical patent/JP2001345293A/ja
Publication of JP2001345293A publication Critical patent/JP2001345293A/ja
Publication of JP2001345293A5 publication Critical patent/JP2001345293A5/ja
Pending legal-status Critical Current

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  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000162174A 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置 Pending JP2001345293A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000162174A JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000162174A JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

Publications (2)

Publication Number Publication Date
JP2001345293A true JP2001345293A (ja) 2001-12-14
JP2001345293A5 JP2001345293A5 (enExample) 2005-06-30

Family

ID=18666106

Family Applications (1)

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JP2000162174A Pending JP2001345293A (ja) 2000-05-31 2000-05-31 化学機械研磨方法及び化学機械研磨装置

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JP (1) JP2001345293A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064450A (ja) * 2003-07-31 2005-03-10 Fujitsu Ltd 半導体装置の製造方法
JP2006261681A (ja) * 2005-03-17 2006-09-28 Samsung Electronics Co Ltd ポリシリコン薄膜トランジスタ基板の製造方法及び液晶表示装置
US7569135B2 (en) 2002-01-31 2009-08-04 Ebara Corporation Electrolytic processing apparatus and substrate processing apparatus and method
JP2009266984A (ja) * 2008-04-24 2009-11-12 Spansion Llc 半導体装置の製造方法
JP2014507813A (ja) * 2011-03-07 2014-03-27 エーワ ダイヤモンド インダストリアル カンパニー，リミテッド 軟弱パッド用コンディショナーおよびその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7569135B2 (en) 2002-01-31 2009-08-04 Ebara Corporation Electrolytic processing apparatus and substrate processing apparatus and method
JP2005064450A (ja) * 2003-07-31 2005-03-10 Fujitsu Ltd 半導体装置の製造方法
US7951715B2 (en) 2003-07-31 2011-05-31 Fujitsu Semiconductor Limited Semiconductor device fabrication method
JP2006261681A (ja) * 2005-03-17 2006-09-28 Samsung Electronics Co Ltd ポリシリコン薄膜トランジスタ基板の製造方法及び液晶表示装置
JP2009266984A (ja) * 2008-04-24 2009-11-12 Spansion Llc 半導体装置の製造方法
JP2014507813A (ja) * 2011-03-07 2014-03-27 エーワ ダイヤモンド インダストリアル カンパニー，リミテッド 軟弱パッド用コンディショナーおよびその製造方法

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