JP2001323249A5 - - Google Patents

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Publication number
JP2001323249A5
JP2001323249A5 JP2000144270A JP2000144270A JP2001323249A5 JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5 JP 2000144270 A JP2000144270 A JP 2000144270A JP 2000144270 A JP2000144270 A JP 2000144270A JP 2001323249 A5 JP2001323249 A5 JP 2001323249A5
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JP
Japan
Prior art keywords
adhesive
circuit connection
heat
curing agent
connection according
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Application number
JP2000144270A
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English (en)
Japanese (ja)
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JP4433564B2 (ja
JP2001323249A (ja
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Priority to JP2000144270A priority Critical patent/JP4433564B2/ja
Priority claimed from JP2000144270A external-priority patent/JP4433564B2/ja
Publication of JP2001323249A publication Critical patent/JP2001323249A/ja
Publication of JP2001323249A5 publication Critical patent/JP2001323249A5/ja
Application granted granted Critical
Publication of JP4433564B2 publication Critical patent/JP4433564B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000144270A 2000-05-17 2000-05-17 回路接続用接着剤 Expired - Fee Related JP4433564B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000144270A JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005238698A Division JP2006028521A (ja) 2005-08-19 2005-08-19 回路接続用接着剤
JP2005331857A Division JP4626495B2 (ja) 2005-11-16 2005-11-16 回路接続用接着剤

Publications (3)

Publication Number Publication Date
JP2001323249A JP2001323249A (ja) 2001-11-22
JP2001323249A5 true JP2001323249A5 (https=) 2005-11-04
JP4433564B2 JP4433564B2 (ja) 2010-03-17

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ID=18650948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000144270A Expired - Fee Related JP4433564B2 (ja) 2000-05-17 2000-05-17 回路接続用接着剤

Country Status (1)

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JP (1) JP4433564B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7967943B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
JP2005194413A (ja) * 2004-01-08 2005-07-21 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
JP4970767B2 (ja) * 2005-10-26 2012-07-11 リンテック株式会社 導電接合シート用の絶縁シート、導電接合シート、導電接合シートの製造方法および電子複合部品の製造方法
JP4626495B2 (ja) * 2005-11-16 2011-02-09 日立化成工業株式会社 回路接続用接着剤
JP4650456B2 (ja) 2006-08-25 2011-03-16 日立化成工業株式会社 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
EP2146355A1 (en) * 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Conductor connection member, connection structure, and solar cell module
EP2146404A1 (en) 2007-05-09 2010-01-20 Hitachi Chemical Company, Ltd. Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module
KR101139749B1 (ko) * 2007-08-10 2012-04-26 아사히 가세이 이-매터리얼즈 가부시키가이샤 접착제 및 접합체
CN102559077A (zh) 2007-10-15 2012-07-11 日立化成工业株式会社 粘接膜作为电路连接材料的用途以及粘接膜用于电路连接材料的制造的用途
JP5779895B2 (ja) * 2011-02-08 2015-09-16 東レ株式会社 半導体用絶縁性接着剤
JP5868823B2 (ja) * 2012-10-01 2016-02-24 日立化成株式会社 異方導電フィルム
WO2018181589A1 (ja) * 2017-03-29 2018-10-04 日立化成株式会社 接着剤組成物及び構造体
JP7234032B2 (ja) * 2019-05-15 2023-03-07 デクセリアルズ株式会社 接着フィルムの製造方法、接着フィルム、及び接続体の製造方法

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