JP2006137954A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006137954A5 JP2006137954A5 JP2005331857A JP2005331857A JP2006137954A5 JP 2006137954 A5 JP2006137954 A5 JP 2006137954A5 JP 2005331857 A JP2005331857 A JP 2005331857A JP 2005331857 A JP2005331857 A JP 2005331857A JP 2006137954 A5 JP2006137954 A5 JP 2006137954A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- circuit connection
- particle size
- particles
- average particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims 15
- 230000001070 adhesive effect Effects 0.000 claims 13
- 239000002245 particle Substances 0.000 claims 13
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000000113 differential scanning calorimetry Methods 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- 230000020169 heat generation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005331857A JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005331857A JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000144270A Division JP4433564B2 (ja) | 2000-05-17 | 2000-05-17 | 回路接続用接着剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006137954A JP2006137954A (ja) | 2006-06-01 |
| JP2006137954A5 true JP2006137954A5 (https=) | 2009-06-25 |
| JP4626495B2 JP4626495B2 (ja) | 2011-02-09 |
Family
ID=36618960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005331857A Expired - Fee Related JP4626495B2 (ja) | 2005-11-16 | 2005-11-16 | 回路接続用接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4626495B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090129478A (ko) * | 2007-03-19 | 2009-12-16 | 나믹스 가부시끼가이샤 | 이방성 도전 페이스트 |
| KR101139749B1 (ko) * | 2007-08-10 | 2012-04-26 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 접착제 및 접합체 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1150032A (ja) * | 1997-08-04 | 1999-02-23 | Hitachi Chem Co Ltd | 回路用接続部材及び回路板 |
| JP3508558B2 (ja) * | 1998-07-22 | 2004-03-22 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
| JP4433564B2 (ja) * | 2000-05-17 | 2010-03-17 | 日立化成工業株式会社 | 回路接続用接着剤 |
-
2005
- 2005-11-16 JP JP2005331857A patent/JP4626495B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000345010A5 (https=) | ||
| JP2001323249A5 (https=) | ||
| JP6109179B2 (ja) | 高分子ptcサーミスタ | |
| CN106165559A (zh) | 电磁波屏蔽片及其制备方法 | |
| JP2013083960A5 (https=) | ||
| TW201144397A (en) | Adhesive composition and its use, connecting structure of circuit part and fabricating method thereof | |
| Yue et al. | Quickly self‐healing hydrogel at room temperature with high conductivity synthesized through simple free radical polymerization | |
| TW200643984A (en) | Conductive paste | |
| JP2009088465A5 (https=) | ||
| JP2013118180A5 (https=) | ||
| JP2016048691A5 (https=) | ||
| JP2006137954A5 (https=) | ||
| TWI456016B (zh) | 接著劑組成物、電路連接構造體、半導體裝置及太陽電池模組 | |
| JP2007224228A5 (https=) | ||
| JP2009276643A5 (https=) | ||
| TW201247863A (en) | Friction variable molded body and friction variable structure | |
| JPWO2014155898A1 (ja) | 断熱シートおよびその製造方法 | |
| CN107396618B (zh) | 一种绝缘性好的散热片 | |
| CN103289622A (zh) | 镀银碳纳米管环氧树脂导电胶的制备方法 | |
| Bai et al. | Flexible Composite Phase-Change Films with Multiscale Fibrous Networks toward High-Performance Thermal Management | |
| CN112538327B (zh) | 一种基于形状记忆效应的温控自粘性导电复合材料及其制备方法及应用 | |
| JP2012207127A5 (https=) | ||
| CN208382955U (zh) | 一种导热导电装置及终端设备 | |
| CN109096975A (zh) | 一种导电性热熔胶粘合剂 | |
| JPWO2023095671A5 (https=) |